AU2002220500A1 - Leadfree chemical nickel alloy - Google Patents

Leadfree chemical nickel alloy

Info

Publication number
AU2002220500A1
AU2002220500A1 AU2002220500A AU2050002A AU2002220500A1 AU 2002220500 A1 AU2002220500 A1 AU 2002220500A1 AU 2002220500 A AU2002220500 A AU 2002220500A AU 2050002 A AU2050002 A AU 2050002A AU 2002220500 A1 AU2002220500 A1 AU 2002220500A1
Authority
AU
Australia
Prior art keywords
nickel alloy
leadfree
chemical nickel
bismuth
antimony
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002220500A
Inventor
Heinz-Peter Becker
Alfons Hollander
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aalberts Surface Technologies GmbH Kerpen
Original Assignee
AHC Oberflaechenechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7661055&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU2002220500(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by AHC Oberflaechenechnik GmbH filed Critical AHC Oberflaechenechnik GmbH
Publication of AU2002220500A1 publication Critical patent/AU2002220500A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/936—Chemical deposition, e.g. electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12944—Ni-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Vessels And Coating Films For Discharge Lamps (AREA)
  • Contacts (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Lead-free chemically produced nickel alloy containing nickel, phosphorus, bismuth and antimony, process for the production of such a nickel alloy by externally electroless metal deposition in an aqueous electrolyte and articles plated therewith.
AU2002220500A 2000-10-25 2001-10-25 Leadfree chemical nickel alloy Abandoned AU2002220500A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10052960 2000-10-25
DE10052960A DE10052960C9 (en) 2000-10-25 2000-10-25 Lead-free nickel alloy
PCT/DE2001/004014 WO2002034964A1 (en) 2000-10-25 2001-10-25 Leadfree chemical nickel alloy

Publications (1)

Publication Number Publication Date
AU2002220500A1 true AU2002220500A1 (en) 2002-05-06

Family

ID=7661055

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002220500A Abandoned AU2002220500A1 (en) 2000-10-25 2001-10-25 Leadfree chemical nickel alloy

Country Status (9)

Country Link
US (1) US6911269B2 (en)
EP (1) EP1330558B1 (en)
JP (1) JP4023796B2 (en)
AT (1) ATE350511T1 (en)
AU (1) AU2002220500A1 (en)
CA (1) CA2432333A1 (en)
DE (2) DE10052960C9 (en)
HU (1) HUP0301340A3 (en)
WO (1) WO2002034964A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1796106A4 (en) * 2004-09-02 2010-04-14 Sekisui Chemical Co Ltd Electroconductive fine particle and anisotropically electroconductive material
DE102004047423C5 (en) * 2004-09-28 2011-04-21 AHC-Oberflächentechnik GmbH & Co. OHG Externally applied Nickel alloy and its use
JP4430570B2 (en) * 2005-03-15 2010-03-10 荏原ユージライト株式会社 Electroless nickel composite plating bath and electroless nickel alloy composite plating bath
US20090011136A1 (en) * 2005-05-06 2009-01-08 Thomas Steven Lancsek Composite electroless plating
KR101058635B1 (en) * 2008-12-23 2011-08-22 와이엠티 주식회사 Electroless Nickel Plating Solution Composition, Flexible Printed Circuit Board and Manufacturing Method Thereof
JP6061369B2 (en) * 2012-01-30 2017-01-18 凸版印刷株式会社 WIRING BOARD AND ITS MANUFACTURING METHOD, AND SOLDERED WIRING BOARD MANUFACTURING METHOD
US8936672B1 (en) * 2012-06-22 2015-01-20 Accu-Labs, Inc. Polishing and electroless nickel compositions, kits, and methods
EP3390696B1 (en) * 2015-12-18 2023-01-04 Rolex S.A. Method for manufacturing a clock component
DE102017125954A1 (en) 2017-11-07 2019-05-09 RIAG Oberflächentechnik AG External electroless process for producing a nickel alloy and corresponding electrolyte
CN113355618A (en) * 2021-03-26 2021-09-07 中国科学院金属研究所 Research method and application of trace element phosphorus in deformation high-temperature alloy

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2884344A (en) * 1957-10-07 1959-04-28 Reynolds Metals Co Nickel plating
GB845648A (en) 1957-10-07 1960-08-24 Reynolds Metals Co Nickel plating
US3764380A (en) * 1971-06-03 1973-10-09 Gates Rubber Co Electrode having a coated positive contact surface
US4483711A (en) * 1983-06-17 1984-11-20 Omi International Corporation Aqueous electroless nickel plating bath and process
US4600609A (en) * 1985-05-03 1986-07-15 Macdermid, Incorporated Method and composition for electroless nickel deposition
US4699811A (en) * 1986-09-16 1987-10-13 Macdermid, Incorporated Chromium mask for electroless nickel or copper plating
JPH0258729A (en) * 1988-08-24 1990-02-27 Nec Corp Magnetic disk substrate and its production
JP3182934B2 (en) 1992-10-15 2001-07-03 上村工業株式会社 Manufacturing method of memory hard disk
US5437887A (en) * 1993-12-22 1995-08-01 Enthone-Omi, Inc. Method of preparing aluminum memory disks
US6800121B2 (en) * 2002-06-18 2004-10-05 Atotech Deutschland Gmbh Electroless nickel plating solutions

Also Published As

Publication number Publication date
DE10052960C9 (en) 2008-07-03
JP4023796B2 (en) 2007-12-19
DE50111820D1 (en) 2007-02-15
ATE350511T1 (en) 2007-01-15
HUP0301340A3 (en) 2007-05-02
JP2004512429A (en) 2004-04-22
CA2432333A1 (en) 2002-05-02
DE10052960A1 (en) 2002-05-16
US6911269B2 (en) 2005-06-28
DE10052960B4 (en) 2004-11-18
EP1330558B1 (en) 2007-01-03
HUP0301340A2 (en) 2003-09-29
US20040007472A1 (en) 2004-01-15
WO2002034964A1 (en) 2002-05-02
EP1330558A1 (en) 2003-07-30
DE10052960C5 (en) 2007-10-31

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