AU2001281306A1 - Adjustable segmented electrode apparatus and method - Google Patents

Adjustable segmented electrode apparatus and method

Info

Publication number
AU2001281306A1
AU2001281306A1 AU2001281306A AU8130601A AU2001281306A1 AU 2001281306 A1 AU2001281306 A1 AU 2001281306A1 AU 2001281306 A AU2001281306 A AU 2001281306A AU 8130601 A AU8130601 A AU 8130601A AU 2001281306 A1 AU2001281306 A1 AU 2001281306A1
Authority
AU
Australia
Prior art keywords
segmented electrode
electrode apparatus
adjustable segmented
adjustable
segmented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001281306A
Inventor
Maolin Long
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2001281306A1 publication Critical patent/AU2001281306A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
AU2001281306A 2000-07-13 2001-07-10 Adjustable segmented electrode apparatus and method Abandoned AU2001281306A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US21804000P 2000-07-13 2000-07-13
US60218040 2000-07-13
PCT/US2001/041311 WO2002007184A2 (en) 2000-07-13 2001-07-10 Adjustable segmented electrode apparatus and method

Publications (1)

Publication Number Publication Date
AU2001281306A1 true AU2001281306A1 (en) 2002-01-30

Family

ID=22813501

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001281306A Abandoned AU2001281306A1 (en) 2000-07-13 2001-07-10 Adjustable segmented electrode apparatus and method

Country Status (3)

Country Link
US (1) US6916401B2 (en)
AU (1) AU2001281306A1 (en)
WO (1) WO2002007184A2 (en)

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US20030042227A1 (en) * 2001-08-29 2003-03-06 Tokyo Electron Limited Apparatus and method for tailoring an etch profile
WO2003100817A1 (en) * 2002-05-23 2003-12-04 Lam Research Corporation Multi-part electrode for a semiconductor processing plasma reactor and method of replacing a portion of a mutli-part electrode
US20050130620A1 (en) * 2003-12-16 2005-06-16 Andreas Fischer Segmented radio frequency electrode apparatus and method for uniformity control
US20060191638A1 (en) * 2005-02-28 2006-08-31 International Business Machines Corporation Etching apparatus for semiconductor fabrication
JP4853049B2 (en) * 2006-03-02 2012-01-11 大日本印刷株式会社 Plasma processing method
JP4929759B2 (en) * 2006-03-02 2012-05-09 大日本印刷株式会社 Plasma processing method
US7829815B2 (en) * 2006-09-22 2010-11-09 Taiwan Semiconductor Manufacturing Co., Ltd. Adjustable electrodes and coils for plasma density distribution control
EP2232958A4 (en) * 2007-12-25 2011-01-19 Applied Materials Inc Asymmetrical rf drive for electrode of plasma chamber
EP2245912A2 (en) * 2008-01-31 2010-11-03 Applied Materials, Inc. Multiple phase rf power for electrode of plasma chamber
JP4558810B2 (en) * 2008-02-29 2010-10-06 富士フイルム株式会社 Deposition equipment
US7767986B2 (en) * 2008-06-20 2010-08-03 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for controlling beam current uniformity in an ion implanter
US8299391B2 (en) * 2008-07-30 2012-10-30 Applied Materials, Inc. Field enhanced inductively coupled plasma (Fe-ICP) reactor
US8382941B2 (en) * 2008-09-15 2013-02-26 Micron Technology, Inc. Plasma reactor with adjustable plasma electrodes and associated methods
US8992723B2 (en) * 2009-02-13 2015-03-31 Applied Material, Inc. RF bus and RF return bus for plasma chamber electrode
US20100243609A1 (en) * 2009-03-30 2010-09-30 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
EP3020850B1 (en) 2009-07-08 2018-08-29 Aixtron SE Apparatus for plasma processing
KR200476124Y1 (en) * 2009-09-29 2015-01-30 어플라이드 머티어리얼스, 인코포레이티드 Offcenter ground return for rfpowered showerhead
EP2609691B1 (en) * 2010-08-23 2015-04-15 Telefonaktiebolaget L M Ericsson (publ) Device and method for improved closed loop diversity
US8765232B2 (en) 2011-01-10 2014-07-01 Plasmasi, Inc. Apparatus and method for dielectric deposition
US8932429B2 (en) * 2012-02-23 2015-01-13 Lam Research Corporation Electronic knob for tuning radial etch non-uniformity at VHF frequencies
US9299956B2 (en) 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
US10526708B2 (en) 2012-06-19 2020-01-07 Aixtron Se Methods for forming thin protective and optical layers on substrates
US8896211B2 (en) * 2013-01-16 2014-11-25 Orteron (T.O) Ltd Physical means and methods for inducing regenerative effects on living tissues and fluids
US10266802B2 (en) * 2013-01-16 2019-04-23 Orteron (T.O) Ltd. Method for controlling biological processes in microorganisms
KR102513443B1 (en) * 2016-03-15 2023-03-24 삼성전자주식회사 electrostatic chuck and substrate processing apparatus including the same
WO2017189222A1 (en) * 2016-04-29 2017-11-02 Retro-Semi Technologies, Llc Plasma reactor having divided electrodes
US20170314133A1 (en) * 2016-04-29 2017-11-02 Retro-Semi Technologies, Llc Plasma reactor having divided electrodes
US20180143332A1 (en) * 2016-11-18 2018-05-24 Plasma-Therm Llc Ion Filter
US11251019B2 (en) * 2016-12-15 2022-02-15 Toyota Jidosha Kabushiki Kaisha Plasma device
US11096626B2 (en) * 2017-05-22 2021-08-24 Maurice-Andre Recanati Fetal scalp monitor
JP6863199B2 (en) 2017-09-25 2021-04-21 トヨタ自動車株式会社 Plasma processing equipment

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Publication number Priority date Publication date Assignee Title
JPS5723227A (en) * 1980-07-17 1982-02-06 Nippon Telegr & Teleph Corp <Ntt> Plasma etching device
JPS6012734A (en) * 1983-07-01 1985-01-23 Hitachi Ltd Plasma processing device
US4885074A (en) * 1987-02-24 1989-12-05 International Business Machines Corporation Plasma reactor having segmented electrodes
JPH01108382A (en) * 1987-10-21 1989-04-25 Nec Corp Plasma vapor growth device
JPH0211781A (en) * 1988-06-29 1990-01-16 Hitachi Ltd Dry etching device
JPH0344028A (en) * 1989-07-11 1991-02-25 Matsushita Electron Corp Apparatus for plasma etching
JP3175894B2 (en) * 1994-03-25 2001-06-11 株式会社半導体エネルギー研究所 Plasma processing apparatus and plasma processing method
AU2003195A (en) * 1994-06-21 1996-01-04 Boc Group, Inc., The Improved power distribution for multiple electrode plasma systems using quarter wavelength transmission lines
US5565074A (en) * 1995-07-27 1996-10-15 Applied Materials, Inc. Plasma reactor with a segmented balanced electrode for sputtering process materials from a target surface
JP3650248B2 (en) * 1997-03-19 2005-05-18 東京エレクトロン株式会社 Plasma processing equipment
JP5165825B2 (en) * 2000-01-10 2013-03-21 東京エレクトロン株式会社 Divided electrode assembly and plasma processing method.
US20030079983A1 (en) * 2000-02-25 2003-05-01 Maolin Long Multi-zone RF electrode for field/plasma uniformity control in capacitive plasma sources
JP2002359232A (en) * 2001-05-31 2002-12-13 Tokyo Electron Ltd Plasma treatment apparatus

Also Published As

Publication number Publication date
US20030103877A1 (en) 2003-06-05
US6916401B2 (en) 2005-07-12
WO2002007184A3 (en) 2002-06-20
WO2002007184A2 (en) 2002-01-24

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