AU2001281115A1 - Ceramic microelectromechanical structure - Google Patents

Ceramic microelectromechanical structure

Info

Publication number
AU2001281115A1
AU2001281115A1 AU2001281115A AU8111501A AU2001281115A1 AU 2001281115 A1 AU2001281115 A1 AU 2001281115A1 AU 2001281115 A AU2001281115 A AU 2001281115A AU 8111501 A AU8111501 A AU 8111501A AU 2001281115 A1 AU2001281115 A1 AU 2001281115A1
Authority
AU
Australia
Prior art keywords
layer
sacrificial layer
microelectromechanical structure
ceramic substrate
low loss
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001281115A
Inventor
Carol Gamlen
Charles Newton
Raymond Rumpf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harris Corp
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Publication of AU2001281115A1 publication Critical patent/AU2001281115A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/0015—Cantilevers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/10—Auxiliary devices for switching or interrupting
    • H01P1/12—Auxiliary devices for switching or interrupting by mechanical chopper
    • H01P1/127—Strip line switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0271—Resonators; ultrasonic resonators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0109—Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Orthopedics, Nursing, And Contraception (AREA)
  • Materials For Medical Uses (AREA)
  • Thermally Actuated Switches (AREA)
  • Manufacture Of Switches (AREA)

Abstract

A microelectromechanical structure and method is disclosed. A ceramic substrate preferably is formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can e a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. In one aspect of the invention, a switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.
AU2001281115A 2000-08-04 2001-08-04 Ceramic microelectromechanical structure Abandoned AU2001281115A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09632701 2000-08-04
US09/632,701 US6738600B1 (en) 2000-08-04 2000-08-04 Ceramic microelectromechanical structure
PCT/US2001/024645 WO2002012114A2 (en) 2000-08-04 2001-08-04 Ceramic microelectromechanical structure

Publications (1)

Publication Number Publication Date
AU2001281115A1 true AU2001281115A1 (en) 2002-02-18

Family

ID=24536568

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001281115A Abandoned AU2001281115A1 (en) 2000-08-04 2001-08-04 Ceramic microelectromechanical structure

Country Status (7)

Country Link
US (2) US6738600B1 (en)
EP (1) EP1305258B1 (en)
AT (1) ATE319652T1 (en)
AU (1) AU2001281115A1 (en)
CA (1) CA2417352C (en)
DE (1) DE60117811T2 (en)
WO (1) WO2002012114A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2002243763A1 (en) * 2001-01-31 2002-08-12 Internet Security Systems, Inc. Method and system for configuring and scheduling security audits of a computer network
US6815739B2 (en) * 2001-05-18 2004-11-09 Corporation For National Research Initiatives Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates
US7309842B1 (en) * 2004-03-19 2007-12-18 Verionix Incorporated Shielded monolithic microplasma source for prevention of continuous thin film formation
CN1322527C (en) * 2004-09-21 2007-06-20 清华大学 Micro mechanical switch for regulating resonance frequency using spiral coil inductive structure
FR2895986B1 (en) * 2006-01-06 2008-09-05 Centre Nat Rech Scient PREPARATION OF MULTILAYER MICROCOMPONENTS BY THE METHOD OF THE SACRIFICIAL THICK LAYER
DE102006061386B3 (en) * 2006-12-23 2008-06-19 Atmel Germany Gmbh Integrated assembly, its use and method of manufacture
CN101694895B (en) * 2009-10-30 2012-11-28 上海交通大学 Series radio-frequency micro-electromechanical switch amplified on basis of heat driving and preparation method of same
US9269497B2 (en) 2014-05-30 2016-02-23 Raytheon Company Integrated capacitively-coupled bias circuit for RF MEMS switches

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US5024372A (en) * 1989-01-03 1991-06-18 Motorola, Inc. Method of making high density solder bumps and a substrate socket for high density solder bumps
DE4031248A1 (en) * 1990-10-04 1992-04-09 Kernforschungsz Karlsruhe MICROMECHANICAL ELEMENT
US5121089A (en) 1990-11-01 1992-06-09 Hughes Aircraft Company Micro-machined switch and method of fabrication
US5258591A (en) * 1991-10-18 1993-11-02 Westinghouse Electric Corp. Low inductance cantilever switch
US5326671A (en) * 1992-12-28 1994-07-05 At&T Bell Laboratories Method of making circuit devices comprising a dielectric layer of siloxane-caprolactone
WO1994022531A1 (en) * 1993-03-31 1994-10-13 Motorola Inc. Switch circuit and method therefor
US5455385A (en) 1993-06-28 1995-10-03 Harris Corporation Multilayer LTCC tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses
US5619061A (en) * 1993-07-27 1997-04-08 Texas Instruments Incorporated Micromechanical microwave switching
US5498905A (en) 1994-08-26 1996-03-12 Hughes Aircraft Company Layered features for co-fired module integration
US5665249A (en) 1994-10-17 1997-09-09 Xerox Corporation Micro-electromechanical die module with planarized thick film layer
US5512382A (en) * 1995-05-08 1996-04-30 Alliedsignal Inc. Porous thermal barrier coating
US5661647A (en) 1995-06-07 1997-08-26 Hughes Electronics Low temperature co-fired ceramic UHF/VHF power converters
US5578976A (en) * 1995-06-22 1996-11-26 Rockwell International Corporation Micro electromechanical RF switch
US5708570A (en) 1995-10-11 1998-01-13 Hughes Aircraft Company Shrinkage-matched circuit package utilizing low temperature co-fired ceramic structures
US5638946A (en) 1996-01-11 1997-06-17 Northeastern University Micromechanical switch with insulated switch contact
JPH09199911A (en) * 1996-01-23 1997-07-31 Murata Mfg Co Ltd Thin film multi-layer electrode, high frequency resonator and high frequency transmission line
DE19615787A1 (en) 1996-04-20 1997-10-23 Bosch Gmbh Robert Process for the production of a ceramic multilayer substrate
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US6171921B1 (en) * 1998-06-05 2001-01-09 Motorola, Inc. Method for forming a thick-film resistor and thick-film resistor formed thereby
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US6570750B1 (en) * 2000-04-19 2003-05-27 The United States Of America As Represented By The Secretary Of The Air Force Shunted multiple throw MEMS RF switch
US6865402B1 (en) * 2000-05-02 2005-03-08 Bae Systems Information And Electronic Systems Integration Inc Method and apparatus for using RF-activated MEMS switching element

Also Published As

Publication number Publication date
US20040198231A1 (en) 2004-10-07
DE60117811D1 (en) 2006-05-04
WO2002012114A2 (en) 2002-02-14
US6738600B1 (en) 2004-05-18
DE60117811T2 (en) 2006-08-31
WO2002012114A3 (en) 2002-04-25
EP1305258A2 (en) 2003-05-02
EP1305258B1 (en) 2006-03-08
ATE319652T1 (en) 2006-03-15
CA2417352A1 (en) 2002-02-14
CA2417352C (en) 2006-12-12
US7035591B2 (en) 2006-04-25

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