AU2017100747A4 - Tooling for linearly cutting internal splines of input planet carriers - Google Patents
Tooling for linearly cutting internal splines of input planet carriers Download PDFInfo
- Publication number
- AU2017100747A4 AU2017100747A4 AU2017100747A AU2017100747A AU2017100747A4 AU 2017100747 A4 AU2017100747 A4 AU 2017100747A4 AU 2017100747 A AU2017100747 A AU 2017100747A AU 2017100747 A AU2017100747 A AU 2017100747A AU 2017100747 A4 AU2017100747 A4 AU 2017100747A4
- Authority
- AU
- Australia
- Prior art keywords
- positioning sleeve
- input planet
- chassis
- cut
- gland
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
TITLE: TOOLING FOR LINEARLY CUTTING INTERNAL SPLINES OF INPUT PLANET CARRIERS Abstract The present invention discloses a tooling for linearly cutting internal splines of input planet carriers, comprising a chassis, a positioning sleeve and a gland, wherein the chassis, the positioning sleeve and the press cover are three independent components; a central positioning hole running through the chassis from top to bottom is formed on the chassis; an inner cavity for accommodating several input planet carriers to be cut is formed within the positioning sleeve; an inner edge of a radial cross-section of the positioning sleeve is circular; the inner cavity of the positioning sleeve and the central positioning hole of the chassis are arranged coaxially; a through hole running through the gland from top to bottom is formed on the gland; several input planet carriers to be cut are stacked within the inner cavity, with the position of an upper end face of the topmost input planet carrier to be cut being higher than the position of an upper end face of the positioning sleeve; and, a lower end face of the gland extends upward to form a circular groove communicated with the through hole.
Description
2017100747 15 Jun2017
TOOLING FOR LINEARLY CUTTING INTERNAL SPLINES OF INPUT
PLANET CARRIERS
Technical Field of the Invention
The present invention relates to a tooling for linearly cutting internal splines of input planet carriers.
Background of the Invention
In the prior art, in order to linearly cut internal splines of input planet carriers, each input planet carrier needs to be fixed. The input planet carriers are machined successively by linear cutting, and it is unable to machine internal splines of a plurality of input planet carriers in one time. Therefore, the machining efficiency is low.
Summary of the Invention
An objective of the present invention is to provide a tooling for linearly cutting internal splines of input planet carriers, by which a number of input planet carriers are simultaneously machined by linear cutting.
For this purpose, the present invention employs the following technical solutions: a tooling for linearly cutting internal splines of input planet carriers is provided, including a chassis, a positioning sleeve and a gland, the chassis, the positioning sleeve and the gland being three independent components; a central positioning hole running through the chassis from top to bottom is formed on the chassis; an inner cavity for accommodating several input planet carriers to be cut is formed within the positioning sleeve; an inner edge of a radial cross-section of the positioning sleeve is circular; the inner cavity of the positioning sleeve and the central positioning hole of the chassis are arranged coaxially; a through hole running through the gland from top to bottom is formed on the gland; several input planet carriers to be cut are stacked within 1 2017100747 15 Jun2017 the inner cavity, with the position of an upper end face of the topmost input planet carrier to be cut being higher than the position of an upper end face of the positioning sleeve and the position of a lower end face of the topmost input planet carrier to be cut being lower than the position of the upper end face of the positioning sleeve; a lower end face of the gland extends upward to form a circular groove communicated with the through hole; and, when the gland and the positioning sleeve are fixed, the upper end face of the topmost input planet carrier to be cut is located within the circular groove.
In use of the tooling of the present invention, the positioning sleeve and the chassis are fixed first, and a plurality of pieces to be cut (input planet carriers to be cut) are then placed into the cavity of the positioning sleeve. The topmost piece to be cut is partially exposed out from the positioning sleeve. The axial limiting to the pieces to be cut is realized by fitting the circular groove of the gland and the topmost piece to be cut, and the radial limiting to the pieces to be cut is realized by the inner cavity of the positioning sleeve. By applying a force to the gland, the pieces to be cut are compressed tightly, and then linearly cut and machined. Before linear cutting, a metal wire is passed through the central positioning hole of the chassis, the through holes of several pieces to be cut and the through hole of the gland, and then to a central position of the inner cavity of the positioning sleeve through the central positioning hole, so that the concentricity for the axes of several pieces to be cut after being machined is ensued.
In the present invention, a plurality of pieces to be cut (input planet carriers to be cut) can be linearly cut and machined in one time, so that the machining efficiency is high; moreover, the axial precision of the pieces to be cut may be ensured, and the machining precision is thus high.
Brief Description of the Drawings
Fig. 1 is a structural diagram of the present invention; and
Fig. 2 is a structural diagram of the present invention, when fitted with 2017100747 15 Jun2017 pieces to be cut.
Detailed Description of the Invention
The present invention will be further described below by specific embodiments with reference to the accompanying drawings.
