AU2003222780A1 - Micro-reactor and micro-channel heat exchanger - Google Patents

Micro-reactor and micro-channel heat exchanger

Info

Publication number
AU2003222780A1
AU2003222780A1 AU2003222780A AU2003222780A AU2003222780A1 AU 2003222780 A1 AU2003222780 A1 AU 2003222780A1 AU 2003222780 A AU2003222780 A AU 2003222780A AU 2003222780 A AU2003222780 A AU 2003222780A AU 2003222780 A1 AU2003222780 A1 AU 2003222780A1
Authority
AU
Australia
Prior art keywords
micro
reactor
heat exchanger
channel heat
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003222780A
Inventor
Peter Prechtl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU2003222780A1 publication Critical patent/AU2003222780A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/0093—Microreactors, e.g. miniaturised or microfabricated reactors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0031—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
    • F28D9/0037—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the conduits for the other heat-exchange medium also being formed by paired plates touching each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00781—Aspects relating to microreactors
    • B01J2219/00783—Laminate assemblies, i.e. the reactor comprising a stack of plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00781—Aspects relating to microreactors
    • B01J2219/00819—Materials of construction
    • B01J2219/00822—Metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00781—Aspects relating to microreactors
    • B01J2219/00819—Materials of construction
    • B01J2219/00835—Comprising catalytically active material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00781—Aspects relating to microreactors
    • B01J2219/00851—Additional features
    • B01J2219/00871—Modular assembly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00781—Aspects relating to microreactors
    • B01J2219/00873—Heat exchange
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00781—Aspects relating to microreactors
    • B01J2219/00993—Design aspects
    • B01J2219/00997—Strategical arrangements of multiple microreactor systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/10—Particular pattern of flow of the heat exchange media
    • F28F2250/104—Particular pattern of flow of the heat exchange media with parallel flow
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Micromachines (AREA)
AU2003222780A 2002-03-26 2003-03-26 Micro-reactor and micro-channel heat exchanger Abandoned AU2003222780A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10213500 2002-03-26
DE10213500.2 2002-03-26
PCT/EP2003/003137 WO2003080233A1 (en) 2002-03-26 2003-03-26 Micro-reactor and micro-channel heat exchanger

Publications (1)

Publication Number Publication Date
AU2003222780A1 true AU2003222780A1 (en) 2003-10-08

Family

ID=27815959

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003222780A Abandoned AU2003222780A1 (en) 2002-03-26 2003-03-26 Micro-reactor and micro-channel heat exchanger

Country Status (4)

