AU2003251686A1 - Hermetic transistor outline housing comprising a ceramic connection for high frequency applications - Google Patents

Hermetic transistor outline housing comprising a ceramic connection for high frequency applications

Info

Publication number
AU2003251686A1
AU2003251686A1 AU2003251686A AU2003251686A AU2003251686A1 AU 2003251686 A1 AU2003251686 A1 AU 2003251686A1 AU 2003251686 A AU2003251686 A AU 2003251686A AU 2003251686 A AU2003251686 A AU 2003251686A AU 2003251686 A1 AU2003251686 A1 AU 2003251686A1
Authority
AU
Australia
Prior art keywords
hermetic
high frequency
frequency applications
transistor outline
ceramic connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003251686A
Inventor
Robert Hettler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Original Assignee
Carl Zeiss AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss AG filed Critical Carl Zeiss AG
Publication of AU2003251686A1 publication Critical patent/AU2003251686A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
AU2003251686A 2002-08-08 2003-08-02 Hermetic transistor outline housing comprising a ceramic connection for high frequency applications Abandoned AU2003251686A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE2002136278 DE10236278A1 (en) 2002-08-08 2002-08-08 Transistor outline housing for transistors used for networking computers comprises a punched part as base for supporting electronic components and closed using a cup-like cover
DE10236278.5 2002-08-08
PCT/EP2003/008587 WO2004021438A1 (en) 2002-08-08 2003-08-02 Hermetic transistor outline housing comprising a ceramic connection for high frequency applications

Publications (1)

Publication Number Publication Date
AU2003251686A1 true AU2003251686A1 (en) 2004-03-19

Family

ID=30775081

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003251686A Abandoned AU2003251686A1 (en) 2002-08-08 2003-08-02 Hermetic transistor outline housing comprising a ceramic connection for high frequency applications

Country Status (3)

Country Link
AU (1) AU2003251686A1 (en)
DE (1) DE10236278A1 (en)
WO (1) WO2004021438A1 (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3784883A (en) * 1971-07-19 1974-01-08 Communications Transistor Corp Transistor package
JPS5745955A (en) * 1980-09-02 1982-03-16 Seikosha Co Ltd Sealing container
CA1225126A (en) * 1985-03-07 1987-08-04 Robert G. Harrison Microstrip - slotline frequency halver
US5214498A (en) * 1990-02-26 1993-05-25 Raytheon Company MMIC package and connector
JP2000216603A (en) * 1999-01-26 2000-08-04 Sumitomo Metal Ind Ltd Grounded coplanar waveguide suitable for millimeter wave band
AU2001227912A1 (en) * 2000-01-13 2001-07-24 Alpha Industries, Inc. Microwave ic package with dual mode wave guide
JP3804407B2 (en) * 2000-07-07 2006-08-02 日本電気株式会社 filter
JP3670574B2 (en) * 2000-11-30 2005-07-13 京セラ株式会社 I / O terminal and semiconductor element storage package
JP2002184888A (en) * 2000-12-13 2002-06-28 Kyocera Corp Input/output terminal and semiconductor element housing package
JP3598059B2 (en) * 2000-12-13 2004-12-08 京セラ株式会社 Package for storing semiconductor elements
DE10064577A1 (en) * 2000-12-18 2002-07-11 Infineon Technologies Ag Control arrangement in optical transmission/reception module, includes circuit board with radio frequency lines which are connected to package terminals in parallel to board plane
JP4454144B2 (en) * 2000-12-22 2010-04-21 京セラ株式会社 High frequency circuit package

Also Published As

Publication number Publication date
DE10236278A1 (en) 2004-02-26
WO2004021438A1 (en) 2004-03-11

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase