AU2002239782A1 - Parallel plate development with the application of a differential voltage - Google Patents

Parallel plate development with the application of a differential voltage

Info

Publication number
AU2002239782A1
AU2002239782A1 AU2002239782A AU3978202A AU2002239782A1 AU 2002239782 A1 AU2002239782 A1 AU 2002239782A1 AU 2002239782 A AU2002239782 A AU 2002239782A AU 3978202 A AU3978202 A AU 3978202A AU 2002239782 A1 AU2002239782 A1 AU 2002239782A1
Authority
AU
Australia
Prior art keywords
application
parallel plate
differential voltage
plate development
development
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002239782A
Inventor
Michael K. Templeton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2002239782A1 publication Critical patent/AU2002239782A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3007—Imagewise removal using liquid means combined with electrical means, e.g. force fields

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AU2002239782A 2000-10-25 2001-10-23 Parallel plate development with the application of a differential voltage Abandoned AU2002239782A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US24308000P 2000-10-25 2000-10-25
US60/243,080 2000-10-25
US09/973,034 2001-10-09
US09/973,034 US6830389B2 (en) 2000-10-25 2001-10-09 Parallel plate development with the application of a differential voltage
PCT/US2001/051290 WO2002043122A2 (en) 2000-10-25 2001-10-23 Parallel plate development with the application of a differential voltage

Publications (1)

Publication Number Publication Date
AU2002239782A1 true AU2002239782A1 (en) 2002-06-03

Family

ID=26935573

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002239782A Abandoned AU2002239782A1 (en) 2000-10-25 2001-10-23 Parallel plate development with the application of a differential voltage

Country Status (6)

Country Link
US (1) US6830389B2 (en)
EP (1) EP1330834B1 (en)
AU (1) AU2002239782A1 (en)
DE (1) DE60119363T2 (en)
TW (1) TW507261B (en)
WO (1) WO2002043122A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6796517B1 (en) * 2000-03-09 2004-09-28 Advanced Micro Devices, Inc. Apparatus for the application of developing solution to a semiconductor wafer
US7101796B2 (en) * 2002-08-14 2006-09-05 United Microelectronics Corp. Method for forming a plane structure
US6793418B1 (en) * 2003-05-28 2004-09-21 Anocoil Corporation Method and apparatus for applying a film of fluid onto a flat surface and specifically onto a lithographic printing plate in a developing station
KR100515369B1 (en) * 2003-10-02 2005-09-14 동부아남반도체 주식회사 Apparatus for forming fine patterns of semiconductor wafer by electric field and the method of the same
US7374867B2 (en) * 2003-10-06 2008-05-20 Intel Corporation Enhancing photoresist performance using electric fields
JP4527670B2 (en) * 2006-01-25 2010-08-18 東京エレクトロン株式会社 Heat treatment apparatus, heat treatment method, control program, and computer-readable storage medium
US7966968B2 (en) * 2007-04-27 2011-06-28 Taiwan Semiconductor Manufacturing Company, Ltd. Electroless plating apparatus with non-liquid heating source
CN102387862B (en) * 2009-04-03 2014-05-28 株式会社科特拉 Method and device for manufacturing exhaust emission control catalyst and nozzle used for the device
JP6215787B2 (en) 2014-07-25 2017-10-18 東京エレクトロン株式会社 Development method, development apparatus, and computer-readable recording medium
US9829790B2 (en) * 2015-06-08 2017-11-28 Applied Materials, Inc. Immersion field guided exposure and post-exposure bake process
US11747729B2 (en) * 2021-03-19 2023-09-05 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor developer tool and methods of operation

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4021278A (en) * 1975-12-12 1977-05-03 International Business Machines Corporation Reduced meniscus-contained method of handling fluids in the manufacture of semiconductor wafers
US4292384A (en) * 1977-09-30 1981-09-29 Horizons Research Incorporated Gaseous plasma developing and etching process employing low voltage DC generation
US4373991A (en) * 1982-01-28 1983-02-15 Western Electric Company, Inc. Methods and apparatus for polishing a semiconductor wafer
US4544446A (en) * 1984-07-24 1985-10-01 J. T. Baker Chemical Co. VLSI chemical reactor
US4922277A (en) * 1988-11-28 1990-05-01 The United States Of America As Represented By The Secretary Of The Air Force Silicon wafer photoresist developer
US5275690A (en) * 1992-06-17 1994-01-04 Santa Barbara Research Center Method and apparatus for wet chemical processing of semiconductor wafers and other objects
JPH08293452A (en) * 1995-04-25 1996-11-05 Mitsubishi Electric Corp Resist coater
US6076979A (en) * 1997-07-25 2000-06-20 Dainippon Screen Mfg. Co., Ltd. Method of and apparatus for supplying developing solution onto substrate
US6190063B1 (en) * 1998-01-09 2001-02-20 Tokyo Electron Ltd. Developing method and apparatus
JPH11340119A (en) * 1998-05-26 1999-12-10 Tokyo Electron Ltd Method and device for development processing
JP3177969B2 (en) * 1998-12-07 2001-06-18 日本電気株式会社 Semiconductor substrate spin coating apparatus and spin coating method
US6458607B1 (en) * 2001-07-23 2002-10-01 Advanced Micro Devices, Inc. Using UV/VIS spectrophotometry to regulate developer solution during a development process

Also Published As

Publication number Publication date
DE60119363D1 (en) 2006-06-08
DE60119363T2 (en) 2007-05-10
EP1330834B1 (en) 2006-05-03
EP1330834A2 (en) 2003-07-30
WO2002043122A2 (en) 2002-05-30
US6830389B2 (en) 2004-12-14
US20020046703A1 (en) 2002-04-25
WO2002043122A3 (en) 2003-02-13
TW507261B (en) 2002-10-21

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