AU2002234046A1 - Process for monitoring a process, planarizing a surface, and for quantifying the results of a planarization process - Google Patents

Process for monitoring a process, planarizing a surface, and for quantifying the results of a planarization process

Info

Publication number
AU2002234046A1
AU2002234046A1 AU2002234046A AU3404602A AU2002234046A1 AU 2002234046 A1 AU2002234046 A1 AU 2002234046A1 AU 2002234046 A AU2002234046 A AU 2002234046A AU 3404602 A AU3404602 A AU 3404602A AU 2002234046 A1 AU2002234046 A1 AU 2002234046A1
Authority
AU
Australia
Prior art keywords
planarizing
quantifying
monitoring
results
planarization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002234046A
Inventor
Nikolay Korovin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam IPEC Corp
Original Assignee
Speedfam IPEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam IPEC Corp filed Critical Speedfam IPEC Corp
Publication of AU2002234046A1 publication Critical patent/AU2002234046A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/03—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent according to the final size of the previously ground workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
AU2002234046A 2000-12-19 2001-12-19 Process for monitoring a process, planarizing a surface, and for quantifying the results of a planarization process Abandoned AU2002234046A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/741,461 US6503767B2 (en) 2000-12-19 2000-12-19 Process for monitoring a process, planarizing a surface, and for quantifying the results of a planarization process
US09/741,461 2000-12-19
PCT/US2001/048988 WO2002050893A2 (en) 2000-12-19 2001-12-19 Process for monitoring a process, planarizing a surface, and for quantifying the results of a planarization process

Publications (1)

Publication Number Publication Date
AU2002234046A1 true AU2002234046A1 (en) 2002-07-01

Family

ID=24980805

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002234046A Abandoned AU2002234046A1 (en) 2000-12-19 2001-12-19 Process for monitoring a process, planarizing a surface, and for quantifying the results of a planarization process

Country Status (3)

Country Link
US (1) US6503767B2 (en)
AU (1) AU2002234046A1 (en)
WO (1) WO2002050893A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003058687A1 (en) * 2001-12-31 2003-07-17 Tokyo Electron Limited Method of detecting, identifying and correcting process performance
US6613591B1 (en) * 2002-03-07 2003-09-02 Memc Electronic Materials, Inc. Method of estimating post-polishing waviness characteristics of a semiconductor wafer
US6790123B2 (en) * 2002-05-16 2004-09-14 Speedfam-Ipec Corporation Method for processing a work piece in a multi-zonal processing apparatus
JP4020739B2 (en) * 2002-09-27 2007-12-12 株式会社荏原製作所 Polishing device
JP4858395B2 (en) 2007-10-12 2012-01-18 パナソニック株式会社 Plasma processing equipment
WO2010025334A2 (en) * 2008-08-28 2010-03-04 Kla-Tencor Corporation Localized substrate geometry characterization
US8751033B2 (en) 2008-11-14 2014-06-10 Applied Materials, Inc. Adaptive tracking spectrum features for endpoint detection
US9588441B2 (en) 2012-05-18 2017-03-07 Kla-Tencor Corporation Method and device for using substrate geometry to determine optimum substrate analysis sampling
FR3006048A1 (en) * 2013-05-24 2014-11-28 Commissariat Energie Atomique METHOD OF CHARACTERIZING THE TOPOGRAPHY OF A SURFACE

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5337015A (en) * 1993-06-14 1994-08-09 International Business Machines Corporation In-situ endpoint detection method and apparatus for chemical-mechanical polishing using low amplitude input voltage
US5635083A (en) * 1993-08-06 1997-06-03 Intel Corporation Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate
KR100241537B1 (en) * 1996-06-21 2000-02-01 김영환 Interlayer planerizing method for semiconductor device
US5898106A (en) * 1997-09-25 1999-04-27 Digital Instruments, Inc. Method and apparatus for obtaining improved vertical metrology measurements
JP3884163B2 (en) * 1998-03-31 2007-02-21 信越半導体株式会社 Semiconductor substrate surface shape measuring apparatus and semiconductor substrate surface shape determining method
US6033921A (en) * 1998-04-06 2000-03-07 Advanced Micro Devices, Inc. Method for depositing a material of controlled, variable thickness across a surface for planarization of that surface
JPH11351857A (en) * 1998-06-08 1999-12-24 Kuroda Precision Ind Ltd Method and apparatus for measurement of surface shape of thin plate
JP2000146569A (en) * 1998-09-11 2000-05-26 Showa Denko Kk Periphery sagging measurement of semiconductor substrate
JP3404318B2 (en) * 1999-04-02 2003-05-06 黒田精工株式会社 Surface shape measurement method

Also Published As

Publication number Publication date
US20020086531A1 (en) 2002-07-04
US6503767B2 (en) 2003-01-07
WO2002050893A3 (en) 2004-01-08
WO2002050893A2 (en) 2002-06-27

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