AU2011203224B2 - Device for leveling and aligning tiles and method for leveling and aligning tiles - Google Patents

Device for leveling and aligning tiles and method for leveling and aligning tiles Download PDF

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Publication number
AU2011203224B2
AU2011203224B2 AU2011203224A AU2011203224A AU2011203224B2 AU 2011203224 B2 AU2011203224 B2 AU 2011203224B2 AU 2011203224 A AU2011203224 A AU 2011203224A AU 2011203224 A AU2011203224 A AU 2011203224A AU 2011203224 B2 AU2011203224 B2 AU 2011203224B2
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tile
section
edge
main member
opening
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AU2011203224A
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AU2011203224A1 (en
Inventor
Robert C. Doda Jr.
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QEP Co Inc
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QEP Co Inc
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Priority claimed from AU2008231348A external-priority patent/AU2008231348B2/en
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Publication of AU2011203224A1 publication Critical patent/AU2011203224A1/en
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    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F21/00Implements for finishing work on buildings
    • E04F21/0092Separate provisional spacers used between adjacent floor or wall tiles

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Finishing Walls (AREA)

Abstract

DEVICE FOR LEVELING AND ALIGNING TILES AND METHOD FOR LEVELING AND ALIGNING TILES 5 A tile levelingdevice is provided. The device includes a main member, a first section extending transversely from the main member for receiving a first tile and a second section extending transversely from the main member in a direction opposite the first section for receiving a second tile. A member is provided for penetrating the main member and exerting a force on the tiles for leveling them relative to each other. -- -20 28 - 18 26

