AU2002308965A1 - Heat-conductive silicone composition - Google Patents

Heat-conductive silicone composition

Info

Publication number
AU2002308965A1
AU2002308965A1 AU2002308965A AU2002308965A AU2002308965A1 AU 2002308965 A1 AU2002308965 A1 AU 2002308965A1 AU 2002308965 A AU2002308965 A AU 2002308965A AU 2002308965 A AU2002308965 A AU 2002308965A AU 2002308965 A1 AU2002308965 A1 AU 2002308965A1
Authority
AU
Australia
Prior art keywords
heat
silicone composition
conductive silicone
conductive
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002308965A
Inventor
Hiroji Enami
Hiroshi Fukui
Tadashi Okawa
Masayuki Onishi
Satoshi Onodera
Manabu Sutoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone Co Ltd filed Critical Dow Corning Toray Silicone Co Ltd
Publication of AU2002308965A1 publication Critical patent/AU2002308965A1/en
Abandoned legal-status Critical Current

Links

AU2002308965A 2001-05-14 2002-05-14 Heat-conductive silicone composition Abandoned AU2002308965A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-143109 2001-05-14
JP2001-151356 2001-05-21
JP2001-221952 2001-07-23

Publications (1)

Publication Number Publication Date
AU2002308965A1 true AU2002308965A1 (en) 2002-11-25

Family

ID=

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