AU2002222917A1 - Conduction-convection atmosphere reflowing or polymerisation method and device therefor - Google Patents

Conduction-convection atmosphere reflowing or polymerisation method and device therefor

Info

Publication number
AU2002222917A1
AU2002222917A1 AU2002222917A AU2291702A AU2002222917A1 AU 2002222917 A1 AU2002222917 A1 AU 2002222917A1 AU 2002222917 A AU2002222917 A AU 2002222917A AU 2291702 A AU2291702 A AU 2291702A AU 2002222917 A1 AU2002222917 A1 AU 2002222917A1
Authority
AU
Australia
Prior art keywords
reflowing
conduction
device therefor
polymerisation method
convection atmosphere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002222917A
Inventor
Francis Bourrieres
Clement Kaiser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NOVATEC Ste
Original Assignee
NOVATEC SOC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR0009485A external-priority patent/FR2812079B1/en
Application filed by NOVATEC SOC filed Critical NOVATEC SOC
Publication of AU2002222917A1 publication Critical patent/AU2002222917A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/008Soldering within a furnace
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/40Semiconductor devices
AU2002222917A 2000-07-19 2001-07-06 Conduction-convection atmosphere reflowing or polymerisation method and device therefor Abandoned AU2002222917A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
FR0009485A FR2812079B1 (en) 2000-07-19 2000-07-19 HELIUM CONDUCTO-CONVECTIVE FURNACE
FR0009485 2000-07-19
FR0104473A FR2812080B1 (en) 2000-07-19 2001-04-03 CONDUCTO-CONVECTIVE ATMOSPHERE REFLING OR POLYMERIZATION METHOD AND DEVICE FOR IMPLEMENTING THE SAME
FR0104473 2001-04-03
PCT/FR2001/002176 WO2002005999A1 (en) 2000-07-19 2001-07-06 Conduction-convection atmosphere reflowing or polymerisation method and device therefor

Publications (1)

Publication Number Publication Date
AU2002222917A1 true AU2002222917A1 (en) 2002-01-30

Family

ID=26212542

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002222917A Abandoned AU2002222917A1 (en) 2000-07-19 2001-07-06 Conduction-convection atmosphere reflowing or polymerisation method and device therefor

Country Status (3)

Country Link
AU (1) AU2002222917A1 (en)
FR (1) FR2812080B1 (en)
WO (1) WO2002005999A1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3720912A1 (en) * 1986-07-03 1988-01-07 Licentia Gmbh METHOD AND ARRANGEMENT FOR REFLOW-SOLDERING AND REFLOW-DESOLDERING CIRCUIT BOARDS
JPH07254781A (en) * 1994-03-16 1995-10-03 Matsushita Electric Ind Co Ltd Mounting of electronic component
JPH08281905A (en) * 1995-04-17 1996-10-29 Toyota Motor Corp Multi-layer plate for screen printing, and method for printing paste film utilizing the plate
US5632434A (en) * 1995-06-29 1997-05-27 Regents Of The University Of California Pressure activated diaphragm bonder

Also Published As

Publication number Publication date
FR2812080B1 (en) 2006-10-20
WO2002005999A1 (en) 2002-01-24
FR2812080A1 (en) 2002-01-25

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