AU2003236876A1 - Module comprising acoustic wave interface components - Google Patents

Module comprising acoustic wave interface components

Info

Publication number
AU2003236876A1
AU2003236876A1 AU2003236876A AU2003236876A AU2003236876A1 AU 2003236876 A1 AU2003236876 A1 AU 2003236876A1 AU 2003236876 A AU2003236876 A AU 2003236876A AU 2003236876 A AU2003236876 A AU 2003236876A AU 2003236876 A1 AU2003236876 A1 AU 2003236876A1
Authority
AU
Australia
Prior art keywords
module
acoustic wave
interface components
wave interface
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003236876A
Inventor
Sylvain Ballandras
Serge Camou
Vincent Laude
Marc Solal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales SA filed Critical Thales SA
Publication of AU2003236876A1 publication Critical patent/AU2003236876A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/0222—Details of interface-acoustic, boundary, pseudo-acoustic or Stonely wave devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
AU2003236876A 2002-04-12 2003-03-28 Module comprising acoustic wave interface components Abandoned AU2003236876A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0204629A FR2838577B1 (en) 2002-04-12 2002-04-12 MODULE COMPRISING ACOUSTIC INTERFACE WAVE COMPONENTS
FR02/04629 2002-04-12
PCT/FR2003/000988 WO2003088482A1 (en) 2002-04-12 2003-03-28 Module comprising acoustic wave interface components

Publications (1)

Publication Number Publication Date
AU2003236876A1 true AU2003236876A1 (en) 2003-10-27

Family

ID=28459800

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003236876A Abandoned AU2003236876A1 (en) 2002-04-12 2003-03-28 Module comprising acoustic wave interface components

Country Status (3)

Country Link
AU (1) AU2003236876A1 (en)
FR (1) FR2838577B1 (en)
WO (1) WO2003088482A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005055871A1 (en) 2005-11-23 2007-05-24 Epcos Ag Guided bulk acoustic wave operated component for e.g. ladder filter, has dielectric layer with low acoustic impedance, and metal layer including partial layer with high impedance, where ratio between impedances lies in certain range
DE102005055870A1 (en) 2005-11-23 2007-05-24 Epcos Ag Electroacoustic component, has layer system arranged between carrier substrate and piezo substrate, and comprising metal layer and dielectric layer, where thickness of piezo substrate is maximally half of thickness of carrier substrate
DE102017130926A1 (en) * 2017-12-21 2019-06-27 RF360 Europe GmbH Wafer assembly, method of making same and hybrid filter

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124109A (en) * 1983-12-09 1985-07-03 Clarion Co Ltd Surface elastic wave element
JP4049239B2 (en) * 2000-08-30 2008-02-20 Ｔｄｋ株式会社 Method for manufacturing high-frequency module component including surface acoustic wave element

Also Published As

Publication number Publication date
FR2838577B1 (en) 2005-11-25
WO2003088482A1 (en) 2003-10-23
FR2838577A1 (en) 2003-10-17

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase