AU2020100474A4 - Photosensitive adhesive - Google Patents
Photosensitive adhesive Download PDFInfo
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- AU2020100474A4 AU2020100474A4 AU2020100474A AU2020100474A AU2020100474A4 AU 2020100474 A4 AU2020100474 A4 AU 2020100474A4 AU 2020100474 A AU2020100474 A AU 2020100474A AU 2020100474 A AU2020100474 A AU 2020100474A AU 2020100474 A4 AU2020100474 A4 AU 2020100474A4
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 61
- 239000000853 adhesive Substances 0.000 title claims abstract description 59
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 22
- -1 polysiloxane Polymers 0.000 claims abstract description 20
- 239000003999 initiator Substances 0.000 claims abstract description 12
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 10
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 10
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000003054 catalyst Substances 0.000 claims abstract description 9
- 239000003112 inhibitor Substances 0.000 claims abstract description 9
- 239000012948 isocyanate Substances 0.000 claims abstract description 9
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 9
- 150000002009 diols Chemical class 0.000 claims abstract description 8
- 229920000515 polycarbonate Polymers 0.000 claims abstract description 8
- 239000004417 polycarbonate Substances 0.000 claims abstract description 8
- 150000001875 compounds Chemical class 0.000 claims description 19
- 239000012860 organic pigment Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 claims description 6
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 claims description 6
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 claims description 6
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 claims description 6
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 claims description 3
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 claims description 3
- 229940044119 2-tert-butylhydroquinone Drugs 0.000 claims description 3
- PHQSYHHLVVDIFC-UHFFFAOYSA-N CC1=C(C=P(C2=CC=CC=C2)C2=CC=CC=C2)C(=CC(=C1)C)C Chemical compound CC1=C(C=P(C2=CC=CC=C2)C2=CC=CC=C2)C(=CC(=C1)C)C PHQSYHHLVVDIFC-UHFFFAOYSA-N 0.000 claims description 3
- 230000002378 acidificating effect Effects 0.000 claims description 3
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 claims description 3
- OSXYHAQZDCICNX-UHFFFAOYSA-N dichloro(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](Cl)(Cl)C1=CC=CC=C1 OSXYHAQZDCICNX-UHFFFAOYSA-N 0.000 claims description 3
- GNEPOXWQWFSSOU-UHFFFAOYSA-N dichloro-methyl-phenylsilane Chemical compound C[Si](Cl)(Cl)C1=CC=CC=C1 GNEPOXWQWFSSOU-UHFFFAOYSA-N 0.000 claims description 3
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 claims description 3
- VFNGKCDDZUSWLR-UHFFFAOYSA-L disulfate(2-) Chemical compound [O-]S(=O)(=O)OS([O-])(=O)=O VFNGKCDDZUSWLR-UHFFFAOYSA-L 0.000 claims description 3
- 239000005055 methyl trichlorosilane Substances 0.000 claims description 3
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 claims description 3
- 239000005054 phenyltrichlorosilane Substances 0.000 claims description 3
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 description 7
- 238000000016 photochemical curing Methods 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 238000001723 curing Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 235000011837 pasties Nutrition 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- KXBFLNPZHXDQLV-UHFFFAOYSA-N [cyclohexyl(diisocyanato)methyl]cyclohexane Chemical compound C1CCCCC1C(N=C=O)(N=C=O)C1CCCCC1 KXBFLNPZHXDQLV-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000009533 lab test Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- VLCAYQIMSMPEBW-UHFFFAOYSA-N methyl 3-hydroxy-2-methylidenebutanoate Chemical compound COC(=O)C(=C)C(C)O VLCAYQIMSMPEBW-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/006—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/12—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
- C08F283/122—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes on to saturated polysiloxanes containing hydrolysable groups, e.g. alkoxy-, thio-, hydroxy-
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/28—Treatment by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
The present invention provides a photosensitive adhesive comprising a composition of 0.1 portion to 1 portion by weight of photo initiator; 0.1 portion to 3 portions by weight of organic silicone; 10 portions to 32.5 portions by weight of isocyanate; 10 portions to 32.5 portions by weight of hydroxyethyl terminated polysiloxane; 10 portions to 32.5 portions by weight of polycarbonate diol; 5 portions to 17.5 portions by weight of hydroxyethyl acrylate; 0.01 portion to 0.5 portion by weight of catalyst; and 0.01 portion to 0.5 portion by weight of polymerization inhibitor.
Description
TECHNICAL FIELD
The present invention relates broadly to adhesives. More specifically, the present 5 invention relates to a photosensitive adhesive.
BACKGROUND OF THE INVENTION
Photosensitive adhesive (also known as UV adhesive) is a type of adhesive that generally realizes adhesion under the ultraviolet light source, and it is also called photocuring adhesive.
It usually comprises principal components such as base resin, reactive monomer and photo initiator, as well as assistants such as stabilizer, cross-linking agent and coupling agent. Under the irradiation of UV light with the appropriate wavelength, the photo initiator quickly generates free agents or ions, and then triggers the polymerization and cross-linking of the base resin and the reactive monomer to form a network structure, thereby achieving the rapid bonding of bonding materials. Existing UV adhesives are all liquid, which makes it easily contaminate unnecessary surfaces (especially for small objects) during the use, such as the user's fingers, causing waste, etc.; Besides, existing UV adhesives do not adhere well to surfaces that require curing adhesion before curing. If there is relative movement between the two surfaces that need to be cured and bonded in the curing process, the overall surface tends 20 to be smeared with UV adhesives, causing inconvenience and waste. UV adhesives cure fast, so the position, thickness, and shape of adhesives cannot be changed once it drops on the object surface, which has a direct negative impact on the bonding effect between the two surfaces.
SUMMARY OF THE INVENTION
2020100474 27 Mar 2020
The problem to be solved in the present invention is to provide a photosensitive adhesive that is convenient to use and featured with high adhesive properties, high air tightness and high weatherability.
The present invention provides a photosensitive adhesive comprising a composition of
0.1 portion to 1 portion by weight of photo initiator; 0.1 portion to 3 portions by weight of organic silicone; 10 portions to 32.5 portions by weight of isocyanate; 10 portions to 32.5 portions by weight of hydroxyethyl terminated polysiloxane; 10 portions to 32.5 portions by weight of polycarbonate diol; 5 portions to 17.5 portions by weight of hydroxyethyl acrylate;
0.01 portion to 0.5 portion by weight of catalyst; and 0.01 portion to 0.5 portion by weight of polymerization inhibitor.
Typically, the photo initiator is any one or two compounds selected from (2, 4, 6trimethylbenzylidene) diphenylphosphine oxide, bis (1- (2, 4- difluorophenyl) - 3pyrrolidinyl) dicenelocene or 1- hydroxycyclohexyl phenyl ketone.
Typically, the organic silicone comprises at least two compounds selected from methyltrichlorosilane, dimethyldichlorosilane, phenyltrichlorosilane, diphenyldichlorosilane or methylphenyldichlorosilane.
Typically, the catalyst comprises at least one compound selected from acidic resin, toluenesulfonic acid, monosulfate, disulfate or p-toluenesulfonic acid.
Typically, the polymerization inhibitor comprises at least one compound selected from methylhydroquinone, P-hydroxyanisole, 2-tert-butylhydroquinone or quinol.
Typically, the photosensitive adhesive further comprises 0.1 portion to 3 portions by weight of an organic pigment.
Typically, the method for making the photosensitive adhesive, comprising the steps of:
(a) adding isocyanate, hydroxyethyl terminated polysiloxane, polycarbonate diol and
2020100474 27 Mar 2020 hydroxyethyl acrylate into a container according to pre-determined portions by weight, and then adding photo initiator into the container;
(b) heating up the container at a preset temperature in a first preset time period;
stirring the mixture of compounds inside the container in a second preset time period;
(c) adding organic silicone, catalyst and polymerization inhibitor into the container according to pre-determined portions by weight, and then stirring the mixture of compounds inside the container in a third preset time period; and (d) cooling.
Typically, the preset temperature is between 60 ° C and 100° C, the first preset time 0 period is between 1 hour and 2 hours.
Typically, the second preset time period is between 1/4 hour and 3/4 hour.
Typically, the third preset time period is between 1/3 hour and 2/3 hour.
Typically, the method further comprises the steps of:- (a) stirring the mixture of compounds inside the container in the third preset time 5 period;
(b) adding the organic pigment to the container according to a pre-determined portions by weight before standing for cooling; and (c) stirring the mixture of compounds inside the container in a fourth preset time period.
Typically, the fourth preset time period is between 1/20 hour and 1/10 hour.
The photosensitive adhesive provided by the present invention is a paste not sticky to hands. It solves the problem that the traditional liquid UV adhesive is sticky to hands, thus bringing convenience and improving efficiency. The introduction of silicon-modified photo-curing monomers improves the refractive index of the adhesive layer, and the 25 introduction of an appropriate proportion of base resin improves the toughness of the adhesive
2020100474 27 Mar 2020 layer, and offsets the brittleness brought about by the introduction of silicon-modified photo-curing monomer with a high refractive index. So the adhesive layer has both a high refractive index and a good toughness. This is different from traditional UV adhesives. For traditional UV adhesives the increase of the refractive index will harden the adhesive layer, 5 resulting in pulverization during use. Moreover, the photosensitive adhesive provided by the present invention does not flow during use or operation, in addition to its good adhesion, which is different from the traditional liquid UV adhesive. Its pasty state makes it possible to change the size, thickness and shape of adhesive according to actual needs after the adhesive is bonded to the objects before photocuring. This property makes operation more flexible. 0 Furthermore, the photosensitive adhesive provided by the present invention can be added with organic pigments according to actual needs, making it more suitable for more applications.
DESCRIPTION OF EMBODIMENTS
The technical features of the present invention will be further described below with 5 reference to the embodiments of the present invention.
As listed in the following table, components used in the embodiments are (unit: portions by weight):
| Embodiments Components^. | I | II | III | IV | V | VI | VII | VIII | IX |
| Photo initiator | 0.1 | 10 | 8.5 | 9 | 7 | 5 | 6 | 4 | 3 |
| Organic silicone | 0.1 | 3 | 3 | 2 | 1.5 | 1 | 2.5 | 0.5 | 3 |
| Isocyanate | 32.5 | 10 | 25 | 31 | 27 | 28 | 32.2 | 31.5 | 15 |
| Hydroxyethyl terminated polysiloxane | 32.5 | 26 | 20 | 30 | 32 | 23 | 15 | 13 | 31 |
| Polycarbonate diol | 29.78 | 32.5 | 25 | 10 | 21 | 32 | 31 | 32.5 | 31 |
| Hydroxyethyl acrylate | 5 | 17.5 | 17.5 | 14.5 | 11 | 8 | 12 | 15 | 13 |
| Catalyst | 0.01 | 0.5 | 0.5 | 0.25 | 0.3 | 0.4 | 0.1 | 0.2 | 0.5 |
| Polymerization inhibitor | 0.01 | 0.5 | 0.5 | 0.25 | 0.1 | 0.4 | 0.2 | 0.3 | 0.5 |
| Organic pigments | — | — | — | 3 | 0.1 | 2.2 | 1 | 3 | 3 |
Table 1- Proportions of components in embodiments
2020100474 27 Mar 2020
In respect of various conditions of the embodiments, the photo initiator can be any one or two compounds selected from (2, 4, 6- trimethylbenzylidene) diphenylphosphine oxide, bis 5 (1- (2, 4- difluorophenyl) - 3- pyrrolidinyl) dicenelocene or 1- hydroxycyclohexyl phenyl ketone. The organic silicone comprises at least two compounds selected from methyltrichlorosilane, dimethyldichlorosilane, phenyltrichlorosilane, diphenyldichlorosilane or methylphenyldichlorosilane. The isocyanate can be selected from toluene diisocynate, diphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, 0 dicyclohexyl methane diisocyanate, xylylene diisocynate, hexamethylene diisocynate, or polyaryl polymethylene isocyanate. The hydroxyethyl terminated polysiloxane can be selected from hydroxyl terminated polydimethylsiloxane, hydroxyl terminated ethyl polysiloxane, hydroxypropyl terminated polysiloxane, bis [3-(1-methoxy - 2-hydroxypropoxy) propyl] terminated polysiloxane, or bis-hydroxypropyl terminated polysiloxane. The 15 hydroxyethyl acrylate can be selected from methyl acrylate, ethyl acrylate, methyl methacrylate, butyl acrylate, hydroxyethyl acrylate, or hydroxyethyl methylacrylate. The catalyst comprises at least one compound selected from acidic resin, toluenesulfonic acid, monosulfate, disulfate or p-toluenesulfonic acid. The polymerization inhibitor comprises at least one compound selected from methylhydroquinone, P-hydroxyanisole, 20 2-tert-butylhydroquinone, or hydroquinone.
2020100474 27 Mar 2020
Each embodiment is prepared by the following methods according to the portions by weight described in Table 1:
SI: adding isocyanate, hydroxyethyl terminated polysiloxane, polycarbonate diol and hydroxyethyl acrylate into a container according to pre-determined portions by weight, and 5 then adding photo initiator into the container, forming a pasty state;
S2: heating up the container at a preset temperature in a first preset time period, wherein the preset temperature is between 60 °C and 100°C, and the first preset time period is between 1 hour and 2 hours;
S3: stirring the mixture of compounds inside the container in a second preset time period, 0 wherein the third preset time period is between 20 minutes and 40 minutes.
S4: adding organic silicone, catalyst and polymerization inhibitor into the container according to pre-determined portions by weight, and then stirring the mixture of compounds inside the container in a third preset time period, wherein the third preset time period is between 3 minutes and 10 minutes;
S5: cooling.
Preferably, in the embodiments, the following step can be added at the time after the step of S4 and before the step of S5 in order to manufacture adhesives containing different colors.
S5': adding the organic pigment to the container according to pre-determined portions by weight, and stirring the mixture of compounds inside the container in a fourth preset time 20 period, wherein the fourth preset time period is between 3 minutes and 10 minutes;
| x. Embodiments | I | II | III | IV | V | VI | VII | VIII | IX |
| Preset temperature /°C | 60 | 75 | 70 | 75 | 80 | 85 | 90 | 95 | 100 |
2020100474 27 Mar 2020
| The first preset time period /hour | 2 | 1.9 | 1.8 | 1.7 | 1.6 | 1.5 | 1.4 | 1.2 | 1 |
| The second preset time period /hour | 0.25 | 0.3 | 0.4 | 0.45 | 0.5 | 0.55 | 0.6 | 0.65 | 0.75 |
| The third preset time period /hour | 0.33 | 0.4 | 0.45 | 0.5 | 0.5 | 0.55 | 0.55 | 0.6 | 0.67 |
| The fourth preset time period /hour | — | — | — | 3 | 4 | 5 | 6 | 7 | 10 |
Table 2 - Reaction condition of each embodiment
The photosensitive adhesive being made in the embodiments is not slippery and sticky to user’s hands when use, because it is in a pasty state. As such, its pasty state of the 5 photosensitive adhesive is adapted for allowing the change of its size, thickness and shape of adhesive according to actual needs of the user during the time that the adhesive is bonded on to the objects before photocuring process. The physical characteristics of the embodiments of the present invention solves the technical problem of the UV adhesive of the existing technology that the existing UV adhesive is a liquid state which is sticky to the user’s hands and therefore the existing UV adhesive is very inconvenient when use.
The major materials to be applied in the present invention are isocyanate and hydroxyethyl terminated polysiloxane. In the preparation of polycarbonate diol, the organic silicone and hydroxyethyl acrylate are added, which can improve the resistance to high temperature and weatherability during the curing process. The addition of silicon-modified 15 photo-curing monomers is adapted to increase the refractive index of the adhesive layer of the present invention. Further, the addition of pre-determined proportion of base resin can increase the toughness level of the adhesive layer of the present invention, and offsets the negative effect of brittleness due to the addition of silicon-modified photo-curing monomer
2020100474 27 Mar 2020 with a high refractive index. As a result, the adhesive layer has both high refractive index and toughness characteristics. Apparently, the photosensitive adhesive of the present invention has technical improvements compared with the UV adhesives of the existing technology. Particularly, when increasing the refractive index of the UV adhesive of the existing technology, the related adhesive layer will harden, resulting in pulverization during use. By contrast, the photosensitive adhesive of the present invention solves the above technical problem of the existing UV adhesive and can achieve the technical features of high adhesive properties, high air tightness and high weatherability. In a fifth embodiment, the photosensitive adhesive of the fifth embodiment was tested. The photosensitive adhesive 0 being tested in the fifth embodiment comprises isocyanate, hydroxyethyl terminated polysiloxane, polycarbonate diol, hydroxyethyl acrylate, and photo initiator. After about 4-minute period of irradiation under ultraviolet light, the top layer of the photosensitive adhesive completely dries out and then stabilizes, and after that, the photosensitive adhesive completely dries out and then bonds after standing for about 12 hours in the air. The adhesive force after bonding can reach a force of 115N approximately, which meets the requirements in almost all applications of the adhesives for use in construction purpose.
