AU2003228977A8 - Method of and apparatus for forming three-dimensional structures integral with semiconductor based circuitry - Google Patents

Method of and apparatus for forming three-dimensional structures integral with semiconductor based circuitry

Info

Publication number
AU2003228977A8
AU2003228977A8 AU2003228977A AU2003228977A AU2003228977A8 AU 2003228977 A8 AU2003228977 A8 AU 2003228977A8 AU 2003228977 A AU2003228977 A AU 2003228977A AU 2003228977 A AU2003228977 A AU 2003228977A AU 2003228977 A8 AU2003228977 A8 AU 2003228977A8
Authority
AU
Australia
Prior art keywords
forming
dimensional structures
semiconductor based
based circuitry
structures integral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003228977A
Other versions
AU2003228977A1 (en
Inventor
Adam L Cohen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Southern California USC
Original Assignee
University of Southern California USC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Southern California USC filed Critical University of Southern California USC
Publication of AU2003228977A8 publication Critical patent/AU2003228977A8/en
Publication of AU2003228977A1 publication Critical patent/AU2003228977A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00126—Static structures not provided for in groups B81C1/00031 - B81C1/00119
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/003—3D structures, e.g. superposed patterned layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76885—By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/05—Temporary protection of devices or parts of the devices during manufacturing
    • B81C2201/053—Depositing a protective layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
    • B81C2203/0735—Post-CMOS, i.e. forming the micromechanical structure after the CMOS circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0494—4th Group
    • H01L2924/04941—TiN
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    • H01L2924/0495—5th Group
    • H01L2924/04953—TaN
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
AU2003228977A 2002-05-07 2003-05-07 Method of and apparatus for forming three-dimensional structures integral with semiconductor based circuitry Abandoned AU2003228977A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US37918302P 2002-05-07 2002-05-07
US60/379,183 2002-05-07
PCT/US2003/014664 WO2003095712A2 (en) 2002-05-07 2003-05-07 Method of and apparatus for forming three-dimensional structures integral with semiconductor based circuitry

Publications (2)

Publication Number Publication Date
AU2003228977A8 true AU2003228977A8 (en) 2003-11-11
AU2003228977A1 AU2003228977A1 (en) 2003-11-11

Family

ID=29420501

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003228977A Abandoned AU2003228977A1 (en) 2002-05-07 2003-05-07 Method of and apparatus for forming three-dimensional structures integral with semiconductor based circuitry

Country Status (3)

Country Link
US (2) US20040065554A1 (en)
AU (1) AU2003228977A1 (en)
WO (1) WO2003095712A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW522238B (en) * 2001-10-18 2003-03-01 Chipmos Technologies Inc Method for manufacturing probes of a probe card
EP1576206A2 (en) * 2002-05-07 2005-09-21 Microfabrica Inc. Method of and apparatus for forming three-dimensional structures
US20050202180A1 (en) * 2003-12-31 2005-09-15 Microfabrica Inc. Electrochemical fabrication methods for producing multilayer structures including the use of diamond machining in the planarization of deposits of material
US20070238265A1 (en) * 2005-04-05 2007-10-11 Keiichi Kurashina Plating apparatus and plating method
KR100870820B1 (en) 2005-12-29 2008-11-27 매그나칩 반도체 유한회사 Image sensor and method for manufacturing the same
CH704572B1 (en) * 2007-12-31 2012-09-14 Nivarox Sa A method of manufacturing a metal microstructure and microstructure obtained using this method.
EP2803083A4 (en) * 2012-01-10 2014-12-31 Hzo Inc Masks for use in applying protective coatings to electronic assemblies, masked electronic assemblies and associated methods
WO2013192222A2 (en) 2012-06-18 2013-12-27 Hzo, Inc. Systems and methods for applying protective coatings to internal surfaces of fully assembled electronic devices
US10449568B2 (en) 2013-01-08 2019-10-22 Hzo, Inc. Masking substrates for application of protective coatings
US9894776B2 (en) 2013-01-08 2018-02-13 Hzo, Inc. System for refurbishing or remanufacturing an electronic device
WO2014110039A2 (en) 2013-01-08 2014-07-17 Hzo, Inc. Removal of selected portions of protective coatings from substrates

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5829128A (en) * 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US5011580A (en) * 1989-10-24 1991-04-30 Microelectronics And Computer Technology Corporation Method of reworking an electrical multilayer interconnect
US5190637A (en) * 1992-04-24 1993-03-02 Wisconsin Alumni Research Foundation Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers
US5378583A (en) * 1992-12-22 1995-01-03 Wisconsin Alumni Research Foundation Formation of microstructures using a preformed photoresist sheet
US6064213A (en) * 1993-11-16 2000-05-16 Formfactor, Inc. Wafer-level burn-in and test
US6023103A (en) * 1994-11-15 2000-02-08 Formfactor, Inc. Chip-scale carrier for semiconductor devices including mounted spring contacts
US5685491A (en) * 1995-01-11 1997-11-11 Amtx, Inc. Electroformed multilayer spray director and a process for the preparation thereof
US5718618A (en) * 1996-02-09 1998-02-17 Wisconsin Alumni Research Foundation Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US5866281A (en) * 1996-11-27 1999-02-02 Wisconsin Alumni Research Foundation Alignment method for multi-level deep x-ray lithography utilizing alignment holes and posts
US5801100A (en) * 1997-03-07 1998-09-01 Industrial Technology Research Institute Electroless copper plating method for forming integrated circuit structures
JP3269827B2 (en) * 1997-04-04 2002-04-02 ユニバーシティ・オブ・サザン・カリフォルニア Articles, methods and apparatus for electrochemical manufacturing
US6008102A (en) * 1998-04-09 1999-12-28 Motorola, Inc. Method of forming a three-dimensional integrated inductor
US6255126B1 (en) * 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
EP1173893A4 (en) * 1999-01-15 2007-08-01 Univ California Polycrystalline silicon germanium films for forming micro-electromechanical systems
US6569701B2 (en) * 2001-10-25 2003-05-27 Rockwell Automation Technologies, Inc. Method for fabricating an isolated microelectromechanical system device
TWI227285B (en) * 2001-10-15 2005-02-01 Univ Southern California Methods of and apparatus for producing a three-dimensional structure
US7160429B2 (en) * 2002-05-07 2007-01-09 Microfabrica Inc. Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures
US7259640B2 (en) * 2001-12-03 2007-08-21 Microfabrica Miniature RF and microwave components and methods for fabricating such components
US20030221968A1 (en) * 2002-03-13 2003-12-04 Memgen Corporation Electrochemical fabrication method and apparatus for producing three-dimensional structures having improved surface finish
CN100567581C (en) * 2002-05-07 2009-12-09 微制造公司 The multistep release method of electrochemically fabricated structures
US20040065550A1 (en) * 2002-05-07 2004-04-08 University Of Southern California Electrochemical fabrication methods with enhanced post deposition processing
AU2003229023A1 (en) * 2002-05-07 2003-11-11 University Of Southern California Conformable contact masking methods and apparatus utilizing in situ cathodic activation of a substrate
AU2003228975A1 (en) * 2002-05-07 2003-11-11 Memgen Corporation Methods of and apparatus for molding structures
CN100582318C (en) * 2002-05-07 2010-01-20 南加州大学 Methods and apparatus for monitoring deposition quality during conformable contact mask plating operations
EP1576206A2 (en) * 2002-05-07 2005-09-21 Microfabrica Inc. Method of and apparatus for forming three-dimensional structures
WO2003095710A2 (en) * 2002-05-07 2003-11-20 Memgen Corporation Methods of and apparatus for electrochemically fabricating structures
WO2003095711A2 (en) * 2002-05-07 2003-11-20 Memgen Corporation Electrochemically fabricated structures having dielectric or active bases

Also Published As

Publication number Publication date
WO2003095712A2 (en) 2003-11-20
WO2003095712A3 (en) 2005-08-18
AU2003228977A1 (en) 2003-11-11
US20070221505A1 (en) 2007-09-27
US20040065554A1 (en) 2004-04-08

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Free format text: IN VOL 18, NO 2, PAGE(S) 606 UNDER THE HEADING APPLICATIONS OPI - NAME INDEX UNDER THE NAME UNIVERSITY OF SOUTHERN CALIFORNIA , APPLICATION NO. 2003228977 , UNDER INID (43) CORRECT THE PUBLICATION DATE TO READ 24.11.2003