AU2020102847A4 - Preparation Method of Drag-reducing Copper Surface - Google Patents
Preparation Method of Drag-reducing Copper Surface Download PDFInfo
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- AU2020102847A4 AU2020102847A4 AU2020102847A AU2020102847A AU2020102847A4 AU 2020102847 A4 AU2020102847 A4 AU 2020102847A4 AU 2020102847 A AU2020102847 A AU 2020102847A AU 2020102847 A AU2020102847 A AU 2020102847A AU 2020102847 A4 AU2020102847 A4 AU 2020102847A4
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
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Abstract
The invention provides a preparation method of drag-reducing copper surface, which
comprises the following steps: 1) pretreating pure copper or a copper-containing alloy to form
a substrate I; 2) plating copper on the substrate I, specifically, immersing the substrate in a
chemical plating solution for chemical deposition, and forming a substrate II after the reaction
is finished; 3) plating nickel on the substrate II, specifically, immersing the prepared substrate
II as a cathode and a pure nickel plate as an anode in an electroplating solution for
electrochemical deposition, and forming a substrate III after the reaction is finished; and 4)
modifying, namely immersing the substrate III in an organic molecular solution with low
surface energy to obtain the drag-reducing copper. The copper prepared by the preparation
method has a lotus leaf-like super-hydrophobic surface, is small in friction resistance, and is
convenient to produce and prepare.
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F1
Figure 4
Description
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F1
Figure 4
Preparation Method of Drag-reducing Copper Surface
[0001] The invention relates to the technical field of metal material treatment, in particular to a preparation method of drag-reducing copper surface.
[0002] As an important engineering metal material, brass is characterized by good mechanical properties, thermoplasticity, machinability, easy welding, good electrical conductivity and thermal conductivity, low price and so on, and is often used for manufacturing parts such as condensers, water pipes, connection pipes of internal and external machines of air conditioners, radiators, pins, conduits and so on. But the surface energy of copper is relatively high, the copper is easy to adsorb moisture in the air to cause corrosion cracking, and the service performance and the service life of the product are influenced.
[0003] In the 1980s, botanists Barthlott and Neihuis of the University of Bonn, Germany, observed the surface structure of lotus leaves and found that there were micron-scale protrusions and waxy structures on the surface of the lotus leaves, which made the lotus leaves super-hydrophobic (i. e., water drops fall on the surface of the leaves will automatically gather into water drops and roll down). The research shows that the super-hydrophobic surface has a plurality of advantages, and if the super hydrophobic surface is applied on a metal material, the effects of self-cleaning, corrosion resistance, slip resistance reduction, friction reduction, light absorption rate enhancement and the like can be achieved. For example, the super-hydrophobic surface is used in petroleum transportation pipelines, so that the pipeline wall can be prevented from being sticky to reduce the loss and energy consumption in the transportation process; the super-hydrophobic surface is used in optical instruments, sensors, solar energy conversion devices and other components, so that the reflection of light can be effectively reduced, and the incident light can be absorbed to the maximum extent; the super-hydrophobic material is used in industries such as shipping and the like, for example, a layer of super-hydrophobic film is coated on a ship body, so that the friction with water in the traveling process of the ship can be greatly reduced, and the fuel oil can be saved; and the super-hydrophobic material is used on the structure surfaces of biological medical tissues such as artificial blood vessels, vascular stents, artificial heart valves, etc., so that the biological blood compatibility can be improved, and the probability of thrombosis can be reduced.
[0004] The form of the hydrophobic surface will affect the condensation and absorption state of the surface moisture, so that the gas can be introduced into the liquid lubricating membrane system; and the existence of the gas can play a role in drag reduction. The most typical example of air bed drag reduction is the cavitation ship, which separates the hull from the water by forming the air film layer through the bottom molding, thereby reducing the viscous resistance, such as the cavitation drag reduction mechanism formed by the Swedish Maritime Institute constructing the sealed bin through the elastic tape; and the Korean JinhoJ. studied the relationship between cavitation area and drag reduction rate by ship model 361]; GokcayS. et al. of the Turkey University of Science and Technology produced a ship model with a step fault structure, so that the drag reduction performancel 3 ] was achieved through cavitation effect. It can be seen from these studies that gas lubrication is also used in industry, such as gas lubrication bearing, because of its small friction resistance and stable performance. With the help of this idea, it is a new lubrication idea to design the sliding surface of the parts reasonably to make it generate gas layer to realize the function of drag reduction.
[0005] The construction method of the hydrophobic surface is different from the common texture preparation method, for the processing and preparation of the common texture, a Vibrorolling technology, a reactive ion etching (RIE) technology, a press etching technology, a surface shot blasting treatment, a UV-LIGA technology, a numerical control mechanical processing technology, a laser surface texture processing (LST) technology and the like are mainly adopted, and most of the processing surfaces can only be a combination of a regular two-dimensional circle, a square, a rhombus and the like. In addition, the production methods have certain advantages, but also have some problems, such as the adoption of a femtosecond laser as a laser marking machine to increase the processing cost, and some of the production methods have harsh requirements on the working environment (need to be processed in a vacuum environment), and are not suitable for industrial production. Therefore, how to prepare a stable super-hydrophobic microstructure surface by using a simple and easy method is particularly important for meeting the application of the surface in the industrial field.
[0006] In view of the disadvantages of the prior art described above, the invention aims to provide a preparation method of a lotus leaf-like micro-nano multi stage structure drag-reducing copper surface, which is used for solving the problem that the drag-reducing copper surface is difficult to produce in the prior art.
[0007] In order to achieve the above objects and other related objects, the invention provides a preparation method of drag-reducing copper surface, comprising the following steps:
[0008] 1) pre-treating pure copper or a copper-containing alloy to form a substrate I, wherein the copper content in the pure copper is 99.9%, and the copper content in the copper-containing alloy is more than 80%;
[0009] 2) plating copper on a substrate, specifically comprising the following steps: immersing the substrate in chemical plating solution containing copper elements for chemical deposition, and forming a substrate II with a micron-scale mastoid structure on the surface after the reaction is finished;
[0010] 3) plating nickel on a substrate II, specifically, the prepared substrate II is used as a cathode, a pure nickel plate is used as an anode, the substrate II is immersed in electroplating solution for electrochemical deposition, and after the reaction is finished, a substrate III with a nano fluff crystal structure is formed;
[0011] 4) modifying, namely immersing the substrate III in organic molecular liquid with low surface energy to obtain the drag-reducing copper with the lotus leaf like super-hydrophobic surface.
[0012] Preferably, the electroless plating solution is a mixed aqueous solution containing 0.04 mol/L of copper sulfate, 0.008 mol/L of nickel sulfate, 0.08 mol/L of sodium hypophosphite, 0.28 mol/L of sodium citrate, 0.5 mol/L of boric acid, and 50 ppm of polyethylene glycol.
[0013] Preferably, the plating solution is a mixed aqueous solution containing 1 mol/L of nickel chloride, 0.5 mol/L of boric acid and 1.5 mol/L of boric acid.
[0014] Preferably, the pretreatment in the step 1) comprises the following steps: grinding the pure copper or the copper-containing alloy by using a gold phase grinding and polishing machine, carrying out ultrasonic cleaning in acetone, carrying out alkaline washing and acid washing, and carrying out cold air drying.
[0015] Preferably, the alkali solution used for the alkali washing is a mixed solution of 45-50g/L Na3PO4-12H20, 50-55g/L NaOH and 3-8g/L Na2SiO3, and the alkali washing is carried out for one minute at room temperature.
[0016] Preferably, the acid solution used for acid washing is in particular an H2SO4 solution with a concentration of 10%, and the acid washing is carried out for s at room temperature.
[0017] Preferably, the low surface energy organic molecular solution is a fluorine-containing silane solution.
[0018] As described above, the preparation method of drag-reducing copper surface with the lotus leaf-like micro-nano multi-level structure has the following beneficial effects: by chemically plating copper and electrochemical nickel on the substrate containing the copper alloy or the pure copper, the nano-scale fluff crystal structure is formed on the surface of the substrate, so that the copper alloy or the pure copper (herein referred to as metal copper) is formed into the super-hydrophobic surface with the lotus leaf-like micro-nano multi-level structure, the super hydrophobic surface is the lotus leaf-like micro-nano multi-level surface, the gas layer is introduced to the solid-liquid lubrication interface through the hydrophobic contact form change, namely, the gas layer is formed between the liquid lubricant and the surface of the metal copper, and the mastoid fluff crystal structure thereof helps to stabilize the existence of the gas layer, and the existence of the gas layer successfully reduces the solid-liquid contact ratio, thereby greatly reducing the frictional resistance in the movement process of the contact between the liquid and the surface of the part manufactured by the metal copper, and further improving the applicable service life of the part.
[0019] Figure 1 is a schematic structural surface view of a plant lotus leaf.
[0020] Figure 2 shows a lotus leaf-like surface view of the substrate III of the invention.
[0021] Figure 3 shows a partial high magnification view of Figure 2.
[0022] Figure 4 is a schematic structural view of a lotus leaf-like surface formed in accordance with the invention.
[0023] Figure 5 shows a schematic view of a metal copper surface produced by the preparation method of the invention in contact with a liquid.
[0024] Figure 6 is a schematic diagram showing a hydrophobic model of a metal copper surface produced by the preparation method of the invention.
[0025] Figure 7 is a schematic view showing the contact angle between the metal copper surface and water produced by the preparation method of the invention.
[0026] Figure 8 shows the friction coefficient versus time for different surfaces.
[00027] Description of Elements
[0028]1 Copper surface
[0029] 2 Micron-scale mastoid
[0030] 3 Nano-scale fluff crystal
[0031] 4 Gas layer
[0032] 5 Liquid drop
[0033] Further advantages and effects of the invention will become apparent to those skilled in the art from the following description of specific embodiments thereof.
[0034] Please refer to from Figure 1 to Figure 7. It is to be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings of the present specification are only for purposes of understanding and reading by those skilled in the art, and are not intended to limit the conditions under which the invention may be practiced, and any modifications in structure, changes in proportional relationship, or adjustments in size are within the scope of the invention without departing from the spirit and scope of the invention as disclosed herein. Meanwhile, terms such as "upper", "lower", "left", "right", "middle" and "a", etc. cited in this specification are also intended to be illustrative only, and are not intended to limit the scope of the invention as may be practiced, and changes or modifications in the relative relationships thereof shall also be considered within the scope of the invention without materially departing from the scope of the invention as may be practiced.
[0035] The invention provides a preparation method of drag-reducing copper surface, which comprises the following steps:
[0036] 1) pre-treating pure copper or an copper-containing alloy to form a substrate I, wherein the copper content in the pure copper is more than 99.9%, and the copper content in the copper-containing alloy is more than 80%;
[0037] 2) plating copper on the substrate I, specifically comprising the following steps: immersing the substrate I in chemical plating solution containing copper elements for chemical deposition, and forming a substrate II after the reaction is finished;
[0038] 3) plating nickel on a substrate II, specifically, the prepared substrate II is used as a cathode, a pure nickel plate is used as an anode, the prepared substrate II is immersed in electroplating solution for electrochemical deposition, and after the reaction is finished, a nano-scale fluff crystal structure is formed on the surface of the micron-scale mastoid, namely a substrate III is formed;
[0039] 4) modifying: the substrate III is immersed in organic molecular liquid with low surface energy for surface modification to obtain the drag-reducing copper.
[0040] According to the invention, a nano-scale fluff crystal structure is formed on the surface of a substrate containing copper alloy or pure copper by electroless copper plating and electrochemical nickel plating, so that a super-hydrophobic surface of a lotus leaf-like structure is formed from copper alloy or pure copper (herein referred to as metal copper), for example, as shown in Figure 2 and Figure 3, the super-hydrophobic surface is in the form of a lotus leaf-like micro-nano multi-scale hierarchical surface, for example, as shown in Figure 4, the surface is in the form of a micro-scale mastoid 2, and a nano-scale fluff crystal 3 is formed on the micron-scale mastoid 2.
[0041] The invention introduces the gas layer into the solid-liquid lubrication interface through the change of the hydrophobic contact form, namely, the gas layer is formed between the liquid lubricant and the surface of the metal copper, and the mastoid fluff crystal structure thereof helps to stabilize the existence of the gas layer, and the existence of the gas layer successfully reduces the solid-liquid contact ratio, thereby greatly reducing the frictional resistance in the movement process of the contact between the liquid and the surface of the part manufactured by the metal copper, and further improving the applicable service life of the part.
[0042] The chemical plating solution containing copper elements in this embodiment may be a mixed aqueous solution containing 0.03 to 0.04 mol/L of copper sulfate, 0.007 to 0.009 mol/L of nickel sulfate, 0.06 to 0.07 mol/L of sodium hypophosphite, 0.25 to 0.29 mol/L of sodium citrate, 0.4 to 0.6 mol/L of boric acid, and 50 ppm of polyethylene glycol. By controlling the reaction time of the step 2) and the related reaction environment, the structure form of the micron-sized mastoid 2 can be controlled, so that the tip of the micron-sized mastoid 2 can be pointed or round, the specific distribution of the micron-scale mastoid 2 can be controlled, which can be dense or evacuated.