Preferably, the adhesive force of the photosensitive adhesive of the present invention is about 115N. Specifically, the reading of the above-mentioned adhesive force was obtained based on laboratory tests. Particularly, referring to the tests, a SNAS electronic universal 20 tensile tester was used to mount the adhesive to the two opposing ends of a PVC wire. Referring to the experiments, the test results were found that the upper end pulling-out force was 116N and the lower end pulling-out force was 115N.
Furthermore, the photosensitive adhesive of the present invention can be added with different kind of organic pigments to satisfy the user’s applications in particular applications 25 of the adhesives which are for use in construction purpose or other purpose. In the
2020100474 27 Mar 2020 circumstances, the photosensitive adhesive will then be more varieties in its physical appearances when use.
The present invention has been described in detail, with reference to the preferred embodiment, in order to enable the reader to practice the invention without undue experimentation. However, a person having ordinary skill in the art will readily recognizes that many of the previous disclosures may be varied or modified somewhat without departing from the spirit and scope of the invention. Accordingly, the intellectual property rights to this invention are defined only by the following claims.
Claims (5)
- 2020100474 27 Mar 20201. A photosensitive adhesive comprising:a composition of:0.1 portion to 1 portion by weight of photo initiator;0.1 portion to 3 portions by weight of organic silicone;10 portions to 32.5 portions by weight of isocyanate;10 portions to 32.5 portions by weight of hydroxyethyl terminated polysiloxane;10 portions to 32.5 portions by weight of polycarbonate diol;5 portions to 17.5 portions by weight of hydroxyethyl acrylate;0.01 portion to 0.5 portion by weight of catalyst; and0.01 portion to 0.5 portion by weight of polymerization inhibitor, wherein the photo initiator is any one or two compounds selected from (2, 4, 6trimethylbenzylidene) diphenylphosphine oxide, bis (1- (2, 4- difluorophenyl) 3- pyrrolidinyl) dicenelocene or 1- hydroxycyclohexyl phenyl ketone.
- 2. The photosensitive adhesive according to Claim 1, wherein the organic silicone comprises at least two compounds selected from methyltrichlorosilane, dimethyldichlorosilane, phenyltrichlorosilane, diphenyldichlorosilane or methylphenyldichlorosilane.
- 3. The photosensitive adhesive according to Claim 1, wherein the catalyst comprises at least one compound selected from acidic resin, toluenesulfonic acid, monosulfate, disulfate or p-toluenesulfonic acid.
- 4. The photosensitive adhesive according to Claim 1, wherein the polymerization inhibitor comprises at least one compound selected from methylhydroquinone, P-hydroxyanisole, 2-tert-butylhydroquinone or quinol.
- 5. The photosensitive adhesive according to Claim 1, wherein the photosensitive adhesive further comprises 0.1 portion to 3 portions by weight of an organic pigment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2020100474A AU2020100474A4 (en) | 2020-03-27 | 2020-03-27 | Photosensitive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2020100474A AU2020100474A4 (en) | 2020-03-27 | 2020-03-27 | Photosensitive adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2020100474A4 true AU2020100474A4 (en) | 2020-04-30 |
Family
ID=70374810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2020100474A Ceased AU2020100474A4 (en) | 2020-03-27 | 2020-03-27 | Photosensitive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| AU (1) | AU2020100474A4 (en) |
-
2020
- 2020-03-27 AU AU2020100474A patent/AU2020100474A4/en not_active Ceased
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