AU2017203313B2 - Octylisothiazolinone dispersions - Google Patents

Octylisothiazolinone dispersions Download PDF

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AU2017203313B2
AU2017203313B2 AU2017203313A AU2017203313A AU2017203313B2 AU 2017203313 B2 AU2017203313 B2 AU 2017203313B2 AU 2017203313 A AU2017203313 A AU 2017203313A AU 2017203313 A AU2017203313 A AU 2017203313A AU 2017203313 B2 AU2017203313 B2 AU 2017203313B2
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wood
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Geoffrey Vern Webb
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Troy Corp
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Troy Corp
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Abstract

OF THE INVENTION An aqueous dispersion of octylisothiazolinone ("T") has been found to be a superior vehicle for delivering OIT to wood for protecting the wood from discoloration 5 by mold or fungi. The OIT dispersion can be applied to the wood by spraying, dipping or pressure treating, among other methods. 9062767_1 (GHMatters) P105955.AU H OHFIG. ICH2 H 0 O X / H 0 0 H<H 0 0OH HX FIG. 3 FIG. 4 L" Lo Lffl -44

Description

OCTYLISOTHIAZOLINONE DISPERSIONS
CROSS-REFERENCE TO RELATED APPLICATIONS
This application claims priority of a provisional application entitled OCTYLISOTHIAZOLINONE DISPERSIONS, which is application number 62/175,391, filed June 14, 2015, and is hereby incorporated by reference in its entirety, and priority of a provisional application entitled OCTYLISOTHIAZOLINONE
DISPERSIONS, which is application number 62/188,348, filed July 2, 2015, and is hereby incorporated by reference in its entirety.
BACKGROUND OF THE INVENTION
Field of the Invention
The present invention relates to dispersions of octylisothiazolinone and to products and processes for increasing the resistance of wood against attack by surface mold and sapstain fungi.
Description of the Related Art
Protecting wood from discoloration by spraying it with or immersing it in liquid solutions of octylisothiazolinone (hereinafter referred to as ΌΙΤ”) is well known. OIT solutions are publicly used to combat molds that have pigmented spores, such as Stachybotrys chartarum and Penicillium sp., and sapstain fungi that have pigmented hyphae, such as Aureobasidium pullulans.
Wood contains four main types of material: cellulose, hemi-cellulose, lignin, and extractives. Cellulose and hemi-cellulose make up the fibril structure of wood cell walls. Lignin acts as a poly-phenolic glue that holds the cellulosic fibrils together.
Extractives are the sugars, starches, oils, etc. that generally reside within the wood cell voids along with water.
Fibrils are groups of cellulosic molecules in bundles of about 12 nm or less diameter, typically about 2 to 4 nm diameter. Cellulose is the primary fibril component.
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Hemicellulose, which is considered a chemical precursor to cellulose, is also present in the fibrils.
Fibrils bundle together to form the wood fiber within a cell wall. Each cell wall is comprised of four layers: a primary cell wall layer, an S1 layer, an S2 layer, and an inner cell wall layer. The fibrils are oriented in different directions, depending upon which layer of the cell wall the fibril was formed in.
The primary cell wall is a relatively thin, outermost layer of the cell wall. Fibrils in the primary cell wall layer can be oriented in various directions; fibril direction in the primary cell wall layer is amorphous.
An S1 layer is located inside the primary cell wall. The S1 layer is about 0.25 to about 0.50 urn thick with a helical/ spiral direction to the fibrils.
An S2 layer of the cell wall is about 0.5 to about 1.0 urn thick with a generally longitudinal direction.
An inner cell wall is a thin layer that makes up the interior surface of the wood 15 cell. The fibrillar direction of the Tertiary cell wall is amorphous.
Due to the structure of cellulose, fibrils, and cell walls; water has interesting effects on wood. First, water can fill the cellular voids and water can also adsorb onto the cellulose (not to be confused with absorption into the cellulose). A hydrogenbonding interaction occurs between the cellulose and the adsorbed water.
Consequently, when wood is dried, the first water that is driven off is water located within the cellular voids (also known as “free water”). The last bit of water to be driven off is the water adsorbed onto the fibrils of the cell wall (also known as “bound water”). Wood shrinks and swells with the addition or removal of bound water. Additional energy is required to remove bound water due to hydrogen bonding. Aqueous solutions, being solutions of water, are typically adsorbed into the wood fiber.