The pH value of the electroless plating solution used for the chemical deposition in the embodiment is 7-9, the chemical deposition time is 10-30 minutes, and the reaction temperature of the chemical deposition is 60-80 DEG C.
[0043] In order to carry out alkali washing and acid washing, the alkali solution used for the alkali washing in the embodiment is a mixed aqueous solution of 45- g/L Na3PO4-12H20, 50-55g/L NaOH and 3-8g/L Na2SiO3, and the alkali washing is carried out for one minute at room temperature. The acid solution used for acid washing in this embodiment is specifically an aqueous solution of 10% H2SO4, and the acid washing is carried out at room temperature for 10s, and activating by 0.001 mol/L palladium chloride solution for 1 minute.
[0044] The low surface energy organic molecular solution in this embodiment is a fluorine-containing silane solution, and the fluorine-containing silane solution in this embodiment is perfluorooctyl triethoxy silane, which is diluted by an ethanol solvent to a mass ratio of 0.5 to 2%. The alkali solution, the acid solution and the organic molecular solution used in the invention are not limited to the alkali solution, the acid solution and the organic molecular solution, and the alkali solution, the acid solution and the organic molecular solution only need to perform acid-base washing treatment on the surfaces of the pure copper and the copper-containing alloy to remove substances such as oil and fat on the surfaces of the pure copper and the copper-containing alloy, and the organic molecular solution only need to finish final surface modification.
[0045] plating copper on a substrate as described in step 2) above, which can form a micron-sized mastoid 2 similar to Figure 4 by preparing a copper surface having a micron-sized mastoid structure by chemical deposition, and plating nickel on a substrate 2 as described in step 3) above, which can form a lotus leaf-like structure obtained by preparing a nano-scale fluff crystal structure on the micron-scale mastoid 2 by electrochemical deposition, which can form a nano-scale fluff crystal 3 similar to Figure 4.
[0046] Embodiment 1
[0047] 1) carrying out metallographic polishing on pure copper or copper containing alloy by using 200 meshes to 2000 meshes silicon carbide sand paper, and carrying out ultrasonic cleaning in acetone;
[0048] 2) carrying out alkali washing with a mixture of 50 g/L Na3PO4-12H20, g/L NaOH and 5 g/L Na2SiO3 at room temperature for one minute to remove the oxide content of pure copper or copper-containing alloys, such as grease.
[0049] 3) carrying out acid washing with 10% H2SO4 solution for 10s, and drying with cold air to obtain the first substrate, wherein the first substrate is a substrate copper sheet, and the size of thefirst substrate is 25mm*25mm*0.3mm;
[0050] 4) activating with 0.001 mol/L palladium chloride solution for 1 min;
[0051] 5) plating copper on the substrate copper sheet, comprising the following steps: immersing the substrate I in a chemical plating solution containing copper elements for chemical deposition, and forming a substrate II with a micron-scale mastoid structure on the surface after the reaction isfinished, wherein the chemical plating solution containing the copper elements is a mixed aqueous solution containing 0.04 mol/L of copper sulfate, 0.008 mol/L of nickel sulfate, 0.08 mol/L of sodium hypophosphite, 0.28 mol/L of sodium citrate, 0.5 mol/L of boric acid and 50 ppm of polyethylene glycol; and the pH value of the chemical plating solution in the embodiment is 7-9, the deposition time of the chemical deposition is 10-30 minutes, and the reaction temperature is 60-80 DEG C.
[0052] 6) plating nickel on the substrate II, specifically, the prepared substrate II is used as a cathode, a pure nickel plate(99.99wt.%) is used as an anode, immersing
the prepared substrate II and the pure nickel plate in the second electroplating solution for electrochemical deposition, the second electroplating solution containing 1 mol/L of nickel chloride, 0.5 mol/L of boric cm and 1.5 mol/L of ethylenediamine hydrochloride, and the reaction is finished, a nano-scale fluff crystal structure is formed on the surface of the micron-scale mastoid, namely a substrate III with the nano-scale fluff crystal structure is formed, for example, as shown in Figure 2 and Figure 3, the structure of the substrate III is a typical lotus leaf-like hierarchical surface; in this embodiment, the pH value of the second electroplating solution is 4, the temperature of the electroplating solution is 60 DEG C, the electrochemical deposition time is 5min, and the current density is 0.02A/cm2
[0053] 6) modifying, namely immersing the substrate III in a fluorine-containing silane solution for surface modification, wherein in the embodiment, the fluorine containing silane solution is perfluorooctyltriethoxysilane, the fluorine-containing silane solution is diluted by an ethanol solvent until the concentration is 0.5-2% by mass, and the fluorine-containing silane solution is solidified for 24 hours at room temperature to obtain the lotus leaf-like drag-reducing lubricating surface, so that the drag-reducing copper surface with the lotus leaf-like micro-nano multi-level structure is obtained.
[0054] Figure 1 is a schematic structural surface diagram of a plant lotus leaf, and Figure 2 is a copper surface formed by the above preparation method. As can be seen from a comparison between Figure 1 and Figure 2, the copper surface morphology produced by the above preparation method of the present embodiment is highly similar to the structural surface morphology of a plant lotus leaf. Specifically, the drag-reducing copper surface produced by the method of the first embodiment described above is a composite multi-scale structured surface of a micron-scale mastoid 2 having a diameter of 1-1.5 m and a height of 1.5 m, as shown in Figure 4, and a nano-scale fluff crystal 3 having a diameter of 100-400 nm and a height of 100 400 nm. The preparation process is simple, the production cost is low, and the structure form and distribution of the formed micron-scale mastoid are controllable.
[0055] The drag-reducing property of the drag-reducing copper surface produced by the above preparation method will be described in detail below. The metal copper surface produced in this embodiment is a lotus leaf-like micro-nano multi-scale hierarchical surface. By changing the hydrophobic contact morphology, as shown in Figure 5, the gas layer 4 is introduced between the copper surface 1 and the liquid lubricant interface (i. e., the liquid drop 5), and the mastoid fluff crystal structure structure thereof helps to stabilize the existence of the gas layer. The existence of the gas layer 4 successfully reduces the solid-liquid contact ratio, as shown in Figure 6, the liquid drop 6(which can be a water drop) is substantially circular, that is, the contact angle between the copper surface 1 and the liquid drop is 161.32 degrees as shown in Figure 7. The method for obtaining the contact angle between the copper surface 1 and the liquid drop according to the embodiment is as follows: the contact angle between the liquid drop with the volume of 5 L and the liquid drop at five different positions of the sample is measured by an optical contact angle tester (JGW 360B) at room temperature, and the average value is taken as the final contact angle value, so that the contact area between the liquid and solid is reduced, and the contact area between the gas layer 4 and the copper surface 1 is increased, so that the friction resistance is greatly reduced in the process of the contact movement of the engineering surface of the mechanical part produced by the copper with the copper surface, and the applicable service life of the mechanical part is prolonged.
[0056] As shown in Figure 8, the relationship curve between the friction coefficient of different surfaces and the time is shown, each curve in the embodiment is subjected to a lubricating performance experiment through a Brooke UMT3 multifunctional tribological testing machine, and stainless steel is selected as an upper sample to be subjected to counter-grinding on the surfaces of smooth copper, micron single-stage copper and lotus leaf-like micro-nano multi-stage copper which is obtained in the embodiment, and the friction surface is mounted in the tray of the water vessel. The clearance between the friction pair surfaces is set to 50tm by a displacement sensor having an accuracy of 1 nm. The test is carried out at room temperature and under a humidity environment of 70%, and recording one data for 20 min every 0.5 s under the condition that the rotating speed is 10 rpm. In the figure, SI is an untreated smooth copper surface friction coefficient curve, S2 is a copper surface friction coefficient curve with micron monopoles, and S3 is a copper surface friction coefficient curve produced by the preparation method of the lotus leaf-like micro nano multi-stage structure drag-reducing copper surface. Therefore, the friction coefficient of the copper surface with the surface hydrophobic structure is far lower than that of the smooth copper surface, namely, the friction coefficient of the copper surface with the micron monopoles represented by the S2 curve is lower than that of the copper surface with the S Icurve; and the friction coefficient of the copper surface with the lotus leaf-like micro-nano multi-stage structure is the lowest, namely, the S3 curve, so that the copper surface with the lotus leaf-like micro-nano multi-stage structure can form a stable gas layer in the running process, the resistance in the friction process is reduced to the greatest extent, and the purpose of prolonging the service life of mechanical parts is achieved.
