AU2001288906A1 - Connection for conducting high frequency signal between a circuit and a discrete electrical component - Google Patents
Connection for conducting high frequency signal between a circuit and a discrete electrical componentInfo
- Publication number
- AU2001288906A1 AU2001288906A1 AU2001288906A AU8890601A AU2001288906A1 AU 2001288906 A1 AU2001288906 A1 AU 2001288906A1 AU 2001288906 A AU2001288906 A AU 2001288906A AU 8890601 A AU8890601 A AU 8890601A AU 2001288906 A1 AU2001288906 A1 AU 2001288906A1
- Authority
- AU
- Australia
- Prior art keywords
- circuit
- high frequency
- connection
- frequency signal
- electrical component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000003990 capacitor Substances 0.000 abstract 2
Classifications
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Communication Cables (AREA)
- Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
- Amplifiers (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Waveguides (AREA)
- Semiconductor Integrated Circuits (AREA)
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- Burglar Alarm Systems (AREA)
Abstract
An apparatus for processing high frequency signals comprises a circuit board has a trace. An electrical circuit is fabricated on a die, which is mounted on the circuit board. The die has a top portion and a contact point is positioned on the top portion. The circuit is configured to process a signal having a frequency in the range of about 20 GHz and higher. A capacitor is mounted on the circuit board and has a top portion and bottom portion. The bottom portion opposes the trace. A wire extends between the contact point on the top portion of the die and the top portion of the capacitor. The wire has a length in the range of about 2 mils to about 12 mils.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US09/662,186 | 2000-09-15 | ||
US09/662,186 US6646521B1 (en) | 2000-09-15 | 2000-09-15 | Connection for conducting high frequency signal between a circuit and a discrete electric component |
PCT/US2001/028113 WO2002023620A2 (en) | 2000-09-15 | 2001-09-07 | Connection for conducting high frequency signal between a circuit and a discrete electrical component |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001288906A1 true AU2001288906A1 (en) | 2002-03-26 |
Family
ID=24656726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001288906A Abandoned AU2001288906A1 (en) | 2000-09-15 | 2001-09-07 | Connection for conducting high frequency signal between a circuit and a discrete electrical component |
Country Status (10)
Country | Link |
---|---|
US (1) | US6646521B1 (en) |
EP (1) | EP1317769B1 (en) |
JP (1) | JP2004529484A (en) |
KR (1) | KR100839252B1 (en) |
AT (1) | ATE498909T1 (en) |
AU (1) | AU2001288906A1 (en) |
DE (1) | DE60144053D1 (en) |
MY (1) | MY127129A (en) |
TW (1) | TW565971B (en) |
WO (1) | WO2002023620A2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7187256B2 (en) * | 2004-02-19 | 2007-03-06 | Hittite Microwave Corporation | RF package |
US7074705B2 (en) * | 2004-02-25 | 2006-07-11 | Agere Systems Inc. | Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles |
US7187249B2 (en) * | 2004-09-24 | 2007-03-06 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package |
US7528792B2 (en) | 2005-06-06 | 2009-05-05 | Raytheon Company | Reduced inductance interconnect for enhanced microwave and millimeter-wave systems |
US9912448B2 (en) * | 2012-02-13 | 2018-03-06 | Sentinel Connector Systems, Inc. | Testing apparatus for a high speed communications jack and methods of operating the same |
KR102419900B1 (en) * | 2015-09-02 | 2022-07-13 | 삼성전자주식회사 | Printed Circuit Board Module and Electronic Device including the same |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3893159A (en) * | 1974-02-26 | 1975-07-01 | Rca Corp | Multiple cell high frequency power semiconductor device having bond wires of differing inductance from cell to cell |
US4225584A (en) * | 1977-12-10 | 1980-09-30 | Henkel Kommanditgesellschaft Auf Aktien | Animal feeds containing a mixture of nitrovin, carbadox or olaquindox and proteolytic enzymes |
JPH0799753B2 (en) | 1985-11-06 | 1995-10-25 | 日本電気株式会社 | Hybrid integrated circuit |
JPS63293842A (en) * | 1987-05-26 | 1988-11-30 | Nec Corp | Integrated circuit |
JP2834878B2 (en) | 1990-09-28 | 1998-12-14 | 三洋電機株式会社 | Hybrid integrated circuit |
US5438305A (en) * | 1991-08-12 | 1995-08-01 | Hitachi, Ltd. | High frequency module including a flexible substrate |
JPH0883817A (en) * | 1994-09-09 | 1996-03-26 | Mitsubishi Materials Corp | Semiconductor integrated circuit and its manufacturing method |
US5701032A (en) | 1994-10-17 | 1997-12-23 | W. L. Gore & Associates, Inc. | Integrated circuit package |
US5777528A (en) * | 1995-05-26 | 1998-07-07 | Motorola, Inc. | Mode suppressing coplanar waveguide transition and method |
JP3476612B2 (en) * | 1995-12-21 | 2003-12-10 | 三菱電機株式会社 | Semiconductor device |
US5815427A (en) * | 1997-04-02 | 1998-09-29 | Micron Technology, Inc. | Modular memory circuit and method for forming same |
US6127894A (en) * | 1998-01-21 | 2000-10-03 | Uniden San Diego Research & Development Center, Inc. | High frequency shunt feedback amplifier topology |
US6259148B1 (en) * | 1998-08-13 | 2001-07-10 | International Business Machines Corporation | Modular high frequency integrated circuit structure |
SE515661C2 (en) * | 1998-12-22 | 2001-09-17 | Ericsson Telefon Ab L M | Wire bonding Compensation |
US6208225B1 (en) * | 1999-02-25 | 2001-03-27 | Formfactor, Inc. | Filter structures for integrated circuit interfaces |
US6201454B1 (en) * | 1999-03-30 | 2001-03-13 | The Whitaker Corporation | Compensation structure for a bond wire at high frequency operation |
US6294966B1 (en) * | 1999-12-31 | 2001-09-25 | Hei, Inc. | Interconnection device |
-
2000
- 2000-09-15 US US09/662,186 patent/US6646521B1/en not_active Expired - Fee Related
-
2001
- 2001-09-07 EP EP01968674A patent/EP1317769B1/en not_active Expired - Lifetime
- 2001-09-07 KR KR1020037003802A patent/KR100839252B1/en not_active IP Right Cessation
- 2001-09-07 WO PCT/US2001/028113 patent/WO2002023620A2/en active Application Filing
- 2001-09-07 AU AU2001288906A patent/AU2001288906A1/en not_active Abandoned
- 2001-09-07 JP JP2002527567A patent/JP2004529484A/en active Pending
- 2001-09-07 AT AT01968674T patent/ATE498909T1/en not_active IP Right Cessation
- 2001-09-07 DE DE60144053T patent/DE60144053D1/en not_active Expired - Lifetime
- 2001-09-12 MY MYPI20014267 patent/MY127129A/en unknown
- 2001-09-19 TW TW090123073A patent/TW565971B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2002023620A2 (en) | 2002-03-21 |
MY127129A (en) | 2006-11-30 |
DE60144053D1 (en) | 2011-03-31 |
TW565971B (en) | 2003-12-11 |
JP2004529484A (en) | 2004-09-24 |
KR20030033065A (en) | 2003-04-26 |
KR100839252B1 (en) | 2008-06-17 |
US6646521B1 (en) | 2003-11-11 |
ATE498909T1 (en) | 2011-03-15 |
EP1317769A2 (en) | 2003-06-11 |
WO2002023620A3 (en) | 2003-03-27 |
EP1317769B1 (en) | 2011-02-16 |
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