AU2001292415A1 - Polyphenyleneoxide-based composite resin composition for ic tray - Google Patents
Polyphenyleneoxide-based composite resin composition for ic trayInfo
- Publication number
- AU2001292415A1 AU2001292415A1 AU2001292415A AU9241501A AU2001292415A1 AU 2001292415 A1 AU2001292415 A1 AU 2001292415A1 AU 2001292415 A AU2001292415 A AU 2001292415A AU 9241501 A AU9241501 A AU 9241501A AU 2001292415 A1 AU2001292415 A1 AU 2001292415A1
- Authority
- AU
- Australia
- Prior art keywords
- polyphenyleneoxide
- tray
- resin composition
- based composite
- composite resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/02—Polythioethers; Polythioether-ethers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Packaging Frangible Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR0058006 | 2000-10-02 | ||
KR10-2000-0058006A KR100381972B1 (en) | 2000-10-02 | 2000-10-02 | Polyphenyleneoxide-based composite resin composition for ic tray |
PCT/KR2001/001625 WO2002028971A1 (en) | 2000-10-02 | 2001-09-27 | Polyphenyleneoxide-based composite resin composition for ic tray |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001292415A1 true AU2001292415A1 (en) | 2002-04-15 |
Family
ID=19691571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001292415A Abandoned AU2001292415A1 (en) | 2000-10-02 | 2001-09-27 | Polyphenyleneoxide-based composite resin composition for ic tray |
Country Status (7)
Country | Link |
---|---|
US (1) | US20030078331A1 (en) |
EP (1) | EP1268671A4 (en) |
JP (1) | JP2004510870A (en) |
KR (1) | KR100381972B1 (en) |
CN (1) | CN1392892A (en) |
AU (1) | AU2001292415A1 (en) |
WO (1) | WO2002028971A1 (en) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003292763A (en) * | 2002-03-29 | 2003-10-15 | Idemitsu Petrochem Co Ltd | Resin composition for optical part and optical part |
KR100478976B1 (en) * | 2002-04-23 | 2005-03-25 | 제일모직주식회사 | Flameproof Styrenic Resin Composition |
US6875387B2 (en) | 2002-12-10 | 2005-04-05 | General Electric | Polyphenylene ether compositions with improved die lip buildup performance |
JP2005060604A (en) * | 2003-08-19 | 2005-03-10 | Alps Electric Co Ltd | Resin composition for molding, conductive member and electrostatic actuator |
US7205354B2 (en) * | 2003-09-04 | 2007-04-17 | Asahi Kasei Kabushiki Kaisha | Resin-made mechanical element with excellent heat resistance and dimensional precision for optical disk drive |
US20050277726A1 (en) * | 2004-05-27 | 2005-12-15 | Zuo Yi | Conductive/dissipative plastic compositions for molding articles |
KR100695503B1 (en) * | 2005-05-23 | 2007-03-16 | 광 석 서 | Plastic Sheet Having Enhanced Formability for Carrier Tape |
JP4920210B2 (en) * | 2005-07-25 | 2012-04-18 | 三菱エンジニアリングプラスチックス株式会社 | Resin composition, molded product and IC tray |
CN100400598C (en) * | 2006-02-23 | 2008-07-09 | 华南理工大学 | Polyphenyl thio-ether and polycarbonate nano composite material and preparation process thereof |
KR100839173B1 (en) * | 2007-03-21 | 2008-06-17 | 신일화학공업(주) | Modified polyphenylene oxide resin composition comprising carbon nano tube |
KR100855367B1 (en) * | 2007-04-05 | 2008-09-04 | (주)성호폴리텍 | Modified polyphenyleneether for ic tray, preparing method of the same, and ic tray having the same |
US8063133B2 (en) * | 2007-06-13 | 2011-11-22 | Sabic Innovative Plastics Ip B.V. | Poly(arylene ether) compositions, methods, and articles |
US20090312479A1 (en) * | 2008-06-17 | 2009-12-17 | Sabic Innovative Plastics Ip Bv | Polycarbonate compositions |
US20100327234A1 (en) * | 2009-06-24 | 2010-12-30 | Cheil Industries Inc. | Polyphenylene Ether Thermoplastic Resin Composition, Method of Preparing the Same, and Molded Product Using the Same |
CN101602887B (en) * | 2009-07-07 | 2011-04-27 | 中国蓝星(集团)股份有限公司 | Polyphenylether composition and preparation method thereof |
US8552096B2 (en) * | 2009-07-31 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Flame-retardant reinforced polycarbonate compositions |
KR101266300B1 (en) | 2009-11-02 | 2013-05-22 | 제일모직주식회사 | Polyphenyleneether resin composition and molded product using the same |
WO2012053700A1 (en) * | 2010-10-20 | 2012-04-26 | 제일모직 주식회사 | Thermoplastic resin composition and molded products thereof |
CN101983987B (en) * | 2010-11-02 | 2013-01-23 | 蓝星化工新材料股份有限公司 | Polydiphenyl ether particles and granulation method thereof |
KR101367648B1 (en) * | 2011-08-23 | 2014-02-28 | (주)폴리원테크놀로지 | Resin composition having modified polyphenylene oxide |
CN102408697A (en) * | 2011-09-20 | 2012-04-11 | 福建奥峰科技有限公司 | Reinforced polyphenylene oxide (PPO) composition, and preparation method and application thereof |
US8975329B2 (en) | 2011-12-02 | 2015-03-10 | Sabic Global Technologies B.V. | Poly(phenylene ether) articles and compositions |
EP2805990B1 (en) * | 2012-01-17 | 2019-02-20 | National Institute of Advanced Industrial Science And Technology | Carbon fiber-reinforced plastic material with nanofiller mixed therein |
JP5842664B2 (en) * | 2012-02-23 | 2016-01-13 | 日立金属株式会社 | Thermosetting adhesive composition and heat-resistant adhesive film, laminated film, wiring film and multilayer wiring film using the same |
JP5895585B2 (en) * | 2012-02-23 | 2016-03-30 | 日立金属株式会社 | Adhesive, adhesive film, laminated film, wiring film and multilayer wiring film |
CN102643526A (en) * | 2012-04-10 | 2012-08-22 | 江苏启蓝新材料有限公司 | Halogen-free flame-retarding polyphenylene oxide composition with ultrahigh heat resistance |
US20150252214A1 (en) * | 2012-11-16 | 2015-09-10 | Sabic Global Technologies B.V. | Flexible, wrinkle resistant poly (phenylene ether) cable jacketing composition |
CN103289354A (en) * | 2013-06-24 | 2013-09-11 | 苏州新区佳合塑胶有限公司 | Antistatic PPO/PC composite material and preparation method thereof |
US20150140248A1 (en) * | 2013-11-19 | 2015-05-21 | Samsung Sdi Co., Ltd. | Polycarbonate Resin Composition and Molded Article Including the Same |
US9309392B2 (en) | 2014-07-18 | 2016-04-12 | Qatar University | Reinforced polymer composites from recycled plastic |
KR101993147B1 (en) | 2015-02-20 | 2019-09-30 | 세키스이가가쿠 고교가부시키가이샤 | Fiber Reinforced Composite Pipe and Hot & Cold Water Piping System |
CN104900642A (en) * | 2015-03-26 | 2015-09-09 | 苏州市德莱尔建材科技有限公司 | MPPO board for integrated circuit and manufacturing method thereof |
CN108250718A (en) * | 2017-12-14 | 2018-07-06 | 天长市优信电器设备有限公司 | A kind of charger case polyphenylene oxide resin preparation method |
CN109251507B (en) * | 2018-08-22 | 2021-04-02 | 东莞市国亨塑胶科技有限公司 | Alloy antistatic material for wafer tray and preparation method thereof |
CN111909467A (en) * | 2020-07-15 | 2020-11-10 | 日彩复合塑料(深圳)有限公司 | Plastic tray material and preparation method thereof |
CN112480646B (en) * | 2020-11-30 | 2022-05-10 | 金发科技股份有限公司 | Kaolin reinforced polyphenyl ether composition and preparation method and application thereof |
CN112778747A (en) * | 2020-12-28 | 2021-05-11 | 金发科技股份有限公司 | PPE composite material and preparation method and application thereof |
CN112812446B (en) * | 2020-12-28 | 2022-10-21 | 金发科技股份有限公司 | PPE composite material and preparation method and application thereof |
CN112745592B (en) * | 2020-12-29 | 2023-12-12 | 成都金发科技新材料有限公司 | Styrene composition and application and preparation method thereof |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4910826B1 (en) * | 1970-01-30 | 1974-03-13 | ||
US4596670A (en) * | 1983-10-25 | 1986-06-24 | General Electric Company | EMI shielding effectiveness of thermoplastics |
US4892904A (en) * | 1984-10-09 | 1990-01-09 | General Electric Company | Glass-reinforced blends of polyphenylene ether resin and polyolefin having improved heat distortion temperature |
EP0355602A3 (en) * | 1988-08-18 | 1990-10-10 | MITSUI TOATSU CHEMICALS, Inc. | Molding material for electroconductive ic parts |
JP3353789B2 (en) * | 1991-10-25 | 2002-12-03 | ゼネラル・エレクトリック・カンパニイ | IC tray |
JPH06220323A (en) * | 1993-01-26 | 1994-08-09 | Dainippon Ink & Chem Inc | Electrically conductive resin composition and container for holding electronic part |
JPH0741656A (en) * | 1993-07-26 | 1995-02-10 | Toray Ind Inc | Flame resistant polyphenyleneoxide resin composition and its injection molded product |
JPH08188710A (en) * | 1995-01-10 | 1996-07-23 | Asahi Chem Ind Co Ltd | Electroconductive resin composition having good extruding property |
KR0180569B1 (en) * | 1996-01-15 | 1999-05-15 | 김상응 | Thermoplastic resin composition |
JPH101603A (en) * | 1996-06-17 | 1998-01-06 | Sumitomo Chem Co Ltd | Thermoplastic resin composition and ic tray |
JPH10316847A (en) * | 1997-05-19 | 1998-12-02 | Asahi Chem Ind Co Ltd | Resin composition and molded product for heat-resistant ic member |
JPH11116794A (en) * | 1997-10-16 | 1999-04-27 | Sumitomo Chem Co Ltd | Ic tray-molding resin composition |
JPH11310674A (en) * | 1998-04-28 | 1999-11-09 | Sumitomo Chem Co Ltd | Polyphenylene ether-based resin composition, molded product and pump part |
JPH11335549A (en) * | 1998-05-26 | 1999-12-07 | Mitsui Chem Inc | Electrically conductive resin composition, semiconductor-packaging container, and ic tray |
US6359043B1 (en) * | 1998-09-24 | 2002-03-19 | General Electric Company | Mica as flame retardant in glass filled noryl |
-
2000
- 2000-10-02 KR KR10-2000-0058006A patent/KR100381972B1/en not_active IP Right Cessation
-
2001
- 2001-09-27 AU AU2001292415A patent/AU2001292415A1/en not_active Abandoned
- 2001-09-27 US US10/148,506 patent/US20030078331A1/en not_active Abandoned
- 2001-09-27 WO PCT/KR2001/001625 patent/WO2002028971A1/en not_active Application Discontinuation
- 2001-09-27 EP EP01972774A patent/EP1268671A4/en not_active Withdrawn
- 2001-09-27 CN CN01802978A patent/CN1392892A/en active Pending
- 2001-09-27 JP JP2002532545A patent/JP2004510870A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP1268671A1 (en) | 2003-01-02 |
US20030078331A1 (en) | 2003-04-24 |
CN1392892A (en) | 2003-01-22 |
JP2004510870A (en) | 2004-04-08 |
KR100381972B1 (en) | 2003-05-01 |
EP1268671A4 (en) | 2004-05-06 |
KR20020026759A (en) | 2002-04-12 |
WO2002028971A1 (en) | 2002-04-11 |
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