Description

1 AUSTRALIA Patents Act 1990 Q.E.P. CO., INC. COMPLETE SPECIFICATION STANDARD PATENT Invention Title: Device for leveling and aligning tiles and method for leveling and aligning tiles The following statement is a full description of this invention including the best method of performing it known to us:- DEVICE FOR LEVELING AND ALIGNING TILES AND METHOD FOR LEVELING AND ALIGNING TILES CROSS-REFERENCE TO RELATED APPLICATIONS 5 This application is related to Australian Patent Application No. 2008231348 and to International Patent Application No. PCT/US2008/003868 (International Publication No. WO 2008/118418), the entire disclosures of which are incorporated herein by way of reference. BACKGROUND OF THE INVENTION 10 This invention relates to a device for leveling, aligning and properly spacing tiles. Tiles are usually laid on a substrate or subsurface such a floor or other flat surface adjacent to each other and spaced apart from each other by a small gap. Typically an adhesive is troweled on the surface where the tile is to be applied. Adhesive may also be applied to the back side of the tile. The tile is then placed and adhered to the subsurface. Another tile is then adhered to the 15 subsurface in the same manner next to the previous tile. Typically, spacers may be used to evenly space one tile from the other. However, depending on the unevenness of the subsurface e, i.e., floor, on which the tiles are applied and the unevenness of the applied adhesive, adjacent tiles are not always aligned and thus are not level relative to each other. In this regard, an edge of one tile may extend beyond an edge of an adjacent tile. To overcome this problem, a 20 leveling device has been created which includes a leveling member 10 and a wedge 12, as for example shown in FIG. 1. The leveling member has a vertically aligned member 14 and a generally horizontally curving member 16 (the "horizontal member"), as shown in FIG. 1. The vertical member extends from the horizontal member. A breakaway line 22 is defined on the vertical member on either surface thereof proximate the horizontal member. The breakaway 25 line is defined by removing material from either surface of the vertical member such that the thickness of the vertical member along the line is reduced and the vertical member is weaker along such line. The device is placed such that one end of the tile sits on one end of the horizontal member of the device and abuts one surface of the vertical member of the device and an adjacent tile sits on the other end of the horizontal member and abuts an opposite surface of the vertical member, as for example shown in FIGS. 2 and 3. The wedge member is then pushed through opening 20. As the wedge is continually pushed through opening 20 due to its increasing thickness, it causes the edge of each tile to be compressed downward pressing the 5 horizontal member beneath it toward the subsurface. As a result the tiles are aligned and leveled, as shown in FIG. 4. The spacing between the tiles is controlled by the thickness of the vertical member. Once the tiles set, the vertical member along with the wedge is broken off by kicking or applying a force on the vertical member such that it breaks along the weaker breakaway line 22. As can be seen in FIG. 5, the breakaway line is positioned such that it is 10 flush with the undersurface of the tiles when the tiles are adhered to the floor. The problem with this device is that at times, adhesive fills out the breakaway line. In this regard, it is very difficult to break off the vertical member from the horizontal member due to the adhesive on the breakaway line. Moreover, adhesive at times may not extend over the horizontal member. Consequently, the ends of the portions of the tile which extend over the horizontal member are 15 not adhered to the undersurface or to the horizontal member which may have adhered to the undersurface. As such, these non-adhered ends of the tiles are susceptible to cracking, as they are not properly supported. Consequently, a leveling, aligning and spacing device is required that overcomes the problems of the prior art. Any discussion of documents, acts, materials, devices, articles or the like which has 20 been included in the present specification is not to be taken as an admission that any or all of these matters form part of the prior art base or were common general knowledge in the field relevant to the present invention as it existed before the priority date of each claim of this application. 25 SUMMARY OF THE INVENTION Throughout this specification the word "comprise", or variations such as "comprises" or "comprising", will be understood to imply the inclusion of a stated element, integer or step, or group of elements, integers or steps, but not the exclusion of any other element, integer or step, or group of elements, integers or steps. -2- In an exemplary embodiment, there is provided a tile leveling device comprising: a main member; a first section extending transversely from said main member for receiving a first tile, said first tile having a first surface opposite a second surface; 5 a second section extending transversely from said main member in a direction opposite said first section for receiving a second tile, said second tile having a first surface opposite a second surface; a first opening formed through said first section; a second opening formed through said second section; and 10 a third opening formed through said main member, wherein the third opening comprises a first edge opposite a second edge, wherein the first edge is further from the first and second sections than the second edge and wherein a stiffener portion is formed proximate the first edge for bolstering said first edge. In a further exemplary embodiment, the device further includes a reduced thickness 15 breakaway section formed on the main member. The main member may also include a first notch extending from a first edge of the main member and a second notch extending from a second edge of the main member and the breakaway section may extend from the first notch to the second notch. Also disclosed herein is a tile leveling device comprising: 20 a main member; a first section extending transversely from said main member for receiving a first tile, said first tile having a first surface opposite a second surface; a second section extending transversely from said main member in a direction opposite said first section for receiving a second tile, said second tile having a first surface 25 opposite a second surface; and an opening formed through said main member, wherein the opening comprises a first edge opposite a second edge, wherein the first edge is further from the first and second sections than the second edge and wherein a stiffener portion is formed proximate the first edge for bolstering said first edge. -3- Also disclosed herein is a method for leveling tiles, said method comprising: providing a tile leveling device comprising, a main member, a first section extending transversely from said main member, said first 5 section comprising a first opening formed there through, a second section extending transversely from said main member in a direction opposite said first section, said second section comprising a second opening formed there through, a third opening formed through said main member, wherein the third 10 opening comprises a first edge opposite a second edge, wherein the first edge is further from the first and second sections than the second edge and wherein a stiffener portion is formed proximate the first edge for bolstering said first edge, and a breakaway section defined along said main member; placing said leveling device over a subsurface; 15 placing a first tile over said first section, said first tile having a first surface opposite a second surface, wherein said second surface is farther from the first section than said first surface; placing a second tile over said second section, said second tile having a first surface opposite a second surface, wherein said second tile second surface is farther from the 20 second section than said second tile first surface; applying a first adhesive between the first tile and the subsurface; applying a second adhesive between the second tile and the subsurface; placing a member through the third opening said member exerting a force on said first and second tiles pressing said tiles against said first and second sections leveling the 25 first tile second surface relative to the second tile second surface, wherein said first adhesive penetrates said first opening and contacts said first tile first surface and said subsurface, said second adhesive penetrates said second opening and contacts said second tile first surface and said subsurface, and wherein said breakaway section is located between the first and second surfaces of each tile; -3acuring the adhesives for adhering the tiles to the subsurface; and breaking the main member along said breakaway section. Also disclosed herein is a tile leveling device and tile combination. The combination includes a first tile having a first surface opposite a second surface, a second tile having a first 5 surface opposite a second surface and a device having a main member, a first section extending transversely from the main member and a second section a second section extending transversely from the main member in a direction opposite the first section. The first tile is located over the first section and the second tile is located over the second section, An opening is formed through the main member and a member is provided for penetrating the opening and 10 exerting a force against both tiles pressing the tiles against the first and second sections. A breakaway section is defined along the main member. The breakaway section is located between the first and second surfaces of each of the first and second tiles. In another exemplary embodiment, an opening is formed through the first section for allowing an adhesive to flow -3bthere through. In a further exemplary embodiment, an opening is formed through the second section for allowing an adhesive to flow there through. In another exemplary embodiment, the opening formed through the main member includes a first edge opposite a second edge such that the first edge is further from the first and second sections than the second edge. A stiffener 5 portion is formed proximate the first edge for bolstering the first edge. In yet another exemplary embodiment, the main member includes a first notch extending from a first edge of the main member and a second notch extending from a second edge of the main member and the breakaway section extends from the first notch to the second notch. In yet a further exemplary embodiment, each of the first and second sections have at least a curved portion 10 having a curvature when viewed in cross-section, such that the force causes this curvature to reduce. Further disclosed herein is a method for leveling tiles. The method includes providing a tile leveling device which includes a main member, a first section extending transversely from the main member and having a first opening formed there through, a second section extending 15 transversely from the main member in a direction opposite the first section and having a second opening formed there through. A third opening is formed through the main member, and a breakaway section is defined along the main member. The method further includes placing the leveling device over a subsurface, placing a first tile over the first section, where the tile has a first surface opposite a second surface, and the second surface if farther from the first section 20 than said first surface, and placing a second tile over said second section, where the second tile has a first surface opposite a second surface and the second tile second surface if farther from the second section than said second tile first surface. The method further includes applying a first adhesive between the first tile and the subsurface, applying a second adhesive between the second tile and the subsurface, and placing a member through the third opening such that the 25 member exerts a force on the first and second tiles pressing the tiles against the first and second sections leveling the first tile second surface relative to the second tile second surface whereby the first adhesive penetrates the first opening and contacts the first tile first surface and the subsurface, and the second adhesive penetrates the second opening and contacts the second tile first surface and the subsurface, and causing the breakaway section to be located between the -4first and second surfaces of each tile. The method also includes curing the adhesives for adhering the tiles relative to the subsurface and breaking the main member along the breakaway section. In another exemplary embodiment, the second adhesive is the same as the first adhesive. In yet a further exemplary embodiment, the tiles are abutted against said main 5 member prior to curing. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a prior art leveling and spacing device. FIGS. 2, 3, 4 and 5 are cross-sectional views showing use of the prior art leveling device. 