For the present purposes, “fungal attack” means infestation by wood destroying fungi (typically Basidiomycetes fungi), which attack and digest the cell wall constituents: cellulose, hemi-cellulose, and lignin. By digesting the cell wall, wooddestroying fungi undermine the strength and integrity of the wood. Preservative treatments for wood have historically focused on protecting the cell wall structural integrity, and thereby the durability of the wood.
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For example, pressure treating with preservatives is a method of forcing preservatives into the structure of the cell wall. In the method, one or more preservatives are forced from the sawn surfaces of a board into the center of the board and wood destroying fungi are killed when they come into contact with the biocide.
Most pressure treating processes utilize biocide dissolved in a liquid solution, and attempt to force the biocidal solution between the fibrils of the cell wall.
Previous researchers have also described special solvents for dissolving OIT, and emulsions which facilitate dilution of concentrated OIT-containing formulations to produce OIT solutions. The solvents and emulsions are said to overcome problems that would otherwise arise from non-homogeneous OIT emulsions or from phase separation of OIT solutions.
Other known pressure processes employ preservatives in the form of aqueous dispersions. The dispersions contain tiny biocidal particles that are forced by pressure into the cell wall fibers. The aqueous solutions swell the fibrils and the tiny particles are forced among the fibrils. Because wood-destroying fungi grow among and eat the fibrils, this is an effective way to bring the biocidal particles into contact with wood destroying fungi. However, the treatments used to combat wood-destroying fungi are inadequate against wood-discoloring molds and fungi.
Wood-discoloring molds and fungi are presently a major of concern in the lumber industry. The simple fact is that consumers do not like to buy discolored, moldylooking wood. Consumers are not satisfied with strong lumber that is looks unhealthy. Wood-discoloring molds and fungi do not negatively impact the structural integrity of the wood, because they do not digest the cell wall. The hyphae of wood-discoloring fungi grow within the cell voids, not within the cell walls. Consequently, the traditional approach of forcing biocidal solutions or biocidal dispersion into fibrils of the cells walls is inefficient and largely ineffective against wood-discoloring molds and fungi.
Despite the impressive achievements of previous researchers, the wood industry still has a need for improved preservative products that can efficiently increase the resistance of wood and wood products to discoloration by mold and fungi.
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SUMMARY OF THE INVENTION
It has now been discovered that an aqueous dispersion of OIT in water is surprisingly more effective for increasing the resistance of pressure treated wood to discoloration by mold and fungi, as compared to aqueous and non-aqueous solutions of OIT.
In one aspect, the invention is a two-phase composition for inhibiting wood discoloration by mold having pigmented spores or by sapstain fungi. The composition includes a disperse phase in the form of solid or liquid particles of measurable size, which disperse phase includes octylisothiazolinone and a surfactant. The surfactant may be nonionic, preferably a polyalkoxylated ether or polyalkoxylated alcohol. The composition also includes a continuous liquid phase containing water and, optionally, a rheology modifier. The size of the particles is in the range of about 0.1 to about 10 microns.
In another aspect, the invention is a process for increasing the resistance of wood to attack by surface mold and sapstain fungi. The process includes suffusing a two-phase composition over or through wood to place the composition within the voids of wood cells, immediately adjacent wood cell walls. The composition is composed of a disperse phase in the form of solid or liquid particles of measurable size, which includes octylisothiazolinone and a surfactant; and a continuous liquid phase, which includes water and, optionally, a rheology modifier.
BRIEF DESCRIPTION OF THE DRAWING
FIG. 1 is a structural formula which illustrates the repeating unit of wood cellulose;
FIG. 2 is a perspective view of a wood fibrillary bundle which illustrates longitudinally arranged molecules;
FIG. 3 is an isometric sectional view of a wood cell wall 6,which depicts a primary cell wall layer 9, an S1 layer 10, an S2 layer 11, and an inner cell wall layer 12;
FIG. 4 is a truncated perspective view of a wood cellular bundle 8, which depicts cell voids 3, wood cells 4, intercellular pits 5, and cell walls 6; and
Fig. 5 is a sectional view of a wood block 13 in which a previously known OIT solution 2 is absorbed within cell walls 6, and cell voids 3, intercellular pits 5, and hyphae of mold having pigmented spores or sapstain fungi 7 are also depicted; and
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FIG. 6 is a sectional view of a wood block 14 in which OIT dispersion particles 1 are concentrated within wood cell voids 3, and intercellular pits 5, cell walls 6, and hyphae of mold having pigmented spores or sapstain fungi 7 are also depicted.