[0057] In conclusion, the preparation method of the lotus leaf-like micro-nano multi-stage structure drag-reducing copper surface comprises the following steps: chemically plating copper and electrochemically plating nickel on a substrate I containing copper alloy or pure copper to form a nano-scale fluff crystal structure on the substrate containing copper alloy or pure copper; and forming a super hydrophobic surface of the lotus leaf-like structure by the substrate containing copper alloy or pure copper (herein referred to as metal copper). Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
[0058] The above-described embodiments are merely illustrative of the principles and efficacy of the invention, and are not intended to limit the invention. Any person skilled in the art may modify or change the embodiments described above without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical concept disclosed herein be covered by the appended claims of the invention.
Claims (7)
1. A preparation method of drag-reducing copper surface is characterized by comprising the following steps:
1) pretreating pure copper or a copper-containing alloy to form a substrate I, wherein the copper content in the pure copper is more than 99.9 %, and the copper content in the copper-containing alloy is more than 80 %;
2) plating copper on the substrate I, specifically comprising the following steps: immersing the substrate I in chemical plating solution containing copper elements for chemical deposition, and forming a substrate 2 after the reaction is finished;
3) plating nickel on the substrate II, specifically, immersing the prepared substrate II as a cathode and a pure nickel plate as an anode in an electroplating solution for electrochemical deposition, and forming a substrate III after the reaction is finished;
4) modifying, namely immersing the substrate III in organic molecular liquid with low surface energy to obtain the drag-reducing copper.
2. The preparation method of the lotus leaf-like micro-nano multi-stage structure drag-reducing copper surface according to claim 1, is characterized in that the chemical plating solution is a mixed aqueous solution containing 0.03-0.04 mol/L of copper sulfate, 0.007-0.009 mol/L of nickel sulfate, 0.06-0.07 mol/L of sodium hypophosphite, 0.25-0.29 mol/L of sodium citrate, 0.4-0.6 mol/L of boric acid and 50 ppm of polyethylene glycol.
3. The preparation method of the lotus leaf-like micro-nano multi-stage structure drag-reducing copper surface according to claim 1, is characterized in that the plating solution is a mixed aqueous solution containing 1 mol/L of nickel chloride, 0.5 mol/L of boric acid and 1.5 mol/L of ethylenediamine hydrochloride.
4. The preparation method of the anti-drag copper surface with the lotus leaf-like micro-nano multi-level structure according to claim 1, is characterized in that the pretreatment in the step 1) comprises the following steps: polishing the pure copper or the copper-containing alloy by using a gold phase grinding and polishing machine, carrying out ultrasonic cleaning in acetone, carrying out alkaline washing and acid washing, and carrying out cold air drying.
5. The preparation method of the lotus leaf-like micro-nano multi-stage structure drag-reducing copper surface according to claim 4, is characterized in that the alkali solution used for the alkali washing is an aqueous solution of 45-50g/L Na3PO4-12H20, 50-55g/L NaOH and 3-8g/L Na2SiO3, and the alkali washing is carried out for one minute at room temperature.
6. The preparation method of the lotus leaf-like micro-nano multi-stage structure drag-reducing copper surface according to claim 4, is characterized in that the acid solution used for acid washing is an H2SO4 aqueous solution with a concentration of %, and the acid washing is carried out for 1Os at room temperature.
7. The preparation method of the lotus leaf-like micro-nano multi-stage structure drag-reducing copper surface according to claim 1, is characterized in that the organic molecular solution with low surface energy is fluorine-containing silane solution.
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| CN113060701A (en) * | 2021-04-30 | 2021-07-02 | 苏州华易航动力科技有限公司 | Preparation method of evaporative cooling microstructure |
| CN113090485A (en) * | 2021-04-02 | 2021-07-09 | 燕山大学 | Hydraulic axial plunger pump sliding shoe pair with lotus leaf texture surface |
| CN114790563A (en) * | 2022-04-29 | 2022-07-26 | 河北工业大学 | Corrosion-resistant super-hydrophobic copper-nickel composite coating and preparation method and application thereof |
-
2020
- 2020-10-19 AU AU2020102847A patent/AU2020102847A4/en not_active Ceased
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113090485A (en) * | 2021-04-02 | 2021-07-09 | 燕山大学 | Hydraulic axial plunger pump sliding shoe pair with lotus leaf texture surface |
| CN113060701A (en) * | 2021-04-30 | 2021-07-02 | 苏州华易航动力科技有限公司 | Preparation method of evaporative cooling microstructure |
| CN114790563A (en) * | 2022-04-29 | 2022-07-26 | 河北工业大学 | Corrosion-resistant super-hydrophobic copper-nickel composite coating and preparation method and application thereof |
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