10 FIG. 6 is a cross-sectional view of an exemplary embodiment leveling and spacing device of the present invention installed. FIG. 7 is an end view of an exemplary embodiment leveling device, including an exemplary embodiment wedge. FIG. 8 is a perspective view of an exemplary embodiment leveling device with a wedge 15 of the present invention. FIG. 9 is a perspective view of yet a further exemplary embodiment leveling and spacing device with a wedge of the present invention. DETAILED DESCRIPTION OF THE INVENTION An inventive leveling and spacing device 110 is provided. The inventive device 20 includes a first member 114 and a transverse member 116 which includes a section 1 16a on one side of the first member and a second section 1 16b on the other side of the first main member as for example shown in FIG. 6. Each section 116a, 116b in an exemplary embodiment shown in FIG. 6 is curved or has at least a portion which curves so as to define a convex curvature 117 on a distal surface or lower surface of the transverse member 116. An opening 118 is formed on 25 the first member to accommodate a wedge 112. A breakaway section or line 122 is formed on the first member and is spaced such that it will extend into the thickness of the tiles 134a, 134b when installed, as for example shown in FIG. 6. To achieve this, the breakaway line is located -5at or above the highest points of the horizontal member sections 1 16a, 116b. In this regard, when the tiles rest on such points, the breakaway line is at or located above the lower surface of such tiles and when the wedge is installed through opening 118 and presses the tiles against the transverse member sections 116a and 116b causing these sections to compress (and flatten if 5 they include a curved portion) toward the subsurface on which such tiles are installed, such that the breakaway line is located at a height within the thickness of the installed tiles. Consequently, the breakaway line is not exposed to the adhesive 132 which is used to adhere the tiles to a floor or subsurface 130. In this regard, the breakaway line allows for a consistently clean breakaway of the first main member from the transverse member. Furthermore, to help 10 the breakaway of the first main member from the transverse member, the breakaway line may be formed by two opposing V-shaped or U-shaped notches 123 extending from opposite surfaces of the vertical member 114, as for example shown in FIG. 7. In another exemplary embodiment, the breakaway line is formed by a reduction in the thickness of the material. Moreover, a portion of the breakaway line or the material defining a breakaway line at the edges 15 of the vertical member may be removed, defining cutouts 125, as for example shown in FIG. 8. This also helps with the breakaway of the first main member from the transverse member. In another exemplary embodiment, the breakaway line 122 may extend all the way to the edges of the vertical member, as for example shown in FIG. 9. "Breakaway line" or "breakaway section" as used herein refers to a section of reduced 20 thickness that would promote the breakaway and thus, the separation of such section. In addition, a stiffener portion 127 may be formed at the upper edge of the opening 118 which accommodates the wedge 112, bolstering such edge. In this regard, as the wedge is inserted into the opening, it does not crush the upper edge of the opening. Furthermore, at least one opening 129 is formed through each section 1 16a, 116b of the transverse member 116 on 25 either side of the first main member 114. In another exemplary embodiment, multiple openings may be formed through each section of the transverse member. These openings allow for the adhesive 132 to penetrate the opening and extend over the surface of the transverse member sections 1 16a, 1 16b, as for example shown in FIG.6. In this regard, the transverse member sections adhere to the subsurface or floor and the tiles get adhered to the transverse member. -6- Consequently, the tile end portions 13 1a, 13 1b which extend over the transverse member sections 1 16a, 1 16b, respectively get proper support, thereby reducing the risk of cracking, crumbling and separating from the subsurface. In an exemplary embodiment, an upper surface 126 of the wedge 112 is tapered 5 downwards and includes teeth 150. Each of these teeth is defined by a vertical surface 152 or riser and an obliquely extending surface 154 from the top of the vertical surface 152 in the same general direction as the upper surface 126 of the wedge. In this regard, these teeth latch on to the upper edge of the opening when the wedge is inserted into the opening 118, thereby preventing the wedge from inadvertently slipping out of the opening 118. 10 In the exemplary embodiment shown, a center portion of the wedge is hollow, defining two opposing edges. The teeth are formed on these opposing edges. In an exemplary embodiment, adhesive is applied to the subsurface of where tiles are to be adhered and is also applied to the undersurface of a first tile. As the tile is being placed on the subsurface with the adhesive, an exemplary embodiment leveling and spacing device is 15 positioned such that the tile undersurface sits on top of the transverse member section 1 16a and it abuts the device first main member 114. The device is positioned on the subsurface such that both transverse member sections sit on the adhesive applied to the subsurface. Adhesive is applied on the undersurface of a second tile. Adhesive may also be further applied to the subsurface if necessary. The second tile is laid on the subsurface such that the second tile 20 undersurface sits on top of the second transverse member section 116b and also abuts the first main member 114. The wedge is then fitted through the opening 118. As the wedge wedges itself in the opening it applies pressure on the upper surfaces of the tiles leveling such tiles relative to each other. The pressure causes the adhesive to travel through the openings formed on the transverse member sections ensuring that the adhesive is spread on the top and bottom 25 and through each of the transverse member sections. It should be understood that if the tiles are being installed so that they are adjacent to more than one other tile, than a leveling device should be placed along each side of a tile that will be adjacent to another tile. For example, if a first tile is going to be surrounded by four other tiles, than a leveling device must be placed -7adjacent each side of the first tile such that a transverse member section of each device is sandwiched between the first tile and the subsurface. Once the adhesive cures, the vertical member may be removed by "kicking it" off or by pushing it sideways or pulling it off. Since the breakaway lines on the exemplary devices are 5 positioned such that they are within the tile thickness of the tile and away from the adhesive, the vertical sections should consistently break off when subjected to the same force. In an exemplary embodiment, wedges may be used having a sufficient thickness such that when they are pushed beyond a certain point through the opening of the vertical member, they will apply a sufficient force to break the vertical member along the breakaway line. In such an embodiment, 10 the vertical member may be removed by further pushing the wedge through the vertical member opening. Although the present invention has been described and illustrated to respect to exemplary embodiments, it is to be understood that it is not to be so limited, since changes and modifications may be made therein which are within the full intended scope of this invention as 15 hereinafter claimed. -8-

