AU2001277250A1 - Metal catalyst technique for texturing silicon solar cells - Google Patents
Metal catalyst technique for texturing silicon solar cellsInfo
- Publication number
- AU2001277250A1 AU2001277250A1 AU2001277250A AU7725001A AU2001277250A1 AU 2001277250 A1 AU2001277250 A1 AU 2001277250A1 AU 2001277250 A AU2001277250 A AU 2001277250A AU 7725001 A AU7725001 A AU 7725001A AU 2001277250 A1 AU2001277250 A1 AU 2001277250A1
- Authority
- AU
- Australia
- Prior art keywords
- metal
- solar cells
- silicon solar
- metal catalyst
- reactive ion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000002184 metal Substances 0.000 title abstract 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract 2
- 239000003054 catalyst Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 229910052710 silicon Inorganic materials 0.000 title abstract 2
- 239000010703 silicon Substances 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 230000003667 anti-reflective effect Effects 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000001143 conditioned effect Effects 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000002923 metal particle Substances 0.000 abstract 1
- 238000001020 plasma etching Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
Textured silicon solar cells and techniques for their manufacture utilizing metal sources to catalyze formation of randomly distributed surface features such as nanoscale pyramidal and columnar structures. These structures include dimensions smaller than the wavelength of incident light, thereby resulting in a highly effective anti-reflective surface. According to the invention, metal sources present in a reactive ion etching chamber permit impurities (e.g. metal particles) to be introduced into a reactive ion etch plasma resulting in deposition of micro-masks on the surface of a substrate to be etched. Separate embodiments are disclosed including one in which the metal source includes one or more metal-coated substrates strategically positioned relative to the surface to be textured, and another in which the walls of the reaction chamber are pre-conditioned with a thin coating of metal catalyst material.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/634,905 | 2000-08-09 | ||
US09/634,905 US6329296B1 (en) | 2000-08-09 | 2000-08-09 | Metal catalyst technique for texturing silicon solar cells |
PCT/US2001/024340 WO2002013279A2 (en) | 2000-08-09 | 2001-08-03 | Metal catalyst technique for texturing silicon solar cells |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001277250A1 true AU2001277250A1 (en) | 2002-02-18 |
Family
ID=24545629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001277250A Abandoned AU2001277250A1 (en) | 2000-08-09 | 2001-08-03 | Metal catalyst technique for texturing silicon solar cells |
Country Status (7)
Country | Link |
---|---|
US (1) | US6329296B1 (en) |
EP (1) | EP1316115B1 (en) |
JP (1) | JP3855105B2 (en) |
AT (1) | ATE393479T1 (en) |
AU (1) | AU2001277250A1 (en) |
DE (1) | DE60133749D1 (en) |
WO (1) | WO2002013279A2 (en) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7193128B2 (en) * | 1997-06-03 | 2007-03-20 | Chromatin, Inc. | Methods for generating or increasing revenues from crops |
US6897085B2 (en) * | 2003-01-21 | 2005-05-24 | Spheral Solar Power, Inc. | Method of fabricating an optical concentrator for a photovoltaic solar cell |
US20060185715A1 (en) * | 2003-07-25 | 2006-08-24 | Hammerbacher Milfred D | Photovoltaic apparatus including spherical semiconducting particles |
US20050148198A1 (en) * | 2004-01-05 | 2005-07-07 | Technion Research & Development Foundation Ltd. | Texturing a semiconductor material using negative potential dissolution (NPD) |
US7563722B2 (en) * | 2004-03-05 | 2009-07-21 | Applied Nanotech Holdings, Inc. | Method of making a textured surface |