DETAILED DESCRIPTION OF A PREFERRED EMBODIMENT
In a preferred embodiment, the invention is a two-phase composition for inhibiting wood discoloration by mold having pigmented spores or sapstain fungi.
Referring now to Fig. 6, a disperse phase of the composition is in the form of solid or liquid particles 1. The particles 1 contain at least octylisothiazolinone and a surfactant. The particles 1 are physically stable at OIT concentrations in the range of about 50 to about 500 ppm, based on the total weight of the dispersion. Preferably, the amount of OIT present in the composition is in the range of about 50 ppm to about 60 percent by weight. More preferably, the OIT present in the composition is 2-n-octyl-4isothiazolin-3-one.
The particles 1of the inventive dispersion are small enough to move inside the cell voids 3 and travel from one wood cell 4 to another via intercellular pits 5, but are too large to be adsorbed or absorbed within the cell wall 6. The particles 1 of the inventive dispersion are effective at inhibiting discoloring mold having pigmented spores or sapstain fungi, because the particles 1 become concentrated in cell voids 3 where the hyphae 7 of mold having pigmented spores or sapstain fungi grow.
The particles 1 are of a size that permits them to travel within individual wood cells 4 without necessarily being adsorbed or absorbed by the wood fiber. Preferably, the particles 1 have a mean average size in the range of about 0.1 to about 50 microns; more preferably, about 0.5 to about 10microns. For the present purposes, “mean average” and “arithmetic mean” are synonyms which are both defined as the value obtained by dividing the sum of a set of quantities by the number of quantities in the set.
In contrast, Fig. 5 depicts a previously known OIT solution 2 absorbed or adsorbed within cell walls 6. While concentrating OIT solution 2 within cell walls 6 may be satisfactory for inhibiting wood-destroying fungi that act by entering cell walls 6, it is has now been discovered that OIT dispersion particles 2 concentrated within or immediately adjacent to cell voids 3 are more effective for inhibiting wood discoloration by mold having pigmented spores or sapstain fungi.
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A continuous phase of the dispersion is liquid and includes water. A thixotropic rheology modifier is often useful for physically stabilizing the dispersion. When present, the amount of thixotropic rheology modifier should be in the range of about 0.01 ppm to about 0.1 per cent by weight. For the present purposes, “rheology” means the deformation and flow of matter, especially non-Newtonian flow of liquids and plastic flow of solids. For the present purposes, “thixotropic” means having a viscosity that decreases when a stress is applied, as when stirred.
The composition is conveniently transported in concentrated form and diluted with water at or near the point of use. Preferably, the concentrated form of the composition contains about 5 percent to about 50 percent OIT by weight. Preferably, the diluted form of the composition contains about 100 ppm to about 2 percent OIT by weight.
The surfactant is preferably a non-ionic surfactant. For the present purposes, “non-ionic surfactant” means a surfactant without a charged moiety. Polyalkoxylated ethers or polyalkoxylated alcohols are especially preferred for the surfactant. For example, the surfactant may be a polymer of ethylene oxide and propylene oxide. The surfactant may be present in the composition in an amount in the range of about 0.1 ppm to about 10 percent by weight; preferably, about 1 ppm to about 0.5 percent by weight; more preferably about 2 ppm to about 2 percent by weight.
The present invention as claimed herein is described in the following items 1 to 20:
1) A two-phase composition for inhibiting fungal discoloration of wood, comprising:
a disperse phase in the form of solid or liquid particles having a mean average size the range of about 0.1 to about 50 microns, which disperse phase includes octylisothiazolinone and a surfactant; and a continuous liquid phase, which includes water and, optionally, a thixotropic rheology modifier, wherein the particles move inside wood cell voids and travel from one wood cell to another via intercellular pits and the particles are not adsorbed or absorbed within wood cell walls, when the composition is suffused over or through a wood piece to place the composition within the wood cell voids, immediately adjacent to wood cell walls.
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6a
2) The two-phase composition of item 1, in which the mean average size of the particles is in the range of about 0.1 to about 10 microns.
3) The two-phase composition of item 2, in which the mean average size the particles is in the range of about 0.5 to about 10 microns.
4) The two-phase composition of any one of items 1 to 3, in which the octylisothiazolinone is 2-n-octyl-4-isothiazolin-3-one.
5) The two-phase composition of any one of items 1 to 4, in which the amount of octylisothiazolinone present is in the range of about 50 ppm to about 60 percent by weight, based on the total weight of the two-phase composition.
6) The two-phase composition of item 5, in which the amount of octylisothiazolinone present is in the range of about 100 ppm to about 2 percent by weight, based on the total weight of the two-phase composition.
7) The two-phase composition of item 5, in which the amount of octylisothiazolinone present is in the range of about 5 percent by weight to about 45 percent by weight, based on the total weight of the two-phase composition.
8) The two-phase composition of any one of items 1 to 7, in which the surfactant is a non-ionic surfactant.
9) The two-phase composition of any one of items 1 to 8, in which the surfactant is a polyalkoxylated ether or polyalkoxylated alcohol.
10) The two-phase composition of any one of items 1 to 9, in which the surfactant is a polymer of ethylene oxide and propylene oxide.
11) The two-phase composition of any one of items 1 to 10, in which the amount of surfactant present is in the range of about 0.1 ppm to about 10 percent by weight, based on the total weight of the two-phase composition.
12) The two-phase composition of any one of items 1 to 11, in which the amount of surfactant present is in the range of about 1 ppm to about 0.5. percent by weight, based on the total weight of the two-phase composition.
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6b
13) The two-phase composition of any one of items 1 to 11, in which the amount of surfactant present is in the range of about 2 ppm to about 2 percent by weight, based on the total weight of the two-phase composition.
14) The two-phase composition of any one of items 1 to 13, in which the amount of thixotropic rheology modifier present is in the range of about 0.01 ppm to about 0.1 per cent by weight, based on the total weight of the two-phase composition.
15) A process for increasing the resistance of wood to fungal discoloration, which comprises:
suffusing the composition of any one of items 1 to 14 over or through a wood piece to place the composition within wood cell voids, immediately adjacent to wood cell walls, whereby the resistance of the wood to discoloration by surface mold and sapstain fungi is increased.
16) The process of item 15, in which the composition is suffused over or through the wood piece by spraying the composition on the wood piece.
17) The process of item 15, in which the composition is suffused over or through the wood piece by immersing the wood piece in the composition.
18) The process of item 15, in which the composition is suffused over or through the wood piece by immersing the wood piece in the composition and under pressure.
19) The wood piece having increased resistance to attack by surface mold and sapstain fungi produced by of the process of any one of items 15 to 18.
20) Use of the two-phase composition of any one of items 1 to 14 to increase resistance of a wood piece to fungal discolouration through suffusion of the wood piece in the composition.
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6c
The following examples and procedures are presented to communicate the invention, and are not meant to limit the invention in any way. Examples described in the present tense are hypothetical examples. Unless otherwise indicated, all references to parts, percentages or proportions are based on weight.
Example 1 Test Procedure
Resistance to attack by surface mold and sapstain fungi was measured in accordance with American Wood Protection Association Standard AWPA E29-13, entitled “Antisapstain Field Test Method for Green Lumber”; except that the six-level rating scale specified in the Method was not used. Instead, a five-level rating scale was employed as follows:
“0” indicates no mold growth “1” indicates less than 10% of the surface area has mold (but more than 0) “2” indicates less than 25% mold growth (but more than 10%)
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2017203313 17 May 2017 “3” indicates less than 50% mold growth (but more than 25%) “4” indicates that greater than 50% of the surface area of the board exhibits mold
More specifically, the lumber utilized for this test was pressure treated Southern
Yellow Pine. The pressure treatment included micronized copper azole at a concentration suitable for protection of wood in above ground environments, and included dichloromethylisothiazolinone and methylisothiazolinone (“CMIT/MIT”) at 48 ppm of active ingredient. Each bundle of lumber contained thirty-five treated boards, each 2 inches thick, 4 inches wide and 4 feet long.
Four bundles were prepared and tested. Bundles No. 1,2, and 3 were treated, respectively, with OIT dispersions of the invention that contained 100 ppm, 200 ppm and, 300 ppm of OIT based on the total weight of the dispersion. The dispersion of the invention included 2 percent of the surfactant, based on the total weight of OIT in the dispersion.
Bundle No. 4 was treated with a widely known and highly regarded antisapstain product, which is commercially available from Arch Wood Protection, Inc. of 360 Interstate North Parkway Suite 450 Atlanta, Georgia, U.S.A, under the tradename Wolman® WE. Wolman® WE is a 45% solution of OIT in a glycol-based solvent. For this test, Wolman® WE was diluted with water to produce a solution containing 100 ppm of OIT.
As specified in the Method, each of the bundles was surrounded by lumber which was not treated with OIT, and was covered in plastic to retain moisture. The bundles were then stored undercover in central South Carolina.
Example 2 Test Results
Ratings were developed for the OIT-containing boards of each of the four bundles, and separately for the OIT-free perimeter boards of each bundle, by inspecting the individual boards and rating them based on the amount of surface area on each board covered by mold. The five-level rating system described above was utilized to rate the boards. Each board was evaluated after being stored undercover for 30 days, and again after being stored undercover for a total of 90 days.
The tally of OIT- containing board ratings within each bundle, and also of the
OIT-free perimeter boards, is shown in the Table below. The mean average of the
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TABLE
Bundle No. Storage Time (days) INVENTION/ COMPARISON [form of OIT+] PASS/ FAIL* for Bundle Mean Average Rating in Bundle Frequency of each Board Rating
in Bundle: 3 4
0 1 2
N/A 30 COMPARISON [No OIT] FAIL 2 0 2 8 9 0
1 30 INVENTION A [100 ppm OIT in Dispersion] PASS 0 26 6 2 1 0
2 30 INVENTION B [200 ppm OIT in Dispersion] PASS 0 29 6 0 0 0
3 30 INVENTION C [300 ppm OIT in Dispersion] PASS 0 26 6 0 0 0
4 30 COMPARISON [100 ppm OIT in Solution] PASS 1 14 11 6 3 1
N/A 90 COMPARISON [No OIT] FAIL 3 0 0 6 8 5
1 90 INVENTION A [100 ppm OIT in Dispersion] PASS 1 22 10 2 1 0
2 90 INVENTION B [200 ppm OIT in Dispersion] PASS 0 25 9 1 0 0
3 90 INVENTION C [300 ppm OIT in Dispersion] PASS 0 29 5 0 1 0
4 90 COMPARISON [100 ppm OIT in Solution] FAIL 3 0 0 3 15 17
Legend: OIT means octylisothiazolinone
PASS means an Average Score of 0 or 1.
FAIL means an Average Score of 2 or higher.
The boards with no OIT were those placed around the perimeter of the bundles of the four test bundles. Due to these boards having at least one surface exposed, and being subject to drying, they mostly exhibited mold growth on the interior surfaces, with little mold on the exterior surfaces.
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The data presented in the TABLE indicates that, after 30 days of storage the bundles of the invention (Bundles No. 1,2, and 3) exhibited superior performance at all tested OIT levels, as compared to the perimeter boards with no OIT and to Bundle No. 4, which had been treated with a solution containing 100 ppm of OIT.
The data also demonstrates that all three bundles of the invention (Bundles No.
1, 2, and 3) continued to pass the antisapstain test after 90 days of storage, while the antisapstain product with OIT in solution failed the Test after 90 days of storage. This data is evidence that an OIT dispersion is more effective at protecting wood against sapstain or surface mold discoloration, as compared to a solution of OIT that contains the same concentration of OIT.
The above Examples are intended to better communicate the invention, and do not limit the invention in any way. The invention is defined solely by the appended claims.
In the claims which follow and in the preceding description of the invention, except where the context requires otherwise due to express language or necessary implication, the word “comprise” or variations such as “comprises” or “comprising” is used in an inclusive sense, i.e. to specify the presence of the stated features but not to preclude the presence or addition of further features in various embodiments of the invention.
It is to be understood that, if any prior art publication is referred to herein, such reference does not constitute an admission that the publication forms a part of the common general knowledge in the art, in Australia or any other country.
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Claims (20)

  1. THE CLAIMS DEFINING THE INVENTION ARE AS FOLLOWS:
    1) A two-phase composition for inhibiting fungal discoloration of wood, comprising:
    a disperse phase in the form of solid or liquid particles having a mean average size the range of about 0.1 to about 50 microns, which disperse phase includes octylisothiazolinone and a surfactant; and a continuous liquid phase, which includes water and, optionally, a thixotropic rheology modifier, wherein the particles move inside wood cell voids and travel from one wood cell to another via intercellular pits and the particles are not adsorbed or absorbed within wood cell walls, when the composition is suffused over or through a wood piece to place the composition within the wood cell voids, immediately adjacent to wood cell walls.
  2. 2) The two-phase composition of claim 1, in which the mean average size of the particles is in the range of about 0.1 to about 10 microns.
  3. 3) The two-phase composition of claim 2, in which the mean average size the particles is in the range of about 0.5 to about 10 microns.
  4. 4) The two-phase composition of any one of claims 1 to 3, in which the octylisothiazolinone is 2-n-octyl-4-isothiazolin-3-one.
  5. 5) The two-phase composition of any one of claims 1 to 4, in which the amount of octylisothiazolinone present is in the range of about 50 ppm to about 60 percent by weight, based on the total weight of the two-phase composition.
  6. 6) The two-phase composition of claim 5, in which the amount of octylisothiazolinone present is in the range of about 100 ppm to about 2 percent by weight, based on the total weight of the two-phase composition.
  7. 7) The two-phase composition of claim 5, in which the amount of octylisothiazolinone present is in the range of about 5 percent by weight to about 45 percent by weight, based on the total weight of the two-phase composition.
  8. 8) The two-phase composition of any one of claims 1 to 7, in which the surfactant is a non-ionic surfactant.
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  9. 9) The two-phase composition of any one of claims 1 to 8, in which the surfactant is a polyalkoxylated ether or polyalkoxylated alcohol.
  10. 10) The two-phase composition of any one of claims 1 to 9, in which the surfactant is a polymer of ethylene oxide and propylene oxide.
  11. 11) The two-phase composition of any one of claims 1 to 10, in which the amount of surfactant present is in the range of about 0.1 ppm to about 10 percent by weight, based on the total weight of the two-phase composition.
  12. 12) The two-phase composition of any one of claims 1 to 11, in which the amount of surfactant present is in the range of about 1 ppm to about 0.5. percent by weight, based on the total weight of the two-phase composition.
  13. 13) The two-phase composition of any one of claims 1 to 11, in which the amount of surfactant present is in the range of about 2 ppm to about 2 percent by weight, based on the total weight of the two-phase composition.
  14. 14) The two-phase composition of any one of claims 1 to 13, in which the amount of thixotropic rheology modifier present is in the range of about 0.01 ppm to about 0.1 per cent by weight, based on the total weight of the two-phase composition.
  15. 15) A process for increasing the resistance of wood to fungal discoloration, which comprises:
    suffusing the composition of any one of claims 1 to 14 over or through a wood piece to place the composition within wood cell voids, immediately adjacent to wood cell walls, whereby the resistance of the wood to discoloration by surface mold and sapstain fungi is increased.
  16. 16) The process of claim 15, in which the composition is suffused over or through the wood piece by spraying the composition on the wood piece.
  17. 17) The process of claim 15, in which the composition is suffused over or through the wood piece by immersing the wood piece in the composition.
  18. 18) The process of claim 15, in which the composition is suffused over or through the wood piece by immersing the wood piece in the composition and under pressure.
  19. 19) The wood piece having increased resistance to attack by surface mold and sapstain fungi produced by of the process of any one of claims 15 to 18.
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  20. 20) Use of the two-phase composition of any one of claims 1 to 14 to increase resistance of a wood piece to fungal discolouration through suffusion of the wood piece in the composition.
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CN103317566A (en) * 2013-06-28 2013-09-25 北京林业大学 Micro-emulsion-type wood and bamboo mould-proof agent, as well as preparation method and application thereof
US20160360752A1 (en) * 2015-06-14 2016-12-15 Troy Corporation Octylisothiazolinone dispersions

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