AU2003223027A1 - Solution for removal of post dry etching residues - Google Patents

Solution for removal of post dry etching residues

Info

Publication number
AU2003223027A1
AU2003223027A1 AU2003223027A AU2003223027A AU2003223027A1 AU 2003223027 A1 AU2003223027 A1 AU 2003223027A1 AU 2003223027 A AU2003223027 A AU 2003223027A AU 2003223027 A AU2003223027 A AU 2003223027A AU 2003223027 A1 AU2003223027 A1 AU 2003223027A1
Authority
AU
Australia
Prior art keywords
removal
solution
dry etching
etching residues
post dry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003223027A
Inventor
Ying-Hao Li
Chih-Peng Lu
Wen-Shoei Sheen
Kwo-Hung Shen
Jack Ting
Sheng-Hung Tu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Merck Kanto Advanced Chemical Ltd
Original Assignee
Merck Kanto Advanced Chemical Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Kanto Advanced Chemical Ltd filed Critical Merck Kanto Advanced Chemical Ltd
Publication of AU2003223027A1 publication Critical patent/AU2003223027A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/042—Acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/046—Salts
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/39—Organic or inorganic per-compounds
    • C11D3/3947—Liquid compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
AU2003223027A 2003-01-30 2003-05-02 Solution for removal of post dry etching residues Abandoned AU2003223027A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
TW92102154 2003-01-30
TW092102154A TWI304439B (en) 2003-01-30 2003-01-30 Solution for removal residue of post dry etch
PCT/IB2003/001720 WO2004067692A1 (en) 2003-01-30 2003-05-02 Solution for removal of post dry etching residues

Publications (1)

Publication Number Publication Date
AU2003223027A1 true AU2003223027A1 (en) 2004-08-23

Family

ID=32823097

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003223027A Abandoned AU2003223027A1 (en) 2003-01-30 2003-05-02 Solution for removal of post dry etching residues

Country Status (3)

Country Link
AU (1) AU2003223027A1 (en)
TW (1) TWI304439B (en)
WO (1) WO2004067692A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006031149A1 (en) 2006-07-04 2008-01-10 Merck Patent Gmbh fluorosurfactants
DE102006031151A1 (en) 2006-07-04 2008-01-10 Merck Patent Gmbh fluorosurfactants
KR20200118368A (en) * 2019-04-03 2020-10-15 조이풀니스 어드밴스드 케미칼 컴퍼니 리미티드 Cleaning composition for removing etching residue
CN114273320B (en) * 2021-12-23 2022-11-08 江阴江化微电子材料股份有限公司 Semiconductor wafer dry etching post-cleaning process

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2894717B2 (en) * 1989-03-15 1999-05-24 日産化学工業株式会社 Low surface tension sulfuric acid composition
US6630074B1 (en) * 1997-04-04 2003-10-07 International Business Machines Corporation Etching composition and use thereof
CN1127552C (en) * 2001-01-05 2003-11-12 中国石油化工股份有限公司 Soaking solution and its prepn

Also Published As

Publication number Publication date
TWI304439B (en) 2008-12-21
WO2004067692A1 (en) 2004-08-12
TW200413501A (en) 2004-08-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase