AU2001287530A1 - Method for coating a number of similar base bodies and use of said method - Google Patents
Method for coating a number of similar base bodies and use of said methodInfo
- Publication number
- AU2001287530A1 AU2001287530A1 AU2001287530A AU8753001A AU2001287530A1 AU 2001287530 A1 AU2001287530 A1 AU 2001287530A1 AU 2001287530 A AU2001287530 A AU 2001287530A AU 8753001 A AU8753001 A AU 8753001A AU 2001287530 A1 AU2001287530 A1 AU 2001287530A1
- Authority
- AU
- Australia
- Prior art keywords
- coating
- base bodies
- similar base
- similar
- bodies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2000142228 DE10042228C2 (en) | 2000-08-28 | 2000-08-28 | Process for coating a large number of identical base bodies and use of the process |
DE10042228 | 2000-08-28 | ||
PCT/DE2001/003000 WO2002018677A1 (en) | 2000-08-28 | 2001-08-06 | Method for coating a number of similar base bodies and use of said method |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001287530A1 true AU2001287530A1 (en) | 2002-03-13 |
Family
ID=7654060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001287530A Abandoned AU2001287530A1 (en) | 2000-08-28 | 2001-08-06 | Method for coating a number of similar base bodies and use of said method |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2001287530A1 (en) |
DE (1) | DE10042228C2 (en) |
WO (1) | WO2002018677A1 (en) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3213511A1 (en) * | 1982-04-10 | 1983-10-20 | Schering AG, 1000 Berlin und 4709 Bergkamen | Process for electrochemically treating the surface of bulk materials |
US4820332A (en) * | 1984-07-13 | 1989-04-11 | E. I. Dupont De Nemours And Company | Herbicidal sulfonamides |
DE3433251A1 (en) * | 1984-08-16 | 1986-02-27 | Robert Bosch Gmbh, 7000 Stuttgart | METHOD FOR PRODUCING GALVANIC SOLDER LAYERS ON INORGANIC SUBSTRATES |
US4810332A (en) * | 1988-07-21 | 1989-03-07 | Microelectronics And Computer Technology Corporation | Method of making an electrical multilayer copper interconnect |
DE3905100A1 (en) * | 1989-02-20 | 1990-08-23 | Hans Henig | Method and appliance for electrolyte exchange especially in narrow recesses of large-area workpieces |
US5733468A (en) * | 1996-08-27 | 1998-03-31 | Conway, Jr.; John W. | Pattern plating method for fabricating printed circuit boards |
DE19734113B4 (en) * | 1997-08-07 | 2006-12-07 | Robert Bosch Gmbh | Process for the production of micromechanical components |
DE19821841C1 (en) * | 1998-05-15 | 1999-06-24 | Karlsruhe Forschzent | Micro-device manufacture involving transfer of micro-structured layer from production substrate to another substrate |
-
2000
- 2000-08-28 DE DE2000142228 patent/DE10042228C2/en not_active Expired - Fee Related
-
2001
- 2001-08-06 AU AU2001287530A patent/AU2001287530A1/en not_active Abandoned
- 2001-08-06 WO PCT/DE2001/003000 patent/WO2002018677A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
DE10042228A1 (en) | 2002-03-28 |
WO2002018677A1 (en) | 2002-03-07 |
DE10042228C2 (en) | 2002-10-17 |
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