AU2002227920A1 - Method and device for the metered delivery of low volumetric flows - Google Patents

Method and device for the metered delivery of low volumetric flows

Info

Publication number
AU2002227920A1
AU2002227920A1 AU2002227920A AU2792002A AU2002227920A1 AU 2002227920 A1 AU2002227920 A1 AU 2002227920A1 AU 2002227920 A AU2002227920 A AU 2002227920A AU 2792002 A AU2792002 A AU 2792002A AU 2002227920 A1 AU2002227920 A1 AU 2002227920A1
Authority
AU
Australia
Prior art keywords
low volumetric
volumetric flows
metered delivery
metered
delivery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002227920A
Inventor
Markus Jakob
Johannes Lindner
Gerd Strauch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aixtron SE
Original Assignee
Aixtron SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aixtron SE filed Critical Aixtron SE
Publication of AU2002227920A1 publication Critical patent/AU2002227920A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4486—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by producing an aerosol and subsequent evaporation of the droplets or particles
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Measuring Volume Flow (AREA)
  • Nozzles (AREA)
  • Flow Control (AREA)
AU2002227920A 2000-11-30 2001-11-10 Method and device for the metered delivery of low volumetric flows Abandoned AU2002227920A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10059386A DE10059386A1 (en) 2000-11-30 2000-11-30 Method and device for the metered delivery of small liquid volume flows
DE10059386.0 2000-11-30
PCT/EP2001/013074 WO2002044441A2 (en) 2000-11-30 2001-11-10 Method and device for the metered delivery of low volumetric flows

Publications (1)

Publication Number Publication Date
AU2002227920A1 true AU2002227920A1 (en) 2002-06-11

Family

ID=7665191

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002227920A Abandoned AU2002227920A1 (en) 2000-11-30 2001-11-10 Method and device for the metered delivery of low volumetric flows

Country Status (8)

Country Link
US (1) US20040035202A1 (en)
EP (1) EP1358364B1 (en)
JP (1) JP2004514997A (en)
KR (1) KR20030059263A (en)
AU (1) AU2002227920A1 (en)
DE (2) DE10059386A1 (en)
TW (1) TW500994B (en)
WO (1) WO2002044441A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7253084B2 (en) * 2004-09-03 2007-08-07 Asm America, Inc. Deposition from liquid sources
WO2007142850A2 (en) * 2006-06-02 2007-12-13 Applied Materials Gas flow control by differential pressure measurements
JP5690498B2 (en) * 2009-03-27 2015-03-25 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Method for depositing a film on a substrate and apparatus for delivering a vaporized precursor compound
DE102015223013A1 (en) 2015-11-23 2017-05-24 Sms Group Gmbh Flow control valve
GB2557670B (en) * 2016-12-15 2020-04-15 Thermo Fisher Scient Bremen Gmbh Improved gas flow control
US11459654B2 (en) 2020-11-19 2022-10-04 Eugenus, Inc. Liquid precursor injection for thin film deposition
CN115505899A (en) * 2022-08-16 2022-12-23 湖南顶立科技有限公司 Process gas source input device of deposition equipment and use method thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5934420B2 (en) * 1980-05-20 1984-08-22 ジエイ・シ−・シユ−マ−カ−・カンパニ− chemical vapor distribution system
US4754737A (en) * 1984-05-08 1988-07-05 Mitsubishi Jidosha Kogyo Kabushiki Kaisha Fuel injection pump device and method for settling the same
CH672850A5 (en) * 1986-07-25 1989-12-29 Jakob Dr Nat Oec Rothenberger
US4990061A (en) * 1987-11-03 1991-02-05 Fowler Elton D Fluid controlled gas lift pump
JPH0769315B2 (en) * 1992-04-06 1995-07-26 株式会社島津製作所 Gas chromatograph
JP2703694B2 (en) * 1992-05-28 1998-01-26 信越半導体株式会社 Gas supply device
JPH06295862A (en) * 1992-11-20 1994-10-21 Mitsubishi Electric Corp Compound semiconductor fabrication system and organic metal material vessel
US5399388A (en) * 1994-02-28 1995-03-21 The United States Of America As Represented By The Secretary Of The Navy Method of forming thin films on substrates at low temperatures
JP2996101B2 (en) * 1994-08-05 1999-12-27 信越半導体株式会社 Liquid source gas supply method and apparatus
US6135433A (en) * 1998-02-27 2000-10-24 Air Liquide America Corporation Continuous gas saturation system and method
US6406545B2 (en) * 1999-07-27 2002-06-18 Kabushiki Kaisha Toshiba Semiconductor workpiece processing apparatus and method
US6591850B2 (en) * 2001-06-29 2003-07-15 Applied Materials, Inc. Method and apparatus for fluid flow control

Also Published As

Publication number Publication date
US20040035202A1 (en) 2004-02-26
WO2002044441A3 (en) 2003-09-12
TW500994B (en) 2002-09-01
EP1358364B1 (en) 2004-07-21
DE10059386A1 (en) 2002-06-13
KR20030059263A (en) 2003-07-07
JP2004514997A (en) 2004-05-20
EP1358364A2 (en) 2003-11-05
WO2002044441A2 (en) 2002-06-06
DE50102949D1 (en) 2004-08-26

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