Country Link
EP (1) EP1506054B1 (en)
AU (1) AU2003222780A1 (en)
DE (1) DE10313685A1 (en)
WO (1) WO2003080233A1 (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7422910B2 (en) 2003-10-27 2008-09-09 Velocys Manifold designs, and flow control in multichannel microchannel devices
US7633752B2 (en) * 2004-03-29 2009-12-15 Intel Corporation Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
DE102004054334B4 (en) * 2004-11-10 2007-06-21 Man Dwe Gmbh Microstructure reactor
DE102004057497B4 (en) * 2004-11-29 2012-01-12 Siemens Ag A heat exchange device and method of making the heat exchange device, and a device and heat exchange device assembly and method of making the assembly
DE102005008271A1 (en) * 2005-02-22 2006-08-24 Behr Gmbh & Co. Kg Micro heat transfer device for cooling electronic components has channels open at top and bottom, and closed towards side surfaces
WO2006110458A1 (en) 2005-04-08 2006-10-19 Velocys, Inc. Flow control through plural, parallel connecting channels to/from a manifold
DE102005017452B4 (en) * 2005-04-15 2008-01-31 INSTITUT FüR MIKROTECHNIK MAINZ GMBH microevaporator
US9101890B2 (en) 2005-05-25 2015-08-11 Velocys, Inc. Support for use in microchannel processing
DE102005029074B3 (en) * 2005-06-23 2006-08-10 Wieland-Werke Ag Heat exchanger for cooling e.g. microprocessor, has heat exchanging unit (3) with inner structure that runs in flow direction for increasing heat transfer and extends in inner space from lower side to upper side
DE102005033150A1 (en) 2005-07-13 2007-01-25 Atotech Deutschland Gmbh Microstructured cooler and its use
US20070246106A1 (en) 2006-04-25 2007-10-25 Velocys Inc. Flow Distribution Channels To Control Flow in Process Channels
KR20080060932A (en) * 2006-12-27 2008-07-02 엘지전자 주식회사 Heat exchanger for a ventilating apparatus
KR100826023B1 (en) * 2006-12-28 2008-04-28 엘지전자 주식회사 Heat exchanger for a ventilating apparatus
DE102007020888A1 (en) 2007-05-04 2008-11-06 Micro Systems Engineering Gmbh & Co. Kg Ceramic substrate material, method of making and using same and antenna or antenna array
DE102007049172A1 (en) 2007-10-13 2009-04-16 Micro Systems Engineering Gmbh & Co. Kg A microreactor and method of making the same and method of making a substrate for a microreactor
DE102008043352A1 (en) 2008-10-31 2010-05-06 Micro Systems Engineering Gmbh Ceramic substrate material, method of making and using same and antenna or antenna array
DE102009012493A1 (en) * 2009-03-12 2010-09-16 Behr Gmbh & Co. Kg Device for exchanging heat between two mediums in vehicle, has disk pairs stacked on each other in stacking direction, where flowing chamber and another flowing chamber are formed between two disks of disk pair or multiple disk pairs
EP2228615B1 (en) 2009-03-12 2018-04-25 MAHLE Behr GmbH & Co. KG Plate heat exchanger, in particular for heat recovery from exhaust gases of a motor vehicle
DE102009050016A1 (en) * 2009-05-27 2011-05-05 Modine Manufacturing Co., Racine Heat exchanger unit
DE102009022919A1 (en) * 2009-05-27 2010-12-02 Modine Manufacturing Co., Racine Heat exchanger unit i.e. oil cooler, for use in motor vehicle, has heat exchanger channels formed by plates, where partial stream is branched from coolant stream in inlet area usina cover plate and is guided through heat exchanger channels
DE102010003642A1 (en) 2010-03-15 2011-09-15 Fresenius Medical Care Deutschland Gmbh Cassette with a sensor for determining the difference between a first and a second liquid flow
DE102010028959A1 (en) * 2010-05-12 2011-11-17 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Media guide unit of a fuel cell or a fuel cell assembly
DE102012203202A1 (en) * 2012-03-01 2013-09-05 Lars Nordwig Device, preferably a microreactor useful for thermochemical splitting of water
EP2962052B1 (en) * 2013-03-02 2020-02-12 James Carl Loebig Microchannel heat exchanger and methods of manufacture
EP2910887B1 (en) * 2014-02-21 2019-06-26 Rolls-Royce Corporation Microchannel heat exchangers for gas turbine intercooling and condensing as well as corresponding method
CN107275299B (en) * 2017-05-26 2019-08-20 北京大学 A kind of micro-channel heat exchanger and preparation method thereof
CN107702566A (en) * 2017-09-14 2018-02-16 华北电力大学 A kind of dot matrix heat exchanger

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4516632A (en) * 1982-08-31 1985-05-14 The United States Of America As Represented By The United States Deparment Of Energy Microchannel crossflow fluid heat exchanger and method for its fabrication
US5727618A (en) * 1993-08-23 1998-03-17 Sdl Inc Modular microchannel heat exchanger
DE19608824A1 (en) * 1996-03-07 1997-09-18 Inst Mikrotechnik Mainz Gmbh Process for the production of micro heat exchangers
DE19708472C2 (en) * 1997-02-20 1999-02-18 Atotech Deutschland Gmbh Manufacturing process for chemical microreactors
DE19741645A1 (en) * 1997-09-22 1999-03-25 Bayer Ag Method and device for the oxidation of organic compounds in the liquid phase using peroxidic oxidizing agents
DE19801374C1 (en) * 1998-01-16 1999-03-11 Dbb Fuel Cell Engines Gmbh Method for soldering micro structured sheet metal elements
DE19959249A1 (en) * 1999-12-08 2001-07-19 Inst Mikrotechnik Mainz Gmbh Modular micro reaction system

Also Published As

Publication number Publication date
EP1506054A1 (en) 2005-02-16
WO2003080233A1 (en) 2003-10-02
EP1506054B1 (en) 2012-07-25
DE10313685A1 (en) 2003-10-09

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase