AU2015339759A1 - Heat sink for use with pumped coolant - Google Patents
Heat sink for use with pumped coolant Download PDFInfo
- Publication number
- AU2015339759A1 AU2015339759A1 AU2015339759A AU2015339759A AU2015339759A1 AU 2015339759 A1 AU2015339759 A1 AU 2015339759A1 AU 2015339759 A AU2015339759 A AU 2015339759A AU 2015339759 A AU2015339759 A AU 2015339759A AU 2015339759 A1 AU2015339759 A1 AU 2015339759A1
- Authority
- AU
- Australia
- Prior art keywords
- heat sink
- coolant
- sink module
- heat
- flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462069301P | 2014-10-27 | 2014-10-27 | |
US62/069,301 | 2014-10-27 | ||
US201462072421P | 2014-10-29 | 2014-10-29 | |
US62/072,421 | 2014-10-29 | ||
US201562099200P | 2015-01-01 | 2015-01-01 | |
US62/099,200 | 2015-01-01 | ||
US14/623,524 | 2015-02-17 | ||
US14/623,524 US9901008B2 (en) | 2014-10-27 | 2015-02-17 | Redundant heat sink module |
US14/705,972 US20150237767A1 (en) | 2011-06-27 | 2015-05-07 | Heat sink for use with pumped coolant |
US14/705,972 | 2015-05-07 | ||
PCT/US2015/056129 WO2016069299A1 (fr) | 2014-10-27 | 2015-10-18 | Dissipateur thermique destiné à être utilisé avec un liquide de refroidissement pompé |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2015339759A1 true AU2015339759A1 (en) | 2017-06-15 |
Family
ID=55858180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2015339759A Abandoned AU2015339759A1 (en) | 2014-10-27 | 2015-10-18 | Heat sink for use with pumped coolant |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2015339759A1 (fr) |
WO (1) | WO2016069299A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT202100004793A1 (it) * | 2021-03-02 | 2022-09-02 | Wieland Provides SRL | Scambiatore di calore a microcanali |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106684495A (zh) * | 2016-08-29 | 2017-05-17 | 华霆(合肥)动力技术有限公司 | 液冷管接头、液冷管及液冷装置 |
CN107181016A (zh) * | 2017-01-05 | 2017-09-19 | 福建猛狮新能源科技有限公司 | 一种用于电池的雾化油热交换设备和热交换方法 |
GB2576030B (en) | 2018-08-02 | 2021-12-29 | Provost Fellows Found Scholars & Other Members Board College Holy & Und | Liquid-based heat exchanger |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6222264B1 (en) * | 1999-10-15 | 2001-04-24 | Dell Usa, L.P. | Cooling apparatus for an electronic package |
US6981542B2 (en) * | 2003-10-29 | 2006-01-03 | Rotys Inc. | Multi-heatsink integrated cooler |
TW201204994A (en) * | 2010-07-30 | 2012-02-01 | Microbase Technology Corp | Lighting device, cooling/heat dissipating system and its cooling module |
US9848509B2 (en) * | 2011-06-27 | 2017-12-19 | Ebullient, Inc. | Heat sink module |
US9901013B2 (en) * | 2011-06-27 | 2018-02-20 | Ebullient, Inc. | Method of cooling series-connected heat sink modules |
US20120325436A1 (en) * | 2011-06-27 | 2012-12-27 | Shedd Timothy A | High efficiency thermal management system |
US20140076523A1 (en) * | 2012-09-19 | 2014-03-20 | Aaron Ray Batker Pritzker | Devices, systems, and methods for cooling electronic device heat spreaders |
US9484283B2 (en) * | 2013-01-04 | 2016-11-01 | Toyota Motor Engineering & Manufacturing North America Inc. | Modular jet impingement cooling apparatuses with exchangeable jet plates |
-
2015
- 2015-10-18 WO PCT/US2015/056129 patent/WO2016069299A1/fr active Application Filing
- 2015-10-18 AU AU2015339759A patent/AU2015339759A1/en not_active Abandoned
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT202100004793A1 (it) * | 2021-03-02 | 2022-09-02 | Wieland Provides SRL | Scambiatore di calore a microcanali |
WO2022185177A1 (fr) * | 2021-03-02 | 2022-09-09 | Wieland Provides S.R.L. | Échangeur de chaleur à microcanaux |
Also Published As
Publication number | Publication date |
---|---|
WO2016069299A1 (fr) | 2016-05-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK1 | Application lapsed section 142(2)(a) - no request for examination in relevant period |