AU2003216160A1 - Signal wire shielding technique - Google Patents

Signal wire shielding technique

Info

Publication number
AU2003216160A1
AU2003216160A1 AU2003216160A AU2003216160A AU2003216160A1 AU 2003216160 A1 AU2003216160 A1 AU 2003216160A1 AU 2003216160 A AU2003216160 A AU 2003216160A AU 2003216160 A AU2003216160 A AU 2003216160A AU 2003216160 A1 AU2003216160 A1 AU 2003216160A1
Authority
AU
Australia
Prior art keywords
signal wire
wire shielding
shielding technique
technique
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003216160A
Other versions
AU2003216160A8 (en
Inventor
Sudhakar Bobba
Tyler J. Thorp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sun Microsystems Inc
Original Assignee
Sun Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/071,379 external-priority patent/US7155695B2/en
Priority claimed from US10/071,365 external-priority patent/US6563336B1/en
Application filed by Sun Microsystems Inc filed Critical Sun Microsystems Inc
Publication of AU2003216160A1 publication Critical patent/AU2003216160A1/en
Publication of AU2003216160A8 publication Critical patent/AU2003216160A8/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5225—Shielding layers formed together with wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H01L23/5286—Arrangements of power or ground buses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU2003216160A 2002-02-06 2003-02-04 Signal wire shielding technique Abandoned AU2003216160A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US10/071,379 US7155695B2 (en) 2002-02-06 2002-02-06 Signal shielding technique using active shields for non-interacting driver design
US10/071,365 2002-02-06
US10/071,365 US6563336B1 (en) 2002-02-06 2002-02-06 Signal shielding assignment technique for precharge based logic
US10/071,379 2002-02-06
PCT/US2003/003239 WO2003067609A2 (en) 2002-02-06 2003-02-04 Signal wire shielding technique

Publications (2)

Publication Number Publication Date
AU2003216160A1 true AU2003216160A1 (en) 2003-09-02
AU2003216160A8 AU2003216160A8 (en) 2003-09-02

Family

ID=27736803

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003216160A Abandoned AU2003216160A1 (en) 2002-02-06 2003-02-04 Signal wire shielding technique

Country Status (2)

Country Link
AU (1) AU2003216160A1 (en)
WO (1) WO2003067609A2 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3249871B2 (en) * 1993-12-22 2002-01-21 三菱電機株式会社 Semiconductor storage device
TW462055B (en) * 1999-04-28 2001-11-01 Fujitsu Ltd Semiconductor memory device
JP3924107B2 (en) * 2000-03-09 2007-06-06 富士通株式会社 Semiconductor integrated circuit

Also Published As

Publication number Publication date
AU2003216160A8 (en) 2003-09-02
WO2003067609A3 (en) 2004-07-22
WO2003067609A2 (en) 2003-08-14

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase