AU2001282803A1 - Sequentially processed circuitry - Google Patents

Sequentially processed circuitry

Info

Publication number
AU2001282803A1
AU2001282803A1 AU2001282803A AU8280301A AU2001282803A1 AU 2001282803 A1 AU2001282803 A1 AU 2001282803A1 AU 2001282803 A AU2001282803 A AU 2001282803A AU 8280301 A AU8280301 A AU 8280301A AU 2001282803 A1 AU2001282803 A1 AU 2001282803A1
Authority
AU
Australia
Prior art keywords
sequentially processed
processed circuitry
circuitry
sequentially
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001282803A
Inventor
Leif Bergstedt
Per Ligander
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of AU2001282803A1 publication Critical patent/AU2001282803A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
AU2001282803A 2000-08-31 2001-08-28 Sequentially processed circuitry Abandoned AU2001282803A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE0003085 2000-08-31
SE0003085A SE519287C2 (en) 2000-08-31 2000-08-31 Encapsulated circuit board with sequentially constructed wiring pattern and manufacturing process
PCT/SE2001/001830 WO2002019784A1 (en) 2000-08-31 2001-08-28 Sequentially processed circuitry

Publications (1)

Publication Number Publication Date
AU2001282803A1 true AU2001282803A1 (en) 2002-03-13

Family

ID=20280855

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001282803A Abandoned AU2001282803A1 (en) 2000-08-31 2001-08-28 Sequentially processed circuitry

Country Status (5)

Country Link
US (1) US20020023775A1 (en)
EP (1) EP1410703A1 (en)
AU (1) AU2001282803A1 (en)
SE (1) SE519287C2 (en)
WO (1) WO2002019784A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD936365S1 (en) * 2020-03-03 2021-11-23 James Chun Accessory case

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1573320A (en) * 1976-05-17 1980-08-20 Ici Ltd Electrophopretic deposition of inorganic films
EP0417887B1 (en) * 1989-09-09 1995-06-14 Mitsubishi Denki Kabushiki Kaisha IC card
US5260170A (en) * 1990-01-08 1993-11-09 Motorola, Inc. Dielectric layered sequentially processed circuit board
JPH08230367A (en) * 1994-12-27 1996-09-10 Mitsubishi Electric Corp Non-contact type ic card and its manufacturing method and apparatus
US5681757A (en) * 1996-04-29 1997-10-28 Microfab Technologies, Inc. Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process
EP1744365B1 (en) * 1996-08-27 2009-04-15 Seiko Epson Corporation Exfoliating method and transferring method of thin film device
DE19722357C1 (en) * 1997-05-28 1998-11-19 Bosch Gmbh Robert Control unit

Also Published As

Publication number Publication date
SE519287C2 (en) 2003-02-11
SE0003085L (en) 2002-03-01
SE0003085D0 (en) 2000-08-31
US20020023775A1 (en) 2002-02-28
EP1410703A1 (en) 2004-04-21
WO2002019784A1 (en) 2002-03-07

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