AU2015202412B2 - Telecommunications jack with crosstalk multi-zone crosstalk compensation and method for designing - Google Patents

Abstract

H:\tld\Intrwovn\NRPortbl\DCC\TLD\7739460_I.docx-30/04/2015 The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to 5 make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

Description

-1 - 2015202412 10 Feb 2017

TELECOMMUNICATIONS JACK WITH CROSSTALK MULTI-ZONE CROSSTALK COMPENSATION AND METHOD FOR DESIGNING

Cross-reference to Related Applications 5

This application is being filed on 10 April 2007, as a PCT International Patent application in the name of ADC Telecommunications, Inc., a U.S. national corporation, applicant for the designation of all countries except the US, and Bernard Hammond, Jr., a citizen of the U.S., and David P. Murray and Ian R. George, citizens of the United Kingdom, applicants 10 for the designation of the US only, and claims priority to U.S. Utility Patent Application Serial No. 11/402,544, filed April 11, 2006.

The disclosure of the complete specification of Australian Patent Application No. 2007238780, as originally filed and accepted, is incorporated herein by reference. The 15 disclosure of the complete specification of Australian Patent Application No. 2011226922, as originally filed and as amended, is incorporated herein by reference.

Field of the Invention 20 The present invention relates to a telecommunications device; and a telecommunications device adapted to receive a plug, the telecommunications device having a compensation arrangement that compensates for cross talk generated at the plug. For example, the invention relates generally to telecommunications equipment. More particularly, the present invention relates to telecommunications jacks that are configured to compensate 25 for near end crosstalk.

Background of the Invention

In the field of data communications, communications networks typically utilize techniques 30 designed to maintain or improve the integrity of signals being transmitted via the network ("transmission signals"). To protect signal integrity, the communications networks should, at a minimum, satisfy compliance standards that are established by standards committees, such as the Institute of Electrical and Electronics Engineers (IEEE). The compliance -2- 2015202412 10 Feb 2017 standards help network designers provide communications networks that achieve at least minimum levels of signal integrity as well as some standard of compatibility.

One prevalent type of communication system uses twisted pairs of wires to transmit 5 signals. In twisted pair systems, information such as video, audio and data are transmitted in the form of balanced signals over a pair of wires. The transmitted signal is defined by the voltage difference between the wires.

Crosstalk can negatively affect signal integrity in twisted pair systems. Crosstalk is 10 unbalanced noise caused by capacitive and/or inductive coupling between wires and a twisted pair system. The effects of crosstalk become more difficult to address with increased signal frequency ranges.

The effects of crosstalk also increase when transmission signals are positioned closer to 15 one another. Consequently, communications networks include areas that are especially susceptible to crosstalk because of the proximity of the transmission signals. In particular, communications networks include connectors that bring transmission signals in close proximity to one another. For example, the contacts of traditional connectors (e.g., jacks and plugs) used to provide interconnections in twisted pair telecommunications systems 20 are particularly susceptible to crosstalk interference.

Figure 1 shows a prior art panel 20 adapted for use with a twisted pair telecommunications system. The panel 20 includes a plurality of jacks 22. Each jack 22 includes a port 24 adapted to receive a standard telecommunications plug 26. Each of the jacks 22 is adapted 25 to be terminated to four twisted pairs of transmission wires. As shown at Figure 2, each of the jacks 22 includes eight contact springs labeled as having positions 1-8. In use, contact springs 4 and 5 are connected to a first pair of wires, the contact springs 1 and 2 are connected to a second pair of wires, contact springs 3 and 6 are connected to a third pair of wires, and contact springs 7 and 8 are connected to a fourth pair of wires. As shown at 30 Figure 3, a typical plug 26 also has eight contacts (labeled 1-8) adapted to interconnect with the corresponding eight contacts of the jack 22 when the plug is inserted within the port 24. 2015202412 10 Feb 2017 -3-

To promote circuit density, the contacts of the jacks and the plugs are required to be positioned in fairly close proximity to one another. Thus, the contact regions of the jacks and plugs are particularly susceptible to crosstalk. Furthermore, certain pairs of contacts 5 are more susceptible to crosstalk than others. For example, the first and third pairs of contacts in the plugs and jacks are typically most susceptible to crosstalk.

To address the problems of crosstalk, jacks have been designed with contact spring configurations adapted to reduce the capacitive coupling generated between the contact 10 springs so that crosstalk is minimized. An alternative approach involves intentionally generating crosstalk having a magnitude and phase designed to compensate for or correct crosstalk caused at the plug or jack. Typically, crosstalk compensation can be provided by manipulating the positioning of the contacts or leads of the jack or can be provided on a circuit board used to electrically connect the contact springs of the jack to insulation 15 displacement connectors of the jack.

The telecommunications industry is constantly striving toward larger signal frequency ranges. As transmission frequency ranges widen, crosstalk becomes more problematic. Thus, there is a need for further development relating to crosstalk remediation. 20

It is generally desirable to overcome or ameliorate one or more of the above described difficulties, or to at least provide a useful alternative.

Summary of the Invention 25

According to the present invention, there is provided a telecommunications device comprising: a housing defining a port for receiving a plug; a plurality of contact springs adapted to make electrical contact with the plug when 30 the plug is inserted into the port of the housing; a plurality of wire termination contacts for terminating wires to the device; -4- 2015202412 10 Feb 2017 a circuit board that electrically connects the contact springs to the wire termination contacts, the circuit board including first and second conductive layers separated by a dielectric layer; and the first and second conductive layers including a cross talk compensation 5 arrangement including first and second capacitor plates for providing a capacitive coupling, the first and second capacitor plates opposing one another and being separated by the dielectric layer, the first capacitor plate being larger than the second capacitor plate, the second capacitor plate further including a trimmable stub extending from the second capacitor plate and opposing the first capacitor plate; 10 wherein the first and second capacitor plates are relatively sized to reduce registration requirements.

According to the present invention, there is also provided a telecommunications device adapted to receive a plug, the telecommunications device having a compensation 15 arrangement that compensates for cross talk generated at the plug, the telecommunications device comprising: a housing defining a port for receiving the plug; first, second, third, fourth, fifth, sixth, seventh and eighth consecutively arranged contact springs adapted to make electrical contact with the plug when the plug is inserted 20 into the port of the housing; first, second, third, fourth, fifth, sixth, seventh and eighth wire termination contacts for terminating wires to the device; a circuit board including first, second, third, fourth, fifth, sixth, seventh and eighth conductive paths that respectively electrically connect the first, second, third, fourth, fifth, 25 sixth, seventh and eighth contact springs to the first, second, third, fourth, fifth, sixth, seventh and eighth wire termination contacts; and a cross talk compensation on the circuit board including first and second capacitor plates for providing a capacitive coupling between two of the conductive paths, the first and second capacitor plates opposing one another and being separated by a dielectric layer 30 of the circuit board, the first capacitor plate being larger than the second capacitor plate, the second capacitor plate further including a trimmable stub extending from the second capacitor plate and opposing the first capacitor plate; -5- 2015202412 10 Feb 2017 wherein the first and second capacitor plates are relatively sized to reduce registration requirements.

According to the present invention, there is also provided a telecommunications device 5 adapted to receive a plug, the telecommunications device having a compensation arrangement that compensates for cross talk generated at the plug, the telecommunications device comprising: a housing defining a port for receiving the plug; first, second, third, fourth, fifth, sixth, seventh and eighth consecutively arranged 10 contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing; first, second, third, fourth, fifth, sixth, seventh and eighth wire termination contacts for terminating wires to the device; a circuit board including first, second, third, fourth, fifth, sixth, seventh and eighth 15 conductive tracings that respectively electrically connect the first, second, third, fourth, fifth, sixth, seventh and eighth contact springs to the first, second, third, fourth, fifth, sixth, seventh and eighth wire termination contacts; and a cross talk compensation arrangement on the circuit board including first and second rectangular capacitor plates for providing a capacitive coupling between two of the 20 conductive tracings, the first and second rectangular capacitor plates opposing one another and being separated by a dielectric layer of the circuit board, the first rectangular capacitor plate being larger than the second rectangular capacitor plate so that portions of the first rectangular capacitor plate extend outwardly beyond boundaries of the second rectangular capacitor plate on all sides of the second rectangular capacitor plate, the second capacitor 25 plate further including a trimmable stub extending from the second capacitor plate and opposing the first capacitor plate.

According to the present invention, there is also provided a telecommunications device adapted to receive a plug, the telecommunications device having a compensation 30 arrangement that compensates for cross talk generated at the plug, the telecommunications device comprising: a housing defining a port for receiving the plug; -6- 2015202412 10 Feb 2017 first, second, third, fourth, fifth, sixth, seventh and eighth consecutively arranged contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing; first, second, third, fourth, fifth, sixth, seventh and eighth wire termination contacts 5 for terminating wires to the device; a circuit board including first, second, third, fourth, fifth, sixth, seventh and eighth conductive tracings that respectively electrically connect the first, second, third, fourth, fifth, sixth, seventh and eighth contact springs to the first, second, third, fourth, fifth, sixth, seventh and eighth wire termination contacts; and 10 a cross talk compensation arrangement including first and second capacitor plates for providing a capacitive coupling between two of the conductive tracings, the first and second capacitor plates opposing one another and being separated by a dielectric layer of the circuit board, the dielectric layer having a thickness less than .01 inches, the first capacitor plate being larger than the second capacitor plate, the second capacitor plate 15 having an external boundary that is inwardly offset from an external boundary of the first capacitor plate such that the external boundary of the second capacitor plate is entirely inside the external boundary of the first capacitor plate from a plan view perspective of the circuit board, the second capacitor plate further including a trimmable stub extending from the second capacitor plate and opposing the first capacitor plate. 20

According to the present invention, there is also provided a telecommunications device adapted to receive a plug, the telecommunications device having a compensation arrangement that compensates for cross talk generated at the plug, the telecommunications device comprising: 25 a housing defining a port for receiving the plug; first, second, third, fourth, fifth, sixth, seventh and eighth consecutively arranged contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing; first, second, third, fourth, fifth, sixth, seventh and eighth wire termination contacts 30 for terminating wires to the device; a circuit board including first, second, third, fourth, fifth, sixth, seventh and eighth conductive tracings that respectively electrically connect the first, second, third, fourth, 2015202412 10 Feb 2017 -7- fifth, sixth, seventh and eighth contact springs to the first, second, third, fourth, fifth, sixth, seventh and eighth wire termination contacts; and a cross talk compensation arrangement on the circuit board including: first and second capacitor plates for providing a first capacitive coupling of 5 the cross talk compensation arrangement, the first capacitive coupling being between the third and fifth tracings, the first capacitor plate being larger than the second capacitor plate and an outer boundary of the second capacitor plate being entirely inside an outer boundary of the first capacitor plate the second capacitor plate further including a trimmable stub extending from the second capacitor plate 10 and opposing the first capacitor plate, wherein the first and second capacitor plates are relatively sized to reduce registration requirements; third and fourth capacitor plates for providing a second capacitive coupling of the cross talk compensation arrangement, the second capacitive coupling being between the third and fifth tracings, the third capacitor plate being larger than the 15 fourth capacitor plate and an outer boundary of the fourth capacitor plate being entirely inside an outer boundary of the third capacitor plate; fifth and sixth capacitor plates for providing a third capacitive coupling of the cross talk compensation arrangement, the third capacitive coupling being between the fourth and sixth tracings, the fifth capacitor plate being larger than the 20 sixth capacitor plate and an outer boundary of the sixth capacitor plate being entirely inside an outer boundary of the fifth capacitor plate; and seventh and eighth capacitor plates for providing a fourth capacitive coupling of the cross talk compensation arrangement, the fourth capacitive coupling being between the fourth and sixth tracings, the seventh capacitor plate 25 being larger than the eighth capacitor plate and an outer boundary of the eighth capacitor plate being entirely inside an outer boundary of the seventh capacitor plate.

One preferred embodiment of the present disclosure relates to circuit board layering 30 configurations adapted for supporting the effective compensation of crosstalk in a telecommunications jack. -8- 2015202412 10 Feb 2017

Another preferred embodiment of the present disclosure relates to the use of high impedance lines to compensate for return loss caused by crosstalk compensation arrangements. 5 Still another preferred embodiment of the present disclosure relates to the use of capacitive couplings to overcome return loss issues caused by crosstalk compensation arrangements.

Still another preferred embodiment of the present disclosure relates to crosstalk compensation arrangements and methods for designing crosstalk compensation 10 arrangements. A variety of additional inventive preferred embodiment will be set forth in the description that follows. The inventive aspects can relate to individual features and to combinations of features. It is to be understood that both the foregoing general description and the 15 following detailed description are exemplary and explanatory only and are not restrictive of the broad inventive concepts upon which the embodiments disclosed herein are based.

Brief Description of the Drawings 20 Preferred embodiments of the present invention are hereafter described, by way of nonlimiting example only, with reference to the accompanying drawings, in which:

Figure 1 is a perspective view of a prior art telecommunications panel;

Figure 2 is a schematic illustration of a prior art jack; 25 Figure 3 is a schematic representation of a prior art telecommunications plug;

Figure 4 is a front, perspective view of a telecommunications jack having features that are examples of inventive aspects in accordance with the principles of the present disclosure; Figure 5 is an exploded view of the jack of Figure 4;

Figure 6 is a side view of the circuit board, insulation displacement connectors and contact 30 springs of the telecommunications jack of Figure 4;

Figure 7 is a front view of the circuit board, contact springs and insulation displacement connectors of Figure 6; -9- 2015202412 10 Feb 2017

Figure 8 is a top view of the circuit board and contact springs of Figure 6;

Figure 9 is a cross-sectional view taken along section line 9-9 of Figure 8;

Figure 10 is a schematic diagram showing a crosstalk compensation scheme incorporated into the telecommunications jack of Figure 4; 5 Figure 11 is a schematic diagram showing a compensation arrangement used to provide crosstalk compensation between the 4-5 and 3-6 pairs of the telecommunications jack of Figure 4;

Figure 12 is a schematic vector diagram showing a compensation arrangement used to provide crosstalk compensation between the 1-2 and 3-6 pairs of the telecommunications j 10 ack of Figure 4;

Figure 13 is a graph that depicts how certain factors can affect return loss in the jack of Figure 4 across a range of frequencies;

Figure 14 is a tracing overlay view of the circuit board used in the telecommunications jack of Figure 4; 15 Figure 15 shows a front conductive layer of the circuit board used in the telecommunications jack of Figure 4;

Figure 16 shows a middle conductive layer of the circuit board used in the telecommunications jack of Figure 4; and

Figure 17 is shows a back conductive layer of the circuit board used in the 20 telecommunications jack of Figure 4.

Detailed Description of Preferred Embodiments of the Invention

Figures 4 and 5 show a telecommunications jack 120 (i.e., a telecommunications 25 connector) having features that are examples of inventive aspects in accordance with the principles of the present disclosure. The jack 120 includes a dielectric housing 122 having a front piece 124 and a rear piece 126. The front and rear pieces 124, 126 can be interconnected by a snap fit connection. The front piece 124 defines a front port 128 sized and shaped to receive a conventional telecommunications plug (e.g., an RJ style plug such 30 as an RJ 45 plug). The rear piece 126 defines an insulation displacement connector interface and includes a plurality of towers 130 adapted to house insulation displacement connector blades/contacts. The jack 120 further includes a circuit board 132 that mounts' -10- 2015202412 10 Feb 2017 between the front and rear pieces 124, 126 of the housing 122. A plurality of contact springs CSi-CSg are terminated to a front side of the circuit board 132. A plurality of insulation displacement connector blades IDCi-IDCg are terminated to a back side of the circuit board 132. The contact springs CSi-CSg extend into the front port 128 and arc 5 adapted to be electrically connected to corresponding contacts provided on a plug when the plug is inserted into the front port 128. The insulation displacement connector blades IDCi -IDCg fit within the towers 130 of the rear piece 126 of the housing 122. The circuit board 132 has tracks Ti-Tg (e.g., tracings, see Figures 14-17) that respectively electrically connect the contact springs CSi-CSg to the insulation displacement connector blades IDCi-10 IDCg.

In use, wires are electrically connected to the contact springs CSi-CSg by inserting the wires between pairs of the insulation displacement connector blades IDCi-IDCg. When the wires are inserted between pairs of the insulation displacement connector blades IDCr 15 IDCg, the blades cut through the insulation of the wires and make electrical contact with the center conductors of the wires. In this way, the insulation displacement connector blades IDCi-IDCg, which are electrically connected to the contact springs CSi-CSg by the tracks on the circuit board, provide an efficient means for electrically connecting a twisted pair of wires to the contact springs CSi-CSg of the jack 120. 20

The contact springs CSi-CSg are shown more clearly in Figures 6-8. The relative positioning, shape and curvature of the contact springs CSpCSg is preferably adapted to provide some initial crosstalk compensation at the jack 120. 25 The circuit board 132 of the jack 120 is preferably a multiple layer circuit board. For example, Figure 9 shows the circuit board 132 including a first conductive layer 140, a second conductive layer 142 and a third conductive layer 144. The first and second conductive layers 140, 142 are separated by a first dielectric layer 146. The second and third conductive layers 142, 144 are separated by a second dielectric layer 148. The first 30 conductive layer 140 is located at a front side of the circuit board 132 and the third conductive layer 144 is located at a back side of the circuit board 132. The contact springs CSi-CSg are mounted at the front side of the. circuit board 132, while the insulation -11 - 2015202412 10 Feb 2017 displacement connector blades IDCi-IDCg are mounted at the back side of the circuit board 132. Vias extend through the first and second dielectric layers 146, 148 to provide electrical connections between the conductive layers 140, 142 and 144. The conductive layers 140, 142 and 144 are defined by electrically the conductive tracks Ti-T8 (see Figures 5 14-17). The tracks Ti-Tg are formed (e.g., etched or otherwise provided) on the dielectric layers 146, 148.

