AU2003281011A1 - Film forming method and film forming apparatus - Google Patents
Film forming method and film forming apparatusInfo
- Publication number
- AU2003281011A1 AU2003281011A1 AU2003281011A AU2003281011A AU2003281011A1 AU 2003281011 A1 AU2003281011 A1 AU 2003281011A1 AU 2003281011 A AU2003281011 A AU 2003281011A AU 2003281011 A AU2003281011 A AU 2003281011A AU 2003281011 A1 AU2003281011 A1 AU 2003281011A1
- Authority
- AU
- Australia
- Prior art keywords
- film forming
- forming apparatus
- forming method
- film
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
- C23C16/0281—Deposition of sub-layers, e.g. to promote the adhesion of the main coating of metallic sub-layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/55—Capacitors with a dielectric comprising a perovskite structure material
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Semiconductor Memories (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-201534 | 2002-07-10 | ||
JP2002201534A JP2004047633A (en) | 2002-07-10 | 2002-07-10 | Method and apparatus for depositing film |
PCT/JP2003/008803 WO2004008518A1 (en) | 2002-07-10 | 2003-07-10 | Film forming method and film forming apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003281011A1 true AU2003281011A1 (en) | 2004-02-02 |
Family
ID=30112570
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003281011A Abandoned AU2003281011A1 (en) | 2002-07-10 | 2003-07-10 | Film forming method and film forming apparatus |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2004047633A (en) |
AU (1) | AU2003281011A1 (en) |
WO (1) | WO2004008518A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4884104B2 (en) | 2006-06-29 | 2012-02-29 | 富士通セミコンダクター株式会社 | Semiconductor device including capacitor and manufacturing method thereof |
JP2011146507A (en) | 2010-01-14 | 2011-07-28 | Renesas Electronics Corp | Semiconductor device and method of manufacturing the same |
JP2013021012A (en) | 2011-07-07 | 2013-01-31 | Renesas Electronics Corp | Semiconductor device manufacturing method |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003519913A (en) * | 2000-01-06 | 2003-06-24 | アプライド マテリアルズ インコーポレイテッド | Low heat balance metal oxide deposition for capacitor structures |
-
2002
- 2002-07-10 JP JP2002201534A patent/JP2004047633A/en active Pending
-
2003
- 2003-07-10 WO PCT/JP2003/008803 patent/WO2004008518A1/en active Application Filing
- 2003-07-10 AU AU2003281011A patent/AU2003281011A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2004047633A (en) | 2004-02-12 |
WO2004008518A1 (en) | 2004-01-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |