AU2002235169A1 - Mechanical housing - Google Patents
Mechanical housingInfo
- Publication number
- AU2002235169A1 AU2002235169A1 AU2002235169A AU3516902A AU2002235169A1 AU 2002235169 A1 AU2002235169 A1 AU 2002235169A1 AU 2002235169 A AU2002235169 A AU 2002235169A AU 3516902 A AU3516902 A AU 3516902A AU 2002235169 A1 AU2002235169 A1 AU 2002235169A1
- Authority
- AU
- Australia
- Prior art keywords
- mechanical housing
- housing
- mechanical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/035—Cooling of active equipments, e.g. air ducts
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/09—Frames or mounting racks not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q2201/00—Constructional details of selecting arrangements
- H04Q2201/06—Cooling arrangements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q2201/00—Constructional details of selecting arrangements
- H04Q2201/10—Housing details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q2201/00—Constructional details of selecting arrangements
- H04Q2201/12—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US24617400P | 2000-11-06 | 2000-11-06 | |
US608/246,174 | 2000-11-06 | ||
US09/804,129 | 2001-03-12 | ||
US09/804,129 US6628521B2 (en) | 2000-11-06 | 2001-03-12 | Mechanical housing |
PCT/US2001/047232 WO2002037912A2 (en) | 2000-11-06 | 2001-11-05 | Mechanical housing |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002235169A1 true AU2002235169A1 (en) | 2002-05-15 |
Family
ID=26937769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002235169A Abandoned AU2002235169A1 (en) | 2000-11-06 | 2001-11-05 | Mechanical housing |
Country Status (4)
Country | Link |
---|---|
US (4) | US6628521B2 (en) |
AU (1) | AU2002235169A1 (en) |
CA (1) | CA2428279C (en) |
WO (1) | WO2002037912A2 (en) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6900984B2 (en) * | 2001-04-24 | 2005-05-31 | Apple Computer, Inc. | Computer component protection |
KR20030073042A (en) * | 2002-03-08 | 2003-09-19 | 현대네트웍스 주식회사 | Device for cooling of outside the board type system in dsl |
US7031158B2 (en) * | 2002-10-30 | 2006-04-18 | Charles Industries, Ltd. | Heat pipe cooled electronics enclosure |
US6781830B2 (en) * | 2002-11-05 | 2004-08-24 | Adc Dsl Systems, Inc. | Methods and systems of heat transfer for electronic enclosures |
US6979772B2 (en) * | 2003-05-14 | 2005-12-27 | Chaun-Choung Technology Corp. | Integrated heat dissipating enclosure for electronic product |
US7164581B2 (en) * | 2004-06-21 | 2007-01-16 | Computer Network Technology Corp. | Modular chassis divided along a midplane and cooling system therefor |
US20060130221A1 (en) * | 2004-12-20 | 2006-06-22 | Bulala Cherie A | Multi-function toilet device |
US20070115635A1 (en) * | 2005-11-18 | 2007-05-24 | Low Andrew G | Passive cooling for fiber to the premise (FTTP) electronics |
US20080098634A1 (en) * | 2006-11-01 | 2008-05-01 | Skyline Products, Inc. | Outdoor display sign |
US7408782B2 (en) * | 2007-01-04 | 2008-08-05 | Tellabs Bedford, Inc. | Multiple printed circuit board heat transfer guide plates |
US7457123B1 (en) * | 2007-05-10 | 2008-11-25 | Adc Telecommunications, Inc. | Chassis mounted heat sink system |
US7450382B1 (en) | 2007-05-15 | 2008-11-11 | Adc Telecommunications, Inc. | Apparatus for enclosing electronic components |
US7535716B2 (en) * | 2007-05-23 | 2009-05-19 | Adc Telecommunications, Inc. | Apparatus for enclosing electronic components used in telecommunication systems |
US7796376B2 (en) * | 2008-01-17 | 2010-09-14 | Yaskawa America, Inc. | Electrical enclosure cooling structure assembly and method |
WO2009113818A2 (en) * | 2008-03-12 | 2009-09-17 | Kmw Inc. | Enclosure device of wireless communication apparatus |
US7734040B1 (en) | 2008-03-25 | 2010-06-08 | Adtran, Inc. | Modular housing system for outside plant telecommunications equipment |
US7855891B1 (en) | 2008-03-25 | 2010-12-21 | Adtran, Inc. | Modular heat sinks for housings for electronic equipment |
US7646606B2 (en) * | 2008-05-13 | 2010-01-12 | Honeywell International Inc. | IGBT packaging and cooling using PCM and liquid |
US7915544B1 (en) | 2008-06-05 | 2011-03-29 | Adtran, Inc. | Cable seal apparatus and techniques for outside plant telecommunications housings |
WO2010028350A1 (en) * | 2008-09-08 | 2010-03-11 | Intergraph Technologies Company | Ruggedized computer capable of operating in high-temperature environments |
US20100242590A1 (en) * | 2009-03-27 | 2010-09-30 | Daniel Measurement And Control, Inc. | Flow Meter and Temperature Stabilizing Cover Therefor |
EP2299582B1 (en) * | 2009-09-18 | 2015-03-11 | SMA Solar Technology AG | Inverter with a housing and electric and electronic components assembled within same |
WO2011119926A2 (en) * | 2010-03-25 | 2011-09-29 | Porreca Paul J | Conduction-cooled apparatus and methods of forming said apparatus |
WO2012000166A1 (en) * | 2010-06-28 | 2012-01-05 | 中兴通讯股份有限公司 | Totally enclosed type integrated access system and method of reducing power consumption of the system |
US8427828B2 (en) * | 2010-07-20 | 2013-04-23 | Themis Computer | Printed circuit board module enclosure and apparatus using same |
US8537540B2 (en) * | 2010-11-02 | 2013-09-17 | Technology Advancement Group, Inc. | Field serviceable CPU module |
US20120120594A1 (en) * | 2010-11-12 | 2012-05-17 | Tien-Sheng Huang | Heat dissipating casing structure for main board |
WO2012104017A1 (en) * | 2011-02-04 | 2012-08-09 | Sew-Eurodrive Gmbh & Co. Kg | Electrical device |
US8830680B2 (en) * | 2011-07-18 | 2014-09-09 | Public Wireless, Inc. | Systems and methods for heat extraction in a power supply |
US20130050939A1 (en) * | 2011-08-28 | 2013-02-28 | Purewave Networks, Inc. | Methods and system for effectively removing heat from a wireless base station |
US9161478B2 (en) * | 2012-02-24 | 2015-10-13 | Futurewei Technologies, Inc. | Apparatus and method for an active antenna heat sink |
US9274548B2 (en) * | 2013-03-01 | 2016-03-01 | Seagate Technology Llc | Electronic apparatus comprising backplane and methods of assembling and disassembling |
US9912053B2 (en) | 2014-03-17 | 2018-03-06 | Ubiquiti Networks, Inc. | Array antennas having a plurality of directional beams |
US10327357B2 (en) * | 2014-09-18 | 2019-06-18 | Artesyn Embedded Computing, Inc. | Thermal conduction to a cylindrical shaft |
US9338907B2 (en) * | 2014-09-24 | 2016-05-10 | Hil Tech Llc | Thermally managed enclosure |
US10720683B2 (en) | 2014-09-30 | 2020-07-21 | Cps Technology Holdings Llc | Battery module thermal management features for internal flow |
US9825343B2 (en) | 2014-09-30 | 2017-11-21 | Johnson Controls Technology Company | Battery module passive thermal management features and positioning |
US10658717B2 (en) | 2014-09-30 | 2020-05-19 | Cps Technology Holdings Llc | Battery module active thermal management features and positioning |
US10164332B2 (en) | 2014-10-14 | 2018-12-25 | Ubiquiti Networks, Inc. | Multi-sector antennas |
US10284268B2 (en) * | 2015-02-23 | 2019-05-07 | Ubiquiti Networks, Inc. | Radio apparatuses for long-range communication of radio-frequency information |
TWM523267U (en) * | 2015-07-16 | 2016-06-01 | 鋐寶科技股份有限公司 | Electronic apparatus |
CN107040294B (en) | 2015-10-09 | 2020-10-16 | 优倍快公司 | Synchronized multiradio antenna system and method |
US10674641B2 (en) * | 2016-04-04 | 2020-06-02 | Hamilton Sundstrand Corporation | Immersion cooling systems and methods |
USD835040S1 (en) | 2016-09-09 | 2018-12-04 | Corning Research & Development Corporation | 1×4 distribution point unit |
DE102020001564A1 (en) * | 2019-04-10 | 2020-10-15 | Sew-Eurodrive Gmbh & Co Kg | Electrical device with housing part |
USD971192S1 (en) | 2019-06-03 | 2022-11-29 | Space Exploration Technologies Corp. | Antenna apparatus |
USD971900S1 (en) | 2019-06-03 | 2022-12-06 | Space Exploration Technologies Corp. | Antenna apparatus |
USD976242S1 (en) | 2019-06-03 | 2023-01-24 | Space Exploration Technologies Corp. | Antenna apparatus |
Family Cites Families (101)
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US336171A (en) * | 1886-02-16 | Vault-light | ||
US2737579A (en) | 1951-04-06 | 1956-03-06 | Acf Ind Inc | Amplifier assembly |
US2796559A (en) | 1952-09-11 | 1957-06-18 | Bendix Aviat Corp | Electrical apparatus |
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US2833966A (en) | 1956-06-13 | 1958-05-06 | George N Goodier | Heat conducting tube mount |
US3087095A (en) | 1959-12-28 | 1963-04-23 | Bell Telephone Labor Inc | Cushion mounting for electrical apparatus |
US3135321A (en) | 1960-03-07 | 1964-06-02 | Trane Co | Heat exchanger |
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US3487267A (en) | 1968-01-02 | 1969-12-30 | Jerrold Electronics Corp | Thermally conducting transistor support arms |
US3697929A (en) | 1971-01-18 | 1972-10-10 | Bunker Ramo | Controlled insertion force receptacle for flat circuit bearing elements |
US3767974A (en) | 1972-01-03 | 1973-10-23 | Cogar Corp | Insertion and extraction lever for printed circuit cards |
US3809798A (en) | 1972-09-06 | 1974-05-07 | H Simon | Angle type feedthrough cable clamp |
DE2443122B2 (en) | 1974-09-09 | 1979-05-17 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Device for high frequency and communications engineering |
US4184539A (en) | 1978-07-10 | 1980-01-22 | The United States Of America As Represented By The Secretary Of The Navy | Electronic card mount and heat transfer assembly for underwater vehicles |
US4172212A (en) | 1978-07-24 | 1979-10-23 | International Telephone And Telegraph Corporation | Submarine housing for submarine cable system repeater components or the like |
US4301494A (en) | 1979-09-28 | 1981-11-17 | Wescom, Inc. | Printed circuit board faceplate assembly |
US4259843A (en) * | 1979-10-09 | 1981-04-07 | Cromemco Inc. | Isolation chamber for electronic devices |
JPS5693634A (en) | 1979-12-26 | 1981-07-29 | Motoda Electronics Co Ltd | Device for sucking thin sheet |
DE3044314C2 (en) | 1980-11-25 | 1986-08-14 | kabelmetal electro GmbH, 3000 Hannover | Housing for accommodating printed circuits equipped with heat-generating electronic components |
JPS58105187A (en) | 1981-12-17 | 1983-06-22 | 佐瀬 英三 | Flour mill model harnessing water wheel |
DE3150166C2 (en) | 1981-12-18 | 1984-09-06 | ANT Nachrichtentechnik GmbH, 7150 Backnang | Cooling system for communications equipment with high power dissipation |
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US6396129B1 (en) * | 2001-03-05 | 2002-05-28 | Siliconware Precision Industries Co., Ltd. | Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor package |
US6406312B1 (en) | 2001-04-25 | 2002-06-18 | Juniper Networks, Inc. | Circuit card captivation and ejection mechanism including a lever to facilitate removal of the mechanism from a housing |
JP3673733B2 (en) | 2001-05-29 | 2005-07-20 | 株式会社ソニー・コンピュータエンタテインメント | Electronic device and board insertion / extraction apparatus for electronic device |
US6587339B1 (en) | 2002-03-29 | 2003-07-01 | Thornhurst Manufacturing, Inc. | Protective pot or container |
-
2001
- 2001-03-12 US US09/804,129 patent/US6628521B2/en not_active Expired - Lifetime
- 2001-11-05 CA CA2428279A patent/CA2428279C/en not_active Expired - Fee Related
- 2001-11-05 AU AU2002235169A patent/AU2002235169A1/en not_active Abandoned
- 2001-11-05 WO PCT/US2001/047232 patent/WO2002037912A2/en not_active Application Discontinuation
-
2003
- 2003-09-29 US US10/673,739 patent/US7075789B2/en not_active Expired - Lifetime
-
2006
- 2006-07-10 US US11/456,270 patent/US20070127212A1/en not_active Abandoned
-
2007
- 2007-10-31 US US11/932,103 patent/US7633757B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2002037912A3 (en) | 2003-05-30 |
CA2428279A1 (en) | 2002-05-10 |
US7633757B2 (en) | 2009-12-15 |
US7075789B2 (en) | 2006-07-11 |
US20040163552A1 (en) | 2004-08-26 |
US20020054481A1 (en) | 2002-05-09 |
US20080239674A1 (en) | 2008-10-02 |
US6628521B2 (en) | 2003-09-30 |
CA2428279C (en) | 2010-09-28 |
US20070127212A1 (en) | 2007-06-07 |
WO2002037912A2 (en) | 2002-05-10 |
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