The circuit board 132 preferably includes structures for compensating for near end crosstalk that occurs at the jack/plug interface. In certain embodiments, the structures for 10 compensating for near end crosstalk include capacitive couplings provided between the first and second conductive layers 140, 142. In preferred embodiments, the capacitive couplings are provided by sets of opposing, generally parallel capacitive plates located at the first and second conductive layers 140, 142. To increase the magnitude of the capacitive coupling provided between the capacitive plates of the first and second 15 conductive layers 140, 142, it is desirable for the first dielectric layer 146 to be relatively thin. For example, in certain embodiments the first dielectric layer 146 can have a thickness ti less than about .01 inches, or less than about .0075 inches, or less than about .005 inches, or less than .003 inches. In other embodiments, the thickness ti can be in the range of .001 inches to .003 inches or in the range of .001 inches to .005 inches. In a 20 preferred embodiment, the thickness ti is about .002 inches.

In certain embodiments, the first dielectric layer 146 can be made of a material having a relatively low dielectric constant. As used herein, dielectric constants are dielectric constants relative to air. In certain embodiments, the dielectric constant of the first 25 dielectric layer 146 can be equal to or less than about 5. In other embodiments, the dielectric constant of the first dielectric layer 146 can be less than or equal to about 4 or less than or equal to about 3. An example material for manufacturing the first dielectric layer 146 is a flame resistant 4 (FR-4) circuit board material. FR-4 circuit board material is a composite of a resin epoxy reinforced with a woven fiberglass mat. 30

The second dielectric layer 148 is preferably configured to isolate the third conductive layer 144 from the first and second conductive layers 140, 142. The second dielectric layer - 12- 2015202412 10 Feb 2017 148 can have a different thickness t2 than the thickness ti of the first dielectric layer 146. In certain embodiments, the second dielectric layer 148 is at least 2.5 times thicker than the first dielectric layer 146 or at least five times thicker than the first dielectric layer 146. In still other embodiments, the second dielectric layer 148 is at least 10 times or at least 20 5 times thicker than the first dielectric layer 146. In one example embodiment, the thickness t2 of the second dielectric layer 148 is in the range of .050 inches to .055 inches. In another example embodiment, the thickness t2 of the second dielectric layer 148 is in the range of .040 inches to .050 inches. 10 The second dielectric layer 148 can also be manufactured of a different material as compared to the first dielectric layer 146. In certain embodiments, the second dielectric layer can have different dielectric properties as compared to the first dielectric layer 146. For example, in certain embodiments the first dielectric layer 146 can have a dielectric constant that is greater (e.g., at least 1.5 times or at least 2 times greater) than the dielectric 15 constant of the second dielectric layer 148. In one example, the second dielectric layer 148 can be manufactured of a material such as FR-4. Of course, it will be appreciated that other materials could also be used.

The circuit board 132 includes a number of capacitive couplings having magnitudes and 20 locations adapted to compensate for near end crosstalk. Near end crosstalk is most problematic between the 4-5 and 3-6 pairs. To compensate for near end crosstalk between the 4-5 and 3-6 pairs, three interdependent zones of compensation are used between tracks T4.5 and tracks T3-6. As 25 shown at Figure 10, the three interdependent zones of compensation include a first zone of compensation Zai, a second zone of compensation Za2 and a third zone of compensation Za3- The first zone of compensation Zai includes a capacitive coupling Cl between track T3 and track T5, and a capacitive coupling C2 between track T4 and track Te. The second zone of compensation Za2 includes a capacitive coupling C3 between track T3 and track 30 T4, and a capacitive coupling C4 between track T5 and track T(,. The third zone of compensation Za3 includes a capacitive coupling C5 between track T3 and track T5, and a capacitive coupling C6 between track T4 and track Τό· - 13- 2015202412 10 Feb 2017

Figure 11 is a schematic diagram representative of the compensation arrangement used to provide crosstalk compensation between the 4-5 and 3-6 pairs. As shown at Figure 11, the compensation arrangement includes a first vector 100, a second vector 102, a third vector 5 104, and a fourth vector 106. The first vector 100 and the third vector 104 have positive polarities, while the second vector 102 and the fourth vector 106 have negative polarities. The first vector 100 has a magnitude of M and corresponds to crosstalk introduced at the plug. The second vector 102 has a magnitude of -3M and corresponds to crosstalk introduced at the first zone of compensation Zai- The third vector 104 has a magnitude of 10 3M and corresponds to crosstalk introduced at the second zone of compensation Za2· The fourth vector 106 has a magnitude of -M and corresponds to crosstalk introduced at the third zone of compensation Za3- It will be appreciated that each vector is a lump sum of the total crosstalk provided at each respective compensation zone, with the vectors being placed at the centers or midpoints of the compensation zones. 15

In designing the compensation scheme of Figure 11, a number of factors are taken into consideration when determining the placement of the compensation zones. One factor includes the need to accommodate signal travel in both directions (i.e., in forward and reverse directions) through the tracks on the circuit board. To accommodate forward and 20 reverse transmissions through the circuit board, the compensation scheme preferably has a configuration with forward and reverse symmetry. It is also desirable for the compensation scheme to provide optimized compensation over a relatively wide range of transmission frequencies. For example, in one embodiment, performance is optimized for frequencies ranging from 1 MHz to 500 MHz. It is further desirable for the compensation arrangement 25 to take into consideration the phase shifts that occur as a result of the time delays that take place as signals travel between the zones of compensation.

To minimize the effect of phase shift in the compensation arrangement, it is preferred for the second vector 102 to be positioned as close as possible to the first vector 100. In Figure 30 11, the time delay between the first vector 100 and the second vector 102 is shown as x. In one example embodiment, x can be about 100 picoseconds for a signal having a transmission speed of 3X108 meters per second. - 14- 2015202412 10 Feb 2017

To maintain forward and reverse symmetry, it is preferred for the time delay between the third vector 104 and the fourth vector 106 to be approximately the same as the time delay between the first vector 100 and the second vector 102. As shown in Figure 11, the time 5 delay between the third and fourth vectors is depicted as x.

The time delay y between the second vector 102 and the third vector 104 is preferably selected to optimize the overall compensation effect of the compensation scheme over a relatively wide range of frequencies. By varying the time delay y between the second 10 vector 102 and the third vector 104, the phase angles of the first and second compensation zones are varied thereby altering the amount of compensation provided at different frequencies. In one example embodiment, to design the time delay y, the time delay y is initially set with a value generally equal to x (i.e., the time delay between the first vector 102 and the second vector 104). The system is then tested or simulated to determine if an 15 acceptable level of compensation is provided across the entire signal frequency range intended to be used. If the system meets the crosstalk requirements with the value y set equal to x, then no further adjustment of the value y is needed. If the compensation scheme fails the crosstalk requirements at higher frequencies, the time delay y can be shortened to improve performance at higher frequencies. If the compensation scheme fails the crosstalk 20 requirements at lower frequencies, the time delay y can be increased to improve crosstalk performance for lower frequencies. It will be appreciated that the time delay y can be varied without altering forward and reverse symmetry.

It has been determined that when magnitudes of the second and third vectors 102, 104 are 25 respectively -3M and 3M , the distance y is preferably greater than the distance x to provide optimized crosstalk compensation. However, if the magnitudes of the vectors 102, 104 are reduced below -3M and 3M(e.g., to -2.7M and 2.7M), the distance y is preferably less than the distance x to provide optimized crosstalk compensation. 30 Crosstalk can also be an issue between the 1-2 and 3-6 pairs. Particularly, substantial crosstalk can be generated between track T2 and track T3. As shown at Figure 10, a two-zone compensation arrangement is used to compensate for this crosstalk. The two-zone - 15- 2015202412 10 Feb 2017 compensation arrangement includes a first zone of compensation ZBi and a second zone of compensation ZB2- The first zone of compensation ZBi includes a capacitive coupling C7 between track Ti and track T3, and a capacitive coupling C8 between track T2 and track T5. The second zone of compensation ZB2 includes a capacitive coupling C9 between track T1 5 and track T6. Figure 12 is a schematic vector diagram showing the compensation arrangement used between the 1-2 and 3-6 pairs. As shown at Figure 12, three crosstalk vectors are taken into consideration. The first crosstalk vector 110 is representative of crosstalk generated at the plug. A second vector 112 is representative of crosstalk provided at the first compensation zone ZBi. The third vector 114 is representative of crosstalk 10 generated at the second compensation zone ZB2. The first and third vectors 110, 114 have positive polarities and magnitudes of about N. The second vector 112 has a negative polarity and a vector about 2N. In testing the compensation arrangement provided between tracks 1-2 and 3-6, it was determined that improved results were obtained when no discrete capacitive coupling was provided between the track T2 and track T3 at the second zone of 15 compensation ZB2- However, in alternative embodiments, a discrete capacitive coupling can also be provided between track T2 and track T3 to maintain symmetry. It will be appreciated that M (shown at Figure 11) is typically substantially greater in magnitude than N (shown at Figure 12). 20 A two-zone compensation arrangement can be also be used to provide crosstalk compensation between the 4-5 and 7-8 pairs. For example, Figure 10 depicts a first zone of compensation Zci and a second zone of compensation Zc2 providing compensation between the 4-5 and 7-8 pairs. The first zone of compensation Zci includes a capacitive coupling CIO between track Τχ and track T5. The second zone of compensation Zc2 25 includes a capacitive coupling Cl 1 between tracks 8 and 4. The first and second zones of compensation Zci and Zc2 can have a 1-2-1 magnitude sequence similar to the two-zone compensation arrangement described with respect to tracks 1-2 and 3-6.

In addition to the multiple zone compensation arrangements described above, a number of 30 single zone compensations can also be used. For example, zone Zpi is a single zone compensation including a capacitive coupling C12 provided between track T2 and track T5. Another single zone compensation ZBi is provided by a capacitive coupling C13 formed - 16- 2015202412 10 Feb 2017 between track Ύβ and track Tg. Another capacitive coupling C14 between track T5 and track Τό compensates for unintended crosstalk generated within the board itself.

To address the crosstalk issue between the 4-5 and 3-6 pairs, a relatively large amount of 5 capacitance is used. This large amount of capacitance can cause the jack to have unacceptable levels of return loss. A number of methods can be used to improve return loss performance. For example, return loss performance can be improved by increasing the impedance of tracks T3, T4, T5 and T6 of the board. The impedance of the tracks is preferably increased through the first, second and third zones of compensation, and also 10 after the first, second, and third zones of compensation. The impedance can be increased by minimizing the transverse cross sectional area of tracks T3, T4, T5 and Ύβ· An example transverse cross-sectional area of the tracks is in the range of 13 to 16 square mils (1 mil =.001 inches). The impedance can also increase by routing the tracks so as to maintain a relatively large spacing between tracks T3 and T4 and between tracks T5 and T(,. In one 15 embodiment, the impedance of the tracks T3-T6 is greater than 100 Ohms. In another embodiment, the impedance is equal to or greater than 120 Ohms. In still another embodiment, the impedance of the tracks T3-T6 is equal to or greater than 150 Ohms. In still a further embodiment, the impedance of the tracks T3-Te is equal to or greater than 175 Ohms. In a further embodiment, the impedance of the tracks T3-T6 is equal to or 20 greater than 200 Ohms.

The impedance of tracks T3-T6 can also be increased by increasing the lengths of the tracks T3-T6 provided between the springs CS3-CS6 and the insulation displacement connectors IDC3-IDC6. In certain embodiments, this increased length can be provided by using 25 serpentine or loop back routing configurations for the tracks T3-T6. In lengthening the tracks T3-T6 provided between contact springs CS3-CS6 and their corresponding insulation displacement connector blades IDC3-IDC6, in certain embodiments, the tracks T3-T6 can be lengthened to be at least one and a half times or at least two times as long as the straight line distance between the springs CS3-CS6 and their corresponding insulation displacement 30 connector blades IDC3-IDC6. In other embodiments, the tracks T3-T6 can be at least three or four times as long as the straight line distances between the contact springs CS3-CS6 and their corresponding insulation displacement connector blades IDC3-IDC6· - 17- 2015202412 10 Feb 2017

The impedance of the tracks T3-T6 can also be increased by increasing/maximizing the spacing between track T4 and track T5, and between track T3 and track Τό· In one embodiment, the tracks T4 and T5 diverge from one another as the tracks T4 and T5 extend 5 away from the contact springs CS4 and CS5, and then converge again as the tracks T4 and T5 approach the insulation displacement connector blades IDC4 and IDC5. Thus, mid regions of the tracks T4 and T5 are spaced relatively far away from one another. In one embodiment, a spacing of at least 0.1 .inches, measured in a direction parallel to a width W of the circuit board, is defined between portions of the tracks T4 and T5. In certain 10 embodiments, this spacing represents at least 1/4 of the width of the circuit board. It will be appreciated that similar spacings can be used between the track T3 and the track Τό to increase impedance.