As shown in Figs. 1 and 2, the present invention provides a tooling for linearly cutting internal splines of input planet carriers, including a chassis 1, a positioning sleeve 2 and a gland 3, wherein the chassis 1, the positioning sleeve 2 and the press cover 3 are three independent components; a central positioning hole 11 running through the chassis from top to bottom is formed on the chassis 1; an inner cavity for accommodating several input planet carriers 4 to be cut is formed within the positioning sleeve 2; an inner edge of a radial cross-section of the positioning sleeve 2 is circular; the inner cavity of the positioning sleeve 2 and the central positioning hole 11 of the chassis 1 are arranged coaxially; and, a through hole 31 running through the gland from top to bottom is formed on the gland 3.
In the present invention, the inner cavity of the positioning sleeve 2 is used for accommodating four input planet carriers 4 to be cut which are stacked from top to bottom. When the four input planet carriers 4 to be cut, which are stacked from top to bottom, are placed into the inner cavity, the position of an upper end face of the topmost input planet carrier 4 to be cut is higher than the position of an upper end face of the positioning sleeve 2, and the position of a lower end face of the topmost input planet carrier 4 is lower than the position of the upper end face of the positioning sleeve 2. A lower end face of the gland 3 extends upward to form a circular groove communicated with the through hole31. When the gland 3 and the positioning sleeve 2 are fixed, the upper end face of the topmost input planet carrier 4 to be cut is located within the circular groove 32. The value of the height from the upper end face of the topmost input planet carrier 4 to be cut to a lower end face of the bottommost input planet carrier 4 to be cut is denoted by L15 the value of the height of the inner 3 2017100747 15 Jun2017 cavity of the positioning sleeve 2 is denoted by L2, the value of the depth of the circular groove 32 is denoted byL3, and U is greater than the sum of L2 and L3. A boss 41 is formed on an end face of each of the input planet carriers 4 to be cut, and the inner diameter of the through hole 31 of the gland 3 is greater than the outer diameter of the boss 41.
The gland 3 is fixed with the positioning sleeve 2 through three first screws 5, three fitting holes 51 for fitting the first screws 5 are formed on both the gland 3 and the positioning sleeve 2, and an internal thread structure is formed within each of the fitting holes 51 of the positioning sleeve 2. The three fitting holes of the positioning sleeve 2 and the three fitting holes of the gland are annularly and uniformly arranged at intervals around an axis of the central positioning hole 11 of the chassis.
All the upper end face of the positioning sleeve 2, the lower end face of the positioning sleeve 2, the upper end face of the chassis 1 and the lower end face of the chassis 1 are flat, and both the upper end face and the lower end face of the positioning sleeve 2 are arranged perpendicularly to the axis of the positioning sleeve 2. The positioning sleeve 2 and the chassis 1 are fixed by three second screws 6, a fitting hole for fitting a positioning pin 7 is formed on both the positioning sleeve 2 and the chassis 1, and the fitting hole of the positioning sleeve 2 corresponds to the fitting hole of the chassis 1. 4
Claims (2)
- Claims
- 1. A tooling for linearly cutting internal splines of input planet carriers, comprising a chassis, a positioning sleeve and a gland, characterized in that the chassis, the positioning sleeve and the gland being three independent components; a central positioning hole running through the chassis from top to bottom is formed on the chassis; an inner cavity for accommodating several input planet carriers to be cut is formed within the positioning sleeve; an inner edge of a radial cross-section of the positioning sleeve is circular; the inner cavity of the positioning sleeve and the central positioning hole of the chassis are arranged coaxially; a through hole running through the gland from top to bottom is formed on the gland; several input planet carriers to be cut are stacked within the inner cavity, with the position of an upper end face of the topmost input planet carrier to be cut being higher than the position of an upper end face of the positioning sleeve and the position of a lower end face of the topmost input planet carrier to be cut being lower than the position of the upper end face of the positioning sleeve; a lower end face of the gland extends upward to form a circular groove communicated with the through hole; and, when the gland and the positioning sleeve are fixed, the upper end face of the topmost input planet carrier to be cut is located within the circular groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2017100747A AU2017100747A4 (en) | 2017-06-15 | 2017-06-15 | Tooling for linearly cutting internal splines of input planet carriers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2017100747A AU2017100747A4 (en) | 2017-06-15 | 2017-06-15 | Tooling for linearly cutting internal splines of input planet carriers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2017100747A4 true AU2017100747A4 (en) | 2017-07-20 |
Family
ID=59335329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2017100747A Ceased AU2017100747A4 (en) | 2017-06-15 | 2017-06-15 | Tooling for linearly cutting internal splines of input planet carriers |
Country Status (1)
| Country | Link |
|---|---|
| AU (1) | AU2017100747A4 (en) |
-
2017
- 2017-06-15 AU AU2017100747A patent/AU2017100747A4/en not_active Ceased
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FGI | Letters patent sealed or granted (innovation patent) | ||
| MK22 | Patent ceased section 143a(d), or expired - non payment of renewal fee or expiry |