AU2002368332A1 - Shielding for electronic components and/or circuits that are sensitive to electromagnetic interference (emi) - Google Patents

Shielding for electronic components and/or circuits that are sensitive to electromagnetic interference (emi)

Info

Publication number
AU2002368332A1
AU2002368332A1 AU2002368332A AU2002368332A AU2002368332A1 AU 2002368332 A1 AU2002368332 A1 AU 2002368332A1 AU 2002368332 A AU2002368332 A AU 2002368332A AU 2002368332 A AU2002368332 A AU 2002368332A AU 2002368332 A1 AU2002368332 A1 AU 2002368332A1
Authority
AU
Australia
Prior art keywords
emi
shielding
sensitive
circuits
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002368332A
Inventor
Georg Busch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of AU2002368332A1 publication Critical patent/AU2002368332A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
AU2002368332A 2002-11-08 2002-11-08 Shielding for electronic components and/or circuits that are sensitive to electromagnetic interference (emi) Abandoned AU2002368332A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE2002/004149 WO2004042820A1 (en) 2002-11-08 2002-11-08 Shielding for electronic components and/or circuits that are sensitive to electromagnetic interference (emi)

Publications (1)

Publication Number Publication Date
AU2002368332A1 true AU2002368332A1 (en) 2004-06-07

Family

ID=32304092

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002368332A Abandoned AU2002368332A1 (en) 2002-11-08 2002-11-08 Shielding for electronic components and/or circuits that are sensitive to electromagnetic interference (emi)

Country Status (2)

Country Link
AU (1) AU2002368332A1 (en)
WO (1) WO2004042820A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2932355A1 (en) * 2008-06-06 2009-12-11 Thales Sa Ball grid array type microwave case for receiving amplifiers, has dividing unit i.e. partition, dividing closed cavity, formed by platform and cap, into two chambers, and microwave access provided between chambers
CN112533349B (en) * 2019-09-18 2022-07-19 宏启胜精密电子(秦皇岛)有限公司 Circuit board and manufacturing method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5256590A (en) * 1989-11-24 1993-10-26 Mitsubishi Denki Kabushiki Kaisha Method of making a shielded semiconductor device
JP2000507045A (en) * 1996-03-22 2000-06-06 テレフオンアクチーボラゲツト エル エム エリクソン Semiconductor device shielded by conductive pin array and method of manufacturing the same
JPH10209374A (en) * 1997-01-21 1998-08-07 Murata Mfg Co Ltd Integration device

Also Published As

Publication number Publication date
WO2004042820A1 (en) 2004-05-21

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase