AU2002256362A1 - Pin grid array package socket - Google Patents

Pin grid array package socket

Info

Publication number
AU2002256362A1
AU2002256362A1 AU2002256362A AU2002256362A AU2002256362A1 AU 2002256362 A1 AU2002256362 A1 AU 2002256362A1 AU 2002256362 A AU2002256362 A AU 2002256362A AU 2002256362 A AU2002256362 A AU 2002256362A AU 2002256362 A1 AU2002256362 A1 AU 2002256362A1
Authority
AU
Australia
Prior art keywords
grid array
array package
pin grid
package socket
socket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002256362A
Inventor
Toshihisa Hirata
Masami Sasao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Molex LLC
Original Assignee
Molex LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex LLC filed Critical Molex LLC
Publication of AU2002256362A1 publication Critical patent/AU2002256362A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
AU2002256362A 2001-04-25 2002-04-25 Pin grid array package socket Abandoned AU2002256362A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001127737A JP2002329562A (en) 2001-04-25 2001-04-25 Socket for pin grid array package
JP2001-127737 2001-04-25
PCT/US2002/013176 WO2002087292A2 (en) 2001-04-25 2002-04-25 Pin grid array package socket

Publications (1)

Publication Number Publication Date
AU2002256362A1 true AU2002256362A1 (en) 2002-11-05

Family

ID=18976545

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002256362A Abandoned AU2002256362A1 (en) 2001-04-25 2002-04-25 Pin grid array package socket

Country Status (5)

Country Link
JP (1) JP2002329562A (en)
CN (1) CN100344216C (en)
AU (1) AU2002256362A1 (en)
TW (1) TW529826U (en)
WO (1) WO2002087292A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4671592B2 (en) * 2003-09-24 2011-04-20 京セラ株式会社 Ceramic heater
JP4076170B2 (en) 2004-08-16 2008-04-16 日本航空電子工業株式会社 connector

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3066586B2 (en) * 1998-12-05 2000-07-17 モレックス インコーポレーテッド Socket for pin grid array package
SG89335A1 (en) * 1999-07-09 2002-06-18 Molex Inc Socket for pin grid array package

Also Published As

Publication number Publication date
WO2002087292A2 (en) 2002-10-31
CN100344216C (en) 2007-10-17
CN1505919A (en) 2004-06-16
JP2002329562A (en) 2002-11-15
WO2002087292A3 (en) 2003-10-23
TW529826U (en) 2003-04-21

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase