AU2001288272A1 - Optical fiber interconnections and a method for fabrication thereof - Google Patents

Optical fiber interconnections and a method for fabrication thereof

Info

Publication number
AU2001288272A1
AU2001288272A1 AU2001288272A AU8827201A AU2001288272A1 AU 2001288272 A1 AU2001288272 A1 AU 2001288272A1 AU 2001288272 A AU2001288272 A AU 2001288272A AU 8827201 A AU8827201 A AU 8827201A AU 2001288272 A1 AU2001288272 A1 AU 2001288272A1
Authority
AU
Australia
Prior art keywords
fabrication
optical fiber
fiber interconnections
interconnections
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001288272A
Inventor
Daniel Yap
Michael Yung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DirecTV Group Inc
HRL Laboratories LLC
Original Assignee
HRL Laboratories LLC
Hughes Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HRL Laboratories LLC, Hughes Electronics Corp filed Critical HRL Laboratories LLC
Publication of AU2001288272A1 publication Critical patent/AU2001288272A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48111—Disposition the wire connector extending above another semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/4917—Crossed wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
AU2001288272A 2000-08-25 2001-08-16 Optical fiber interconnections and a method for fabrication thereof Abandoned AU2001288272A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/648,689 US6655853B1 (en) 2000-08-25 2000-08-25 Optical bond-wire interconnections and a method for fabrication thereof
US09/648,689 2000-08-25
PCT/US2001/025681 WO2002019008A2 (en) 2000-08-25 2001-08-16 Optical fiber interconnections and a method for fabrication thereof

Publications (1)

Publication Number Publication Date
AU2001288272A1 true AU2001288272A1 (en) 2002-03-13

Family

ID=24601814

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001288272A Abandoned AU2001288272A1 (en) 2000-08-25 2001-08-16 Optical fiber interconnections and a method for fabrication thereof

Country Status (5)

Country Link
US (3) US6655853B1 (en)
EP (1) EP1352277A2 (en)
JP (1) JP2004507793A (en)
AU (1) AU2001288272A1 (en)
WO (1) WO2002019008A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6932519B2 (en) * 2000-11-16 2005-08-23 Shipley Company, L.L.C. Optical device package
US6827503B2 (en) * 2000-12-01 2004-12-07 Shipley Company, L.L.C. Optical device package having a configured frame
US7412170B1 (en) 2003-05-29 2008-08-12 Opticomp Corporation Broad temperature WDM transmitters and receivers for coarse wavelength division multiplexed (CWDM) fiber communication systems
GB0819447D0 (en) * 2008-10-23 2008-12-03 Cambridge Display Tech Ltd Optical sensor array
US20110084406A1 (en) * 2009-10-13 2011-04-14 Sony Corporation Device and interconnect in flip chip architecture
FR2961949B1 (en) * 2010-06-24 2012-08-03 Commissariat Energie Atomique CHIP ELEMENTS ASSEMBLIES ON THREADS HAVING A BREAKING PRIMER
ES2557108T3 (en) 2010-08-06 2016-01-22 Dnae Group Holdings Limited Fluid sensor on a wirelessly connected chip
US8587501B2 (en) * 2011-02-17 2013-11-19 Global Oled Technology Llc Electroluminescent display device with optically communicating chiplets
KR20140056360A (en) * 2011-08-31 2014-05-09 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. Multimode fiber for modulatable source
US9529162B2 (en) * 2012-10-09 2016-12-27 Corning Optical Communications LLC Optical fiber connectors and methods of forming optical fiber connectors
TWI503905B (en) * 2013-05-09 2015-10-11 矽品精密工業股份有限公司 Wire-bonding structure
US10845558B2 (en) * 2017-02-07 2020-11-24 Ofs Fitel, Llc High count optical fiber cable configuration

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3963920A (en) 1975-03-10 1976-06-15 General Dynamics Corporation Integrated optical-to-electrical signal transducing system and apparatus
US4358676A (en) * 1980-09-22 1982-11-09 Optical Information Systems, Inc. High speed edge illumination photodetector
JPS61121014A (en) 1984-11-16 1986-06-09 Nec Corp Optical and electric hybrid integrated circuit
JPH03256011A (en) * 1990-03-06 1991-11-14 Fujikura Ltd Connecting structure for optical fiber
US5357103A (en) 1991-10-02 1994-10-18 Sumitomo Electric Industries, Inc. Light receiving module with optical fiber coupling
JP3484543B2 (en) * 1993-03-24 2004-01-06 富士通株式会社 Method of manufacturing optical coupling member and optical device
JPH0888393A (en) 1994-09-19 1996-04-02 Fujitsu Ltd Semiconductor photodetection device and its manufacture
US5911022A (en) * 1994-09-29 1999-06-08 Siemens Aktiengesellschaft Optical coupling arrangement
DE19624366A1 (en) 1996-06-19 1998-01-02 Bosch Gmbh Robert Process for the production of mirrors for waveguides in integrated optical components
JPH10170765A (en) 1996-12-06 1998-06-26 Nec Corp Optical waveguide
JPH10246839A (en) * 1997-03-05 1998-09-14 Fujitsu Ltd Optical semiconductor module
US6187515B1 (en) * 1998-05-07 2001-02-13 Trw Inc. Optical integrated circuit microbench system
JP2001196607A (en) * 2000-01-12 2001-07-19 Sumitomo Electric Ind Ltd Micro-bench and method for manufacturing the same and optical semiconductor module using the same

Also Published As

Publication number Publication date
US20040037513A1 (en) 2004-02-26
JP2004507793A (en) 2004-03-11
US6655853B1 (en) 2003-12-02
EP1352277A2 (en) 2003-10-15
US7309171B2 (en) 2007-12-18
WO2002019008A2 (en) 2002-03-07
US7207728B2 (en) 2007-04-24
WO2002019008A3 (en) 2003-08-07
US20070172176A1 (en) 2007-07-26

Similar Documents

Publication Publication Date Title
AU2002223515A1 (en) A micro-structured optical fibre
AU2002230481A1 (en) Low-loss intermatable ferrules for optical fibers and a method of fabrication thereof
AU2001279056A1 (en) Optical waveguides and methods for making the same
AU2001277899A1 (en) Large optical fiber array assembly and method
AU2002239536A1 (en) Methods and apparatus for forming a fiber optic connection
EP1533284A4 (en) Optical fiber and a method for manufactuirng same
AU2001246932A1 (en) Optical fiber
EP1281989A3 (en) Optical fiber and optical transmission method
AU2003207215A1 (en) Optical fiber connection tool and optical fiber connection method
AU2002227157A1 (en) Method and apparatus for continuously manufacturing optical preform and fiber
AU2001288272A1 (en) Optical fiber interconnections and a method for fabrication thereof
AU2002357445A1 (en) Solid core optic fiber and method for the production thereof
EP1173390A4 (en) Optical fiber preform having oh barrier and fabrication method thereof
AU2001234153A1 (en) Optical fiber
AU2001286423A1 (en) Apparatus and method for manufacturing fiber gratings
GB2373366B (en) Optical fibre and method for producing an optical fibre
EP1357404A4 (en) Method and apparatus for manufacturing optical fiber
AU2001274726A1 (en) A method and an arrangement relating to optical fibers
AU2001241172A1 (en) Optical fiber and method for manufacturing the same
AU2002256056A1 (en) Device and method for positioning optical fibers
AU2001230561A1 (en) Method of manufacturing optical fiber
AU7583800A (en) Method and apparatus for manufacturing optical fiber components
AU2002246239A1 (en) A tapered optical waveguide
AU4301900A (en) Photonic integrated circuit comprising a resonant optical component and methods for making same
GB0000946D0 (en) Optical waveguide and method for fabricating the same