AU2002240791A1 - Production of electrical connections in substrate openings on circuit units by means of angularly directed deposition of conducting layers - Google Patents

Production of electrical connections in substrate openings on circuit units by means of angularly directed deposition of conducting layers

Info

Publication number
AU2002240791A1
AU2002240791A1 AU2002240791A AU2002240791A AU2002240791A1 AU 2002240791 A1 AU2002240791 A1 AU 2002240791A1 AU 2002240791 A AU2002240791 A AU 2002240791A AU 2002240791 A AU2002240791 A AU 2002240791A AU 2002240791 A1 AU2002240791 A1 AU 2002240791A1
Authority
AU
Australia
Prior art keywords
production
electrical connections
circuit units
conducting layers
angularly directed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002240791A
Other languages
English (en)
Inventor
Titus Rinke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universitaet Stuttgart
Original Assignee
Universitaet Stuttgart
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universitaet Stuttgart filed Critical Universitaet Stuttgart
Publication of AU2002240791A1 publication Critical patent/AU2002240791A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
    • H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
    • H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
    • H01L31/0465—PV modules composed of a plurality of thin film solar cells deposited on the same substrate comprising particular structures for the electrical interconnection of adjacent PV cells in the module
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1892—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates
    • H01L31/1896—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates for thin-film semiconductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
AU2002240791A 2001-01-24 2002-01-23 Production of electrical connections in substrate openings on circuit units by means of angularly directed deposition of conducting layers Abandoned AU2002240791A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10103114A DE10103114A1 (de) 2001-01-24 2001-01-24 Herstellen elektrischer Verbindungen in Substratöffnungen von Schaltungseinheiten mittels gerichteter Abscheidung leitfähiger Schichten
DE10103114.9 2001-01-24
PCT/DE2002/000208 WO2002059981A2 (de) 2001-01-24 2002-01-23 Herstellen elektrischer verbindungen in substratöffnungen von schaltungseinheiten mittels schräg gerichteter abscheidung leitfähiger schichten

Publications (1)

Publication Number Publication Date
AU2002240791A1 true AU2002240791A1 (en) 2002-08-06

Family

ID=7671582

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002240791A Abandoned AU2002240791A1 (en) 2001-01-24 2002-01-23 Production of electrical connections in substrate openings on circuit units by means of angularly directed deposition of conducting layers

Country Status (3)

Country Link
AU (1) AU2002240791A1 (de)
DE (2) DE10103114A1 (de)
WO (1) WO2002059981A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4981020B2 (ja) 2005-03-16 2012-07-18 コリア アドバンスト インスティテュート オブ サイエンス アンド テクノロジー 集積型薄膜太陽電池、その製造方法と集積型薄膜太陽電池用透明電極の加工方法、その構造及びその透明電極が形成された透明基板
KR100656738B1 (ko) * 2005-12-14 2006-12-14 한국과학기술원 집적형 박막 태양전지 및 그 제조 방법
KR100725110B1 (ko) 2005-12-14 2007-06-04 한국과학기술원 투과형 집적형 박막 태양전지 및 그 제조 방법.
EP2724380B1 (de) 2011-06-23 2016-09-28 Big Solar Limited Verfahren zur herstellung einer struktur mit beschichtungsschritten und entsprechende anordnung
GB201301683D0 (en) 2013-01-30 2013-03-13 Big Solar Ltd Method of creating non-conductive delineations with a selective coating technology on a structured surface
GB2549134B (en) 2016-04-07 2020-02-12 Power Roll Ltd Asymmetric groove
GB2549132A (en) 2016-04-07 2017-10-11 Big Solar Ltd Aperture in a semiconductor
GB2549133B (en) 2016-04-07 2020-02-19 Power Roll Ltd Gap between semiconductors
GB201617276D0 (en) 2016-10-11 2016-11-23 Big Solar Limited Energy storage

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0362418A1 (de) * 1988-10-03 1990-04-11 International Business Machines Corporation Methode und System für die winklige Belichtung eines Oberflächeteils mit einer schrägeinfallenden Strahlung und nach dieser Methode belichtete halbleitende Scheibe
DE4033658A1 (de) * 1990-10-23 1992-04-30 Siemens Ag Verfahren zur bearbeitung von grabenflanken in halbleitersubstraten
US5885425A (en) * 1995-06-06 1999-03-23 International Business Machines Corporation Method for selective material deposition on one side of raised or recessed features
AUPN606395A0 (en) * 1995-10-19 1995-11-09 Unisearch Limited Metallization of buried contact solar cells
US5909458A (en) * 1996-11-27 1999-06-01 The Regents Of The University Of California Low-cost laser diode array
DE19819200B4 (de) * 1998-04-29 2006-01-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Solarzelle mit Kontaktstrukturen und Verfahren zur Herstellung der Kontaktstrukturen

Also Published As

Publication number Publication date
DE10290245D2 (de) 2004-04-15
WO2002059981A3 (de) 2002-11-28
DE10103114A1 (de) 2002-10-31
WO2002059981A2 (de) 2002-08-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase