AU2005242162A1 - Heat Sink for Light Emitting Diode Bulb - Google Patents

Description

AUSTRALIA

Patents Act 1990 COMPLETE SPECIFICATION FOR A STANDARD PATENT Name of Applicant: Hsien-Jung Huang Name of Inventor: Hsien-Jung Huang Address for Service: CULLEN CO Patent Trade Mark Attorneys, 239 George Street Brisbane QId 4000 Australia Invention Title: Heat Sink for Light Emitting Diode Bulb Details of Priority Applications: Taiwanese Patent Application No. 094205809 14 April 2005 US Patent Application No. 11/131,398 18 May 2005 German Patent Application No. 202005008411.5-30 May 2005 Japanese Patent Application No. 2005-003606 24 May 2005 The following statement is a full description of this invention, including the best method of performing it, known to us: HEAT SINK FOR LIGHT EMITTING DIODE BULB BACKGROUND OF THE INVENTION 0 o 1. Field of the Invention ci 100011] The present invention generally relates to a heat sink, and more particularly to a heat sink for a light bulb.

2. Description of the Prior Art CI [00021 High brightness, low power consumption, long live time, and low working temperature are all of the advantages of the light eitting diodes (LED). The incandescent lamp has defects of the shot live time, high power consumption, and high working temperature by comparison.

For examples, a flashlight with the light emitting diodes can be used over 50 hours by the power of three AAA batteries, and more particularly some flashlights with the light emitting diodes are guaranteed to be used over 70 hours. It is perceived mhat the power consumption of the light emitting diodes is very excellent.

[00031 For enhancing the brightness, a plurality of light emitting diodes are compounded to form a light emidtting diode bulb. Although the working temperature of the light emitting diodes is low, a mount of light emitting diodes in a limited space could still generate a lot of heat.

The heat could age or damage other components aside. Thus a better design for heat sinking is needed.

SUMMARY OF THlE INVENTION [00041 Therefore, in accordance with the previous summary, objects, features and advantages of the present disclosure will become apparent to one skilled in the art from the subsequent description and the appended claims taken in conjunction with the accompanying drawings.

o [00051 The present invention provides a heat sink for a light emitting o diode lamp. The heat sink comprises a heat sink module, a transparent lens and a heat condition liquid. The heat sink module has a 0 lamphouse with a first opening and a second opening on the both ends.

00 The heat sink is formed by a heat condition material for heat sinking.

o Besides, there is a room in where the heat condition liquid is filled within the heat sink module for enhancing the effect of heat condition.

N Accordingly, the heat can be sinked into the air by the heat sink module.

BREIF DESCRIPTION OF THlE DRAWINGS [0006] The accompanying drawings incorporated in and forming a part of the specification illustrate several aspects of the present invention, and together with the description serve to explain the principles of the disclosure. In the drawings: [00071 FIG. 1A is a profle diagram of one embodiment of the present invention; and [00081 FIG. 11B, FIG. IC, and FIG. 1D are the structure diagrams according to the embodiments of the present invention.

DETAI1j~gt emitting diode DESCRIPTION OF THlE PREFERRED EMBO0DIMENTS [0009] The present disclosure can be described by the embodiments given below. It is understood, however, that the embodiments below are not necessarily limitations to the present disclosure, but are used to a typical implementation of the invention.

[0010] Having summarized various aspects of the present invention, reference will now be made in detail to the description of the invention as illustrated in the drawings. While the invention will be described in o connection with these drawings, there is no intent to limit it to the o embodiment or embodiments disclosed therein. On the contrary the o intent is to cover all alternatives, modifications and equivalents included within the spirit and scope of the invention as defined by the 00 appended claims.

10011] It is noted that the drawings presents herein have been ci provided to illustrate certain features and aspects of embodiments of the invention. It will be appreciated from the description provided herein that a variety of alternative embodiments and implementations may be realized, consistent with the scope and spirit of the present o invention.

10012] It is also noted that the drawings presents herein are not consistent with the samne scale. Some scales of some components are not proportional to the scales of other components in order to provide comprehensive descriptions and emphasizes to this present invention.

100131 Referring to FIG. LA, a structure diagramn of a heat sink for a lamp of the light emitting diode is illustrated. The heat sink comprises a heat sink module 110, a transparent lens 120 and an illumination module 130. The heat sink 110 is formed by the heat condition materials for heat sinking. The heat sink 110 also has a plurality of cooling fins 112 surround it for increasing the cooling area. Besides, a lamphouse 122 is also included in the heat sink module 110 with a first opening and a second opening on the both ends. Moreover, the transparent lens 120 and the illumination module 130 are used for sealing the first opening and the second opening separately.

Furthermore, the heat sink further comprises a sealed room 118 filled with a heat conduction liquid for enhancing the cooling effect of the heat sink 110. The room 118 can surround the lamphouse 122 for averagely conducting the heat to each cooling tins 112. According to one preferred embodiment of the present invention, the forgoing heat conduction liquid can be the ultra pure water, high thermal conductive liquid or high thermal conductive mixed liquid.

[00 14] The forgoing illumination module 130 comprises at least a light emitting diode configured on the surface of the illumination module 130 o toward the lamphouse. A light guiding material 132 can be cover on the o light emitting diode or light emitting diodes. The light guiding material o can be transparent or opaque. Besides, the illumination module 130 further comprises a plurality of terminals configured on the surface of 0c' the illumination module 130 backward the lamphouse 122. The o terminals are used for electrically coupling a external electrical power for illumination. The forgoing external electrical power can be the alternating current or the direct current. The external electrical power is optional according to the type of the ilumination module 130.

tn [00151 Referring to FIG. lB and FIG. 1C, the tail of the heat sink o module 110 can be connected to a connector 160, the connector 160 can include a screw cap 162, the interface for connecting the socket for a light bulb. The external electrical power is supplied via the socket for a light bulb. The standards of the screw cap can be E27, E39 and so forth.

The present invention does not limit the manner for connecting the connector 160 with the heat sink module 110. For examples, there can be a indentation on a corner of each cooling fin 112, whereby connector 160 can be pressingly connected on the indentations of the heat sink 110.

[00 161 Furthermore, one embodiment of the present invention can further an AC/DC converter (alternating current/direct current converter) module 150. The AC/DC conver-ter can convert the alternating current in the external electrical power into the direct current for providing to the terminals 134.

[00 171 Moreover, one embodiment of the present Invention can further comprise a plurality of external terminals 172 on the connector 170, referring to FIG. 1 D. Each external terminal 172 can be the extension of one of the terminals 134. The present invention does not limit the manner for connecting the connector 170 to the heat sink module 110.

[00181 Accordingly, the heat can be speeded up to conducting to the cooling fins of the heat sink module when the external electrical power is supplied to the light emitting diode, whereby the heat can be sinked into the air. The illumination module can also be other illumination o devices except the light emitting diode, for examples, the incandescent o lamps.

[00 19] The foregoing description is not intended to be exhaustive or to 0c' limit the invention to the precise forms disclosed. Obvious o) modifications or variations are possible in light of the above teachings.

In this regard, the embodiment or embodiments discussed were chosen and described to provide the best illustration of the principles of the invention and its practical application to thereby enable one of ordinary skill in the art to utilize the invention in various embodiments and with various modifications as are suited to the particular use contemplated.

o) All such modifications and variations are within the scope of the ci inventions as determined by the appended claims when interpreted in accordance with the breath to which they are fairly and legally entitled.

[0020] It is understood that several modifications, changes, and substitutions are intended in the foregoing disclosure and in some instances some features of the invention will be employed without a corresponding use of other features. Accordingly, it is appropriate that the appended claims be construed broadly and in a manner consistent with the scope of the invention.

Claims (5)

1. 3. A heat sink for a light emitting diode bulb of claim 2, wherein said illumination module comprises at least a light emitting diode configured on the surface of said illumination module toward said lamphouse.
2. 4. A heat sink for a light emitting diode bulb of claim 3, wherein there is a light guiding material cover said light emitting diode bulb. A heat sink for a light emitting diode bulb of claim 4, wherein said light guiding material is opaque.
3. 6. A heat sink for a light emitting diode bulb of claim 3, wherein said illumination module comprises a plurality of terminals configured on the surface of said illumination module backward said lamphouse, whereby said light emitting diode can use the external electrical power coupled with said terminals.
4. 7. A heat sink for a light emitting diode bulb of claim 1, wherein said heat condition liquid is the ultra pure water.
5. 8. A heat sink for a light emitting diode bulb of claim 1, wherein said heat condition liquid is a mixed liquid. o 9. -A heat sink for a light emitting diode bulb of claim 6, further 0 comprising a connector with a screw cap, wherein said connector is o connected with said heat sink module and said crew cap is used to 0 connect a socket electrically coupling with an external electrical power. 00 0 10. A heat sink for a light emitting diode bulb of claim 6, further comprising a connector with a plurality of external terminals, wherein IND each external terminal is the extension of one of said terminals separately. r 11. A heat sink for a light emitting diode bulb of claim 6, wherein said 0heat sink module further comprises a plurality of cooling fins surround said heat sink module, wherein cooling fins are formed by the heat condition materials for increasing the cooling area.