Referring still to Figure 10, return loss can also be improved by providing a capacitive 15 coupling C15 between track T3 and track T6, and a capacitive coupling C16 between track T4 and track T5. For the capacitive coupling C15 and C16 to improve and not worsen return loss, the couplings C15, C16 should be placed far enough away from the center of the three zones of compensation Zai-Za3 so that the phase of the capacitance introduced by the couplings C15 and C16 cancels return loss along the tracks T3-T6 at higher frequencies. 20

Figure 13 is a graph that depicts how different factors can affect return loss in the jack across a range of frequencies. In the graph, return loss is plotted on the y axis and frequency is plotted on the x axis. Line 400 represents the maximum permissible return loss across the range of frequencies. Line 402 represents the return loss present in tracks 25 T3-T6 if standard 100 Ohm tracks of standard length are used to provide electrical pathways between the contact springs and the insulation displacement connector blades. Line 404 shows the return loss present in the tracks if the tracks of standard length are converted to high impedance lines. As shown by line 404, the return loss is improved as compared to line 402, but still does not comply with the level of return loss set by line 400. 30 Line 406 shows the return loss in the tracks if the high impedance tracks are extended in length between the contact springs and the insulation displacement connector blades. As shown by line 406, the lengthened, high impedance tracks greatly improve return loss at 2015202412 10 Feb 2017 -18- lower frequencies, but worsen return loss at higher frequencies (e.g., frequencies greater than 300 MHz). Lines 408A, 408B and 408C show the effects of adding capacitive couplings C15, C16 between track T3 and track T6 and between track T4 and track T5 in combination with using relatively long, high impedance tracks between the contact springs 5 CS3-CS6 and the insulation displacement connector blades IDC3-IDC6. To comply with the return loss levels set by line 400, the distance the capacitive couplings are placed from the center of the zones of compensation Zai-Za3 is significant. If the capacitive couplings Cl5, C16 are too close to the capacitive couplings of the zones of compensation Zai-Za3, the return loss will fail at low frequencies (as shown by line 408A). If the capacitive couplings 10 C15, C16 are positioned too far from the zones of compensation ΖΑ|-ΖΑ3, return loss failure will occur at higher frequencies as shown by line 408C. By selecting the distance of the capacitive couplings C15, C16 from the zones of compensation Zai-Za3 such that the capacitive couplings C15, C16 effectively cancel return loss for frequencies in the range of 200-500 Mhz, the jack can meet the return loss parameters set by line 400 over the entire 15 frequency range as shown by line 408B.

Figures 14-17 show an example circuit board layout for implementing the compensation arrangement of Figure 10. Figures 15-17 respectively show the front, middle and back conductive layers 140, 142 and 144 of the circuit board 132. Figure 14 is an overlay of the 20 three conductive layers 140, 142 and 144. The circuit board 132 defines openings 301-308 that respectively receive posts of the contact springs CSi-CSg so that the contact springs CSi-CSg are terminated to the board 132. The circuit board also defines openings 401-408 for respectively receiving posts of the insulation displacement connector blades IDCi-IDCg such that the insulation displacement connector blades IDCi-IDCg are terminated to the 25 circuit board. Vias extend through the circuit board for electrically interconnecting the tracks between the layers 140, 142 and 144. For example, vias V6a, V6b and V6c interconnect the portions of the track T6 located at the different layers 140, 142 and 144. Also, vias V5A and Vsb interconnect the portions of the track T5 located at the different layers 140, 142 and 144. Moreover, vias V4a and V4b interconnect the portions of the track 30 T4 located at the different layers 140, 142 and 144. Additionally, via V3 interconnects the portions of the track T3 located at the different layers 140, 142 and 144. The tracks Τι, T2, - 19- 2015202412 10 Feb 2017 T7 and T= are each provided on a single layer of the board 132. For example, tracks Ti and T2 are provided at layer 140 and tracks T7 and Tg are provided at layer 144.

Referring to Figures 14-16, the capacitive coupling Cl of the first zone of compensation 5 ZAi is provided by opposing capacitor plates CI5 and CI3 respectively provided at layers 140 and 142. The capacitive coupling C2 of the first zone of compensation Zai is provided by opposing capacitor plates C24 and C26 that are respectively provided at the layers 140 and 142. The capacitive coupling C3 of the second compensation zone Za2 is provided by opposing capacitor plates C34 and C33 that are respectively provided at layers 140 and 142. 10 The capacitive coupling C4 of the second compensation zone Za2 is provided by opposing capacitor plates C4s and CAe that are respectively provided at layers 140 and 142. The capacitive coupling C5 of the third compensation zone Za3 is provided by opposing capacitor plates C5sa and C53a that are respectively provided at layers 140 and 142. The capacitive coupling C5 is also provided by inter-digitated capacitor fingers C5sb and C53b 15 that are provided at layer 144. The capacitive coupling C6 of the second compensation zone Za3 is provided by opposing capacitor plates C06A and C64A respectively provided at layers 140 and 142. The capacitive coupling C6 is also provided by inter-digitated capacitor fingers C06b and C64B provided at layer 144. 20 The capacitive coupling C7 of the first compensation zone ZBi is provided by opposing capacitor plates Cl\ and C73 that are respectively provided at layers 140 and 142 of the circuit board. The capacitive coupling C8 of the first compensation zone ZBi is provided by opposing capacitor plates C82 and C86 that are respectively provided at the layers 140 and 142 of the circuit board. The capacitive coupling C9 of the second zone of compensation 25 ZB2 is provided by inter-digitated capacitor fingers C9i and C96 that are provided at layer 140 of the circuit board.

The capacitive coupling CIO of the first compensation zone Zci is provided by opposing capacitor plates CIO5 and C10g that are respectively provided at layers 140 and 142 of the 30 circuit board. The capacitive coupling Cll of the second compensation zone Zc2 is provided by inter-digitated capacitor fingers CII4 and Cllg that are provided at layer 144 of the circuit board. -20- 2015202412 10 Feb 2017

The capacitive coupling C12 of the zone of compensation Zdi is provided by inter-digitated capacitor fingers 022 and C12s provided at layer 140 of the circuit board. The capacitive coupling C13 of the zone of compensation ZEi is provided by parallel capacitor 5 fingers C13g and 03ό provided at layer 144 of the circuit board. The capacitive coupling 04 is provided by inter-digitated capacitor fingers C14s and 046 that are provided at layer 144 of the circuit board. The capacitive coupling 05 is provided by opposing capacitor plates 053 and 05ό that arc respectively provided at layers 140 and 142 of the circuit board. The capacitive couplings 06 is provided by opposing capacitor plates Ο64 10 and Ο65 that are respectively provided at layers 140 and 142 of the circuit board.

Referring still to Figures 14-17, it is noted that the tracks T4 and T5 are routed away from one another for a majority of their lengths so as to increase the impedance of the tracks to address return loss. Similarly, tracks T3 and T6 are routed away from one another for a 15 majority of their lengths to also increase impedance in the tracks to address return loss. It is also noted that tracks T3-T6 also preferably have extended lengths to increase impedance for improving return loss performance. For example, referring to Figure 14, track T3 loops up and around as it extends from contact spring CS3 to its corresponding insulation displacement connector blade IDC3. Track T3 also includes a loop back 900 for further 20 increasing the length of the track T3. Still referring to Figure 14, track T4 loops over, up and around as it extends from contact spring CS4 to its corresponding insulation displacement connector blade IDC4. Referring further to Figure 14, track T5 loops up and over as it extends from contact spring CS5 to its corresponding insulation displacement connector blades IDC5. Additionally, track T5 has a loop back 902 for further increasing 25 the length of the track. Referring once again to Figure 14, track Te extends over up and around as it extends from contact spring CSe to its corresponding insulation displacement connector blade IDC6.

Referring still to Figure 14, the routing configuration of the tracks on the circuit board are 30 also adapted for positioning the capacitive couplings C15 and C16 relatively far from the center of the capacitive provided by the three zones of compensation Zai-Za3. For example, to provide this extra distance, loop extension portions 904 and 906 are provided 2015202412 10 Feb 2017 -21 - with multiple loop backs for increasing the spacings of the capacitive couplings C15, C16 from the center of the capacitance provided by the zones of compensation Zai-Za3. The circuit board is also provided with structures adapted for promoting manufacturing efficiency. For example, each set of opposing plate capacitors has a first plate that is larger 5 than the corresponding second plate so that portions of the first plate extend outwardly beyond the boundaries of the second plate. This facilitates manufacturing efficiency because the exact registration between the plates is not required. Additionally, some of the plates are provided with stubs 910 that can be laser trimmed to exactly tune the capacitance so that the jack satisfies the relevant crosstalk requirements. The capacitance can also be 10 tuned by using a combination of capacitor plates and parallel capacitor fingers at one zone of compensation. Furthermore, some of the tracks are provided with stubs 912 that can be used during design of the circuit board to manually vary the lengths of the tracks. In this way, the effect of varying certain track lengths can be empirically assessed. 15 The above specification provides examples of how certain inventive aspects may be put into practice. It will be appreciated that the inventive aspects can be practiced in other ways than those specifically shown and described herein without departing from the spirit and scope of the inventive aspects. 20 Throughout this specification and the claims which follow, unless the context requires otherwise, the word “comprise”, and variations such as “comprises” and “comprising”, will be understood to imply the inclusion of a stated integer or step or group of integers or steps but not the exclusion of any other integer or step or group of integers or steps. 25 The reference in this specification to any prior publication (or information derived from it), or to any matter which is known, is not, and should not be taken as an acknowledgment or admission or any form of suggestion that that prior publication (or information derived from it) or known matter forms part of the common general knowledge in the field of endeavour to which this specification relates. 30

Claims (22)

1. THE CLAIMS DEFINING THE INVENTION ARE AS FOLLOWS:

   1. A telecommunications device comprising: a housing defining a port for receiving a plug; a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing; a plurality of wire termination contacts for terminating wires to the device; a circuit board that electrically connects the contact springs to the wire termination contacts, the circuit board including first and second conductive layers separated by a dielectric layer; and the first and second conductive layers including a cross talk compensation arrangement including first and second capacitor plates for providing a capacitive coupling, the first and second capacitor plates opposing one another and being separated by the dielectric layer, the first capacitor plate being larger than the second capacitor plate, the second capacitor plate further including a trimmable stub extending from the second capacitor plate and opposing the first capacitor plate; wherein the first and second capacitor plates are relatively sized to reduce registration requirements.
2. 2. The telecommunications device of claim 1, wherein the dielectric layer has a thickness less than .01 inches.
3. 3. The telecommunications device of claim 1, wherein the dielectric layer has a thickness less than .0075 inches.
4. 4. The telecommunications device of claim 1, wherein the dielectric layer has a thickness less than .005 inches.
5. 5. The telecommunications device of claim 1, wherein the dielectric layer has a thickness less than .003 inches.
6. 6. The telecommunications device of claim 1, wherein the first capacitor plate extends beyond the second capacitor plate on all sides.
7. 7. The telecommunications device of claim 6, wherein the first and second capacitor plates are rectangular.
8. 8. A telecommunications device adapted to receive a plug, the telecommunications device having a compensation arrangement that compensates for cross talk generated at the plug, the telecommunications device comprising: a housing defining a port for receiving the plug; first, second, third, fourth, fifth, sixth, seventh and eighth consecutively arranged contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing; first, second, third, fourth, fifth, sixth, seventh and eighth wire termination contacts for terminating wires to the device; a circuit board including first, second, third, fourth, fifth, sixth, seventh and eighth conductive paths that respectively electrically connect the first, second, third, fourth, fifth, sixth, seventh and eighth contact springs to the first, second, third, fourth, fifth, sixth, seventh and eighth wire termination contacts; and a cross talk compensation on the circuit board including first and second capacitor plates for providing a capacitive coupling between two of the conductive paths, the first and second capacitor plates opposing one another and being separated by a dielectric layer of the circuit board, the first capacitor plate being larger than the second capacitor plate, the second capacitor plate further including a trimmable stub extending from the second capacitor plate and opposing the first capacitor plate; wherein the first and second capacitor plates are relatively sized to reduce registration requirements.
9. 9. The telecommunications device of claim 8, wherein the dielectric layer has a thickness less than .0075 inches.
10. 10. The telecommunications device of claim 8, wherein the dielectric layer has a thickness less than .005 inches.
11. 11. The telecommunications device of claim 8, wherein the dielectric layer has a thickness less than .003 inches.
12. 12. The telecommunications device of claim 8, wherein the first capacitor plate extends beyond the second capacitor plate on all sides.
13. 13. The telecommunications device of claim 12, wherein the first and second capacitor plates are rectangular.
14. 14. The telecommunications device of claim 8, wherein the capacitive coupling is between the third and fifth conductive paths.
15. 15. The telecommunications device of claim 8, wherein the capacitive coupling is between the fourth and sixth conductive paths.
16. 16. The telecommunications device of claim 8, wherein the capacitive coupling is between the fifth and sixth conductive paths.
17. 17. The telecommunications device of claim 8, wherein the capacitive coupling is between the first and third conductive paths.
18. 18. The telecommunications device of claim 8, wherein the capacitive coupling is between the fourth and fifth conductive paths.
19. 19. The telecommunications device of claim 8, wherein the capacitive coupling is between the third and sixth conductive paths.
20. 20. A telecommunications device adapted to receive a plug, the telecommunications device having a compensation arrangement that compensates for cross talk generated at the plug, the telecommunications device comprising: a housing defining a port for receiving the plug; first, second, third, fourth, fifth, sixth, seventh and eighth consecutively arranged contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing; first, second, third, fourth, fifth, sixth, seventh and eighth wire termination contacts for terminating wires to the device; a circuit board including first, second, third, fourth, fifth, sixth, seventh and eighth conductive tracings that respectively electrically connect the first, second, third, fourth, fifth, sixth, seventh and eighth contact springs to the first, second, third, fourth, fifth, sixth, seventh and eighth wire termination contacts; and a cross talk compensation arrangement on the circuit board including first and second rectangular capacitor plates for providing a capacitive coupling between two of the conductive tracings, the first and second rectangular capacitor plates opposing one another and being separated by a dielectric layer of the circuit board, the first rectangular capacitor plate being larger than the second rectangular capacitor plate so that portions of the first rectangular capacitor plate extend outwardly beyond boundaries of the second rectangular capacitor plate on all sides of the second rectangular capacitor plate, the second capacitor plate further including a trimmable stub extending from the second capacitor plate and opposing the first capacitor plate.
21. 21. A telecommunications device adapted to receive a plug, the telecommunications device having a compensation arrangement that compensates for cross talk generated at the plug, the telecommunications device comprising: a housing defining a port for receiving the plug; first, second, third, fourth, fifth, sixth, seventh and eighth consecutively arranged contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing; first, second, third, fourth, fifth, sixth, seventh and eighth wire termination contacts for terminating wires to the device; a circuit board including first, second, third, fourth, fifth, sixth, seventh and eighth conductive tracings that respectively electrically connect the first, second, third, fourth, fifth, sixth, seventh and eighth contact springs to the first, second, third, fourth, fifth, sixth, seventh and eighth wire termination contacts; and a cross talk compensation arrangement including first and second capacitor plates for providing a capacitive coupling between two of the conductive tracings, the first and second capacitor plates opposing one another and being separated by a dielectric layer of the circuit board, the dielectric layer having a thickness less than .01 inches, the first capacitor plate being larger than the second capacitor plate, the second capacitor plate having an external boundary that is inwardly offset from an external boundary of the first capacitor plate such that the external boundary of the second capacitor plate is entirely inside the external boundary of the first capacitor plate from a plan view perspective of the circuit board, the second capacitor plate further including a trimmable stub extending from the second capacitor plate and opposing the first capacitor plate.
22. 22. A telecommunications device adapted to receive a plug, the telecommunications device having a compensation arrangement that compensates for cross talk generated at the plug, the telecommunications device comprising: a housing defining a port for receiving the plug; first, second, third, fourth, fifth, sixth, seventh and eighth consecutively arranged contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing; first, second, third, fourth, fifth, sixth, seventh and eighth wire termination contacts for terminating wires to the device; a circuit board including first, second, third, fourth, fifth, sixth, seventh and eighth conductive tracings that respectively electrically connect the first, second, third, fourth, fifth, sixth, seventh and eighth contact springs to the first, second, third, fourth, fifth, sixth, seventh and eighth wire termination contacts; and a cross talk compensation arrangement on the circuit board including: first and second capacitor plates for providing a first capacitive coupling of the cross talk compensation arrangement, the first capacitive coupling being between the third and fifth tracings, the first capacitor plate being larger than the second capacitor plate and an outer boundary of the second capacitor plate being entirely inside an outer boundary of the first capacitor plate the second capacitor plate further including a trimmable stub extending from the second capacitor plate and opposing the first capacitor plate, wherein the first and second capacitor plates are relatively sized to reduce registration requirements; third and fourth capacitor plates for providing a second capacitive coupling of the cross talk compensation arrangement, the second capacitive coupling being between the third and fifth tracings, the third capacitor plate being larger than the fourth capacitor plate and an outer boundary of the fourth capacitor plate being entirely inside an outer boundary of the third capacitor plate; fifth and sixth capacitor plates for providing a third capacitive coupling of the cross talk compensation arrangement, the third capacitive coupling being between the fourth and sixth tracings, the fifth capacitor plate being larger than the sixth capacitor plate and an outer boundary of the sixth capacitor plate being entirely inside an outer boundary of the fifth capacitor plate; and seventh and eighth capacitor plates for providing a fourth capacitive coupling of the cross talk compensation arrangement, the fourth capacitive coupling being between the fourth and sixth tracings, the seventh capacitor plate being larger than the eighth capacitor plate and an outer boundary of the eighth capacitor plate being entirely inside an outer boundary of the seventh capacitor plate.