AU2016101469B4 - Crisp - Google Patents

Abstract

Abstract A method of making a baked crispy edible wafer comprising the steps of: a) making a flour and water based yeast free dough; b) using rollers to roll the dough into a thin sheet; c) cutting the sheets into finger food sized wafers of the desired shape; d) incorporating particulate solid flavouring agents added in dusting flour sprinkled on a surface supporting the wafers as they enter the baking phase; e) baking the until they adopt a toasted appearance. >1 * I 0' 7/' 1 (yy 00 -I ~tj (-) I * *" (A)

Description

[0001] This invention concerns baked finger food and methods of making the same.

[0002] Baked snack foods such as biscuits, crackers and crisps continue to be popular with consumers. The conduct of the baking process is crucial in that it determines water content, crispness and flavour retention. Potato crisps are made from slices of potato with high water content. Phyllo pastry is made from flour based dough and is of lower water content.

SUMMARY OF INVENTION [0003] The product aspect of the invention provides a crispy edible wafer made of flavoured flour dough which has been baked to give the wafer a toasted appearance and is 0.2-1mm thick.

[0004] The dough may have a 45-50% water content. The baked wafer may have a 2-5% water content.

[0005] The flavouring agents may include salt, vinegar, chilli, lime, pepper, sour cream, chives, garlic, paprika, capsicum and the like.

[0006] The method aspect of the invention provides a method of making a crispy edible wafer comprising the steps of making a flour and water dough, rolling the dough into a sheet, incorporating flavour agents into the dough during dough formation or at the rolling stage and baking the sheet sufficiently to give the sheet a toasted appearance and a thickness of 0.2-1mm.

[0007] The sheet is preferably divided into pieces suitable for finger food before baking. These may be triangular, rounded, rectangular and variants thereof. When

-22016101469 18 Aug 2016 the flavour agents are particulate solids such as salt and pepper these are added in dusting flour sprinkled on the surface supporting the pieces as they enter the baking phase. The surface may be the rolling surface. The dusting flour may be applied by a shaker.

[0008] The baking phase may expose the pieces to 240-360°C for 2-3 minutes.

Advantages [0009] 1. The food contains no dairy products, colouring, yeast or egg.

[0010] 2. The food is baked and not fried. The texture is grainy yet smooth and is different in appearance from existing finger food.

[0011] 3. The food is shelf stable for at least a year when suitably packaged.

[0012] Examples of the invention are now described with reference to the accompanying drawings in which:

[0013] Figure 1 is a schematic diagram of the bakery production line.

[0014] Figure 2 is a plan view of a piece of wafer.

[0015] Figure 3 is a side view of Figure 2.

[0016] A commercial batch of wafers is prepared from the following recipe:

[0017] 75kg Flour [0018] 15kg Organic flour [0019] 1.2kg Salt [0020] 720g Potassium sorbate [0021] 80g Dough relaxer

-32016101469 18 Aug 2016 [0022] 421 Water [0023] Referring now to Figure 1 of the drawings, the ingredients for a 250kg batch are placed in a dough mixer 1 with rotating mixer rods 2 and mixed for 30 minutes. The mixer is then raised and the batch of dough 3 is tipped onto a conveyor belt 4. A shaker 5 prepares the belt to receive the dough by lightly sprinkling flour onto the belt in known manner.

[0024] Driven roller 6 slowly reduces the dough thickness to 5mm. The thickness is reduced further to 0.5mm by driven roller 7. The dough sheet 8 is dusted with flour containing powdered sweet chilli by shaker 9 whereafter cutter 10 divides the moving sheet 8 into triangles with sides 50-90mm long.

[0025] The pieces now enter oven 11 at 250°C where they bake for 3 minutes. Oven 11 is 2.5m long and conveyor 12 is 6m long to ensure that the pieces cool before leaving the conveyor to be bagged at the packing station 13. Here they are weighed and put in foil bags each sized to take 50g. The bags are sealed and several are loaded into a shelf carton. These are transferred to a transport box.

[0026] Referring now to Figure 2, the piece is a triangle wherein side A is 50mm, side B is 65mm and side C is 85mm. The piece is 0.5mm thick and has a grainy undulating surface the colour of wholemeal bread with toast coloured patches 14.

Examples [0027] Example 1 [0028] Rice flour is 70% of the dough. The remainder is wheat flour (flour, folate, thiamine) water and iodised salt.

[0029] Example 2

-42016101469 18 Aug 2016 [0030] Rye flour is 70% of the dough. The remainder is wheat flour as in Example 1, water and iodised salt.

[0031] Example 3 [0032] Spelt flour, water and iodised salt.

[0033] Example 4 [0034] Wheat flour as in Example 1, organic flakes 2.2%, quinoa flour 1.6%, water and iodised salt.

[0035] Example 5 [0036] Gluten free crisps utilise gluten free flours, namely quinoa, maize, buckwheat, almond, amaranth; bean flours made from chickpea, fava, lentil, lupin, soya and the like; potato starch, brown rice, white rice, tapioca, sorghum, teff, chia, coconut, masa harina.

[0037] The temperature range of 240-360°C accords with the range available in gas and electric commercial baking ovens.

[0038] While the above description includes the preferred embodiments of the invention, it is to be understood that many variations, alterations, modifications and/or additions may be introduced into the constructions and arrangements of parts previously described without departing from the essential features or the spirit or ambit of the invention.

[0039] It will be also understood that where the word “comprise”, and variations such as “comprises” and “comprising”, are used in this specification, unless the context requires otherwise such use is intended to imply the inclusion of a stated

-52016101469 18 Aug 2016 feature or features but is not to be taken as excluding the presence of other feature or features.

[0040] The reference to any prior art in this specification is not, and should not be taken as, an acknowledgment or any form of suggestion that such prior art forms part of the common general knowledge.

Claims (5)

1. A method of making a baked crispy edible wafer comprising the steps of:

a) making a flour and water based yeast free dough;

b) using rollers to roll the dough into a thin sheet;

c) cutting the sheets into finger food sized wafers of the desired shape;

d) incorporating particulate solid flavouring agents added in dusting flour sprinkled on a surface supporting the wafers as they enter the baking phase;

e) baking the until they adopt a toasted appearance.

2. A method of making a crispy edible wafer in accordance with claim 1 wherein the dough is rolled down to a thickness of 0.2mm to 1mm.

3. A method of making a crispy edible wafer in accordance with claim 1 wherein baking occurs at 240 to 260 degrees Celsius for approximately 2-3 minutes.

4. A method of making a crispy edible wafer in accordance with claim 1 utilising a dough of 45-50% water content.

5. A method of making a crispy edible wafer in accordance with claim 1 wherein the baking time and temperature are such as to result in a baked, crispy wafer that has a water content of 2-5%..