AU2001292114A1 - Substrate cleaning - Google Patents

Substrate cleaning

Info

Publication number
AU2001292114A1
AU2001292114A1 AU2001292114A AU9211401A AU2001292114A1 AU 2001292114 A1 AU2001292114 A1 AU 2001292114A1 AU 2001292114 A AU2001292114 A AU 2001292114A AU 9211401 A AU9211401 A AU 9211401A AU 2001292114 A1 AU2001292114 A1 AU 2001292114A1
Authority
AU
Australia
Prior art keywords
substrate cleaning
cleaning
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001292114A
Inventor
Cameron William Kennedy
Keith Stuart Munro
John Penman
Mark Craven Sunderland
Graham Robert Thompson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KSM INTERNATIONAL Ltd
Original Assignee
KSM INTERNAT Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KSM INTERNAT Ltd filed Critical KSM INTERNAT Ltd
Publication of AU2001292114A1 publication Critical patent/AU2001292114A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
AU2001292114A 2000-10-07 2001-10-05 Substrate cleaning Abandoned AU2001292114A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0024640A GB0024640D0 (en) 2000-10-07 2000-10-07 Substrate cleaning
GB0024640 2000-10-07
PCT/GB2001/004458 WO2002032200A1 (en) 2000-10-07 2001-10-05 Substrate cleaning

Publications (1)

Publication Number Publication Date
AU2001292114A1 true AU2001292114A1 (en) 2002-04-22

Family

ID=9900887

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001292114A Abandoned AU2001292114A1 (en) 2000-10-07 2001-10-05 Substrate cleaning

Country Status (3)

Country Link
AU (1) AU2001292114A1 (en)
GB (1) GB0024640D0 (en)
WO (1) WO2002032200A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040031167A1 (en) 2002-06-13 2004-02-19 Stein Nathan D. Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife
US7328897B2 (en) 2003-10-20 2008-02-12 Zih Corp. Card printer and method of printing on cards
US20050084315A1 (en) * 2003-10-20 2005-04-21 Zebra Technologies Corporation Substrate cleaning apparatus and method
JP2006003515A (en) * 2004-06-16 2006-01-05 Konica Minolta Medical & Graphic Inc Maintenance method and cleaning sheet for medical recording device
DE102005051763A1 (en) * 2005-10-27 2007-05-03 Tesa Ag Cleaning process for shafts guiding material web involves carrying cleaning strips along with material web to clean shafts by contact with adhesive part region
GB2516107A (en) * 2013-07-12 2015-01-14 Technijet Ltd Surface Cleaning Apparatus
CN110560824A (en) * 2019-01-01 2019-12-13 宁夏隆基宁光仪表股份有限公司 automatic tin slag removing system and method after PCB tin soldering
CN112371598A (en) * 2020-11-30 2021-02-19 东营大海科林光电有限公司 Photovoltaic bottom plate dust removal and rust removal device and use method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4800611A (en) * 1986-04-16 1989-01-31 Hakuto Co., Ltd. Plate cleaning apparatus and cleaning roller therefor
JP3070344B2 (en) * 1992-07-31 2000-07-31 トヨタ自動車株式会社 Cleaning equipment for cutting plate work for press
US5251348A (en) * 1992-10-19 1993-10-12 Corrado Frank C Contact cleaner roll cleaning system
US5813073A (en) * 1996-09-26 1998-09-29 Systems Division Incorporated Sheet cleaning apparatus with cartridge roller assembly
JP3067752B2 (en) * 1998-12-29 2000-07-24 有限会社ピーシービープランニング Plate part dust removal device

Also Published As

Publication number Publication date
GB0024640D0 (en) 2000-11-22
WO2002032200A1 (en) 2002-04-18

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