Claims (12)

1. A tile leveling device comprising: a main member; 5 a first section extending transversely from said main member for receiving a first tile, said first tile having a first surface opposite a second surface; a second section extending transversely from said main member in a direction opposite said first section for receiving a second tile, said second tile having a first surface opposite a second surface; 10 a first opening formed through said first section; a second opening formed through said second section; and a third opening formed through said main member, wherein the third opening comprises a first edge opposite a second edge, wherein the first edge is further from the first and second sections than the second edge and wherein a stiffener portion is formed proximate the 15 first edge for bolstering said first edge.
2. The device as recited in claim 1, further comprising a reduced thickness breakaway section formed on said main member, wherein the main member comprises a first notch extending from a first edge of the main member and a second notch extending from a 20 second edge of the main member, wherein said breakaway section extends from the first notch to the second notch, and wherein said first and second notches reduce the width of said reduced thickness breaking section.
3. A tile leveling device comprising: 25 a main member; a first section extending transversely from said main member for receiving a first tile, said first tile having a first surface opposite a second surface; -9- a second section extending transversely from said main member in a direction opposite said first section for receiving a second tile, said second tile having a first surface opposite a second surface; and an opening formed through said main member, wherein the opening comprises a 5 first edge opposite a second edge, wherein the first edge is further from the first and second sections than the second edge and wherein a stiffener portion is formed proximate the first edge for bolstering said first edge.
4. The device as recited in claim 3, further comprising a reduced thickness 10 breakaway section formed on said main member, wherein the main member comprises a first notch extending from a first edge of the main member and a second notch extending from a second edge of the main member, wherein said breakaway section extends from the first notch to the second notch. 15
5. The device as claimed in claim 1, further comprising a through member received through the third opening for providing a force against said first edge.
6. The device as claimed in claim 3, further comprising a through member received through the opening for providing a force against said first edge. 20
7. A method for leveling tiles, said method comprising: providing a tile leveling device comprising, a main member, a first section extending transversely from said main member, said first 25 section comprising a first opening formed there through, a second section extending transversely from said main member in a direction opposite said first section, said second section comprising a second opening formed there through, -10- a third opening formed through said main member, wherein the third opening comprises a first edge opposite a second edge, wherein the first edge is further from the first and second sections than the second edge and wherein a stiffener portion is formed proximate the first edge for bolstering said first edge, and 5 a breakaway section defined along said main member; placing said leveling device over a subsurface; placing a first tile over said first section, said first tile having a first surface opposite a second surface, wherein said second surface is farther from the first section than said first surface; 10 placing a second tile over said second section, said second tile having a first surface opposite a second surface, wherein said second tile second surface is farther from the second section than said second tile first surface; applying a first adhesive between the first tile and the subsurface; applying a second adhesive between the second tile and the subsurface; 15 placing a member through the third opening said member exerting a force on said first and second tiles pressing said tiles against said first and second sections leveling the first tile second surface relative to the second tile second surface, wherein said first adhesive penetrates said first opening and contacts said first tile first surface and said subsurface, said second adhesive penetrates said second opening and contacts said second tile first surface and 20 said subsurface, and wherein said breakaway section is located between the first and second surfaces of each tile; curing the adhesives for adhering the tiles to the subsurface; and breaking the main member along said breakaway section. 25
8. The method as recited in claim 7 wherein the second adhesive is the same as the first adhesive,
9. The method as recited in claim 7 further comprising abutting said tiles against said main member prior to curing. -11-
10. A tile leveling device substantially as hereinbefore described with reference to Figs. 6 to 9 of the accompanying drawings. 5
11. A method for leveling tiles, said method substantially as hereinbefore described with reference to Figs. 6 to 9 of the accompanying drawings.
-12-
AU2011203224A 2007-03-26 2011-06-30 Device for leveling and aligning tiles and method for leveling and aligning tiles Active AU2011203224B2 (en)

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US60/920,430 2007-03-26
AU2008231348A AU2008231348B2 (en) 2007-03-26 2008-03-24 Device for leveling and aligning tiles and method for leveling and aligning tiles
AU2011203224A AU2011203224B2 (en) 2007-03-26 2011-06-30 Device for leveling and aligning tiles and method for leveling and aligning tiles

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2012101175B4 (en) * 2012-08-01 2014-07-31 Gorton, Michael Mr Tile levelling device
US11028601B2 (en) 2017-10-10 2021-06-08 Me Innovations Pty Ltd Tile spacer

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Publication number Priority date Publication date Assignee Title
US4397125A (en) * 1980-06-04 1983-08-09 Gussler Jr Ova L System for aligning uneven thickness panel sections
WO1992014012A2 (en) * 1991-02-08 1992-08-20 Accornero, Guido A device for laying rigid flooring modules
WO2006091606A2 (en) * 2005-02-22 2006-08-31 Davinci Italia/Usa Group, Llc Tile alignment and leveling device and method for using same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4397125A (en) * 1980-06-04 1983-08-09 Gussler Jr Ova L System for aligning uneven thickness panel sections
WO1992014012A2 (en) * 1991-02-08 1992-08-20 Accornero, Guido A device for laying rigid flooring modules
WO2006091606A2 (en) * 2005-02-22 2006-08-31 Davinci Italia/Usa Group, Llc Tile alignment and leveling device and method for using same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2012101175B4 (en) * 2012-08-01 2014-07-31 Gorton, Michael Mr Tile levelling device
US11028601B2 (en) 2017-10-10 2021-06-08 Me Innovations Pty Ltd Tile spacer

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