US8350209B2 (en) * | 2005-10-10 | 2013-01-08 | X-Fab Semiconductor Foundries Ag | Production of self-organized pin-type nanostructures, and the rather extensive applications thereof |
DE102005048361B4 (en) * | 2005-10-10 | 2011-07-14 | X-FAB Semiconductor Foundries AG, 99097 | Method for locally coating semiconductor circuits and discrete components with a thermal SiO 2 layer whose surfaces contain areas with needle-shaped structures in nanometer dimensions |
DE102005048366A1 (en) * | 2005-10-10 | 2007-04-19 | X-Fab Semiconductor Foundries Ag | A process for the preparation of low-defect self-organized needle-like structures with nano-dimensions in the range below the usual light wavelengths with high aspect ratio |
JP4852972B2 (en) * | 2005-10-26 | 2012-01-11 | パナソニック電工株式会社 | Optical component manufacturing method and light emitting device |
DE102006013670A1 (en) * | 2006-03-24 | 2007-09-27 | X-Fab Semiconductor Foundries Ag | Optical component for optoelectronic integrated circuit, has surface for wide band anti-reflection coating with needle-like structures with nanometer dimensions with larger aspect ratio, and developed by reactive ion etching process |
DE102006046131B4 (en) | 2006-09-28 | 2020-06-25 | X-Fab Semiconductor Foundries Ag | Process for manufacturing an optical interface for integrated optical applications |
DE102007024478A1 (en) * | 2007-05-25 | 2008-11-27 | Friedrich-Schiller-Universität Jena | Photosensitive semiconductor device |
KR100971658B1 (en) * | 2008-01-03 | 2010-07-22 | 엘지전자 주식회사 | Method for texturing of silicon solar cell |
US8075792B1 (en) * | 2008-03-21 | 2011-12-13 | Alliance For Sustainable Energy, Llc | Nanoparticle-based etching of silicon surfaces |
US8815104B2 (en) * | 2008-03-21 | 2014-08-26 | Alliance For Sustainable Energy, Llc | Copper-assisted, anti-reflection etching of silicon surfaces |
US20090236317A1 (en) * | 2008-03-21 | 2009-09-24 | Midwest Research Institute | Anti-reflection etching of silicon surfaces catalyzed with ionic metal solutions |
US8729798B2 (en) | 2008-03-21 | 2014-05-20 | Alliance For Sustainable Energy, Llc | Anti-reflective nanoporous silicon for efficient hydrogen production |
JP2012521078A (en) | 2009-03-17 | 2012-09-10 | アイメック | Plasma texture method |
TWI379430B (en) * | 2009-04-16 | 2012-12-11 | Atomic Energy Council | A method of fabricating a thin interface for internal light reflection and impurities isolation |
EP2697820B1 (en) | 2009-11-11 | 2018-04-04 | Alliance for Sustainable Energy, LLC | Wet-chemical method for producing a black silicon substrate |
US8828765B2 (en) | 2010-06-09 | 2014-09-09 | Alliance For Sustainable Energy, Llc | Forming high efficiency silicon solar cells using density-graded anti-reflection surfaces |
WO2012061266A2 (en) | 2010-11-01 | 2012-05-10 | The Board Of Trustees Of The University Of Illinois | Method of forming an array of nanostructures |
CN102157608A (en) * | 2010-12-30 | 2011-08-17 | 中国科学院物理研究所 | Method for reducing surface light reflectivity of silicon chip |
DE112012000576B4 (en) | 2011-01-26 | 2023-06-07 | Sumco Corp. | Method of manufacturing a solar cell wafer, a solar cell, and a solar cell module |
US11251318B2 (en) | 2011-03-08 | 2022-02-15 | Alliance For Sustainable Energy, Llc | Efficient black silicon photovoltaic devices with enhanced blue response |
TWI562395B (en) * | 2011-05-25 | 2016-12-11 | Agency Science Tech & Res | Method of forming nanostructures on a substrate and use of the same |
TWI453927B (en) | 2011-06-29 | 2014-09-21 | Ind Tech Res Inst | Multi-reflection structure and photo-electric device |
JP6500018B2 (en) * | 2013-11-05 | 2019-04-10 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | Metal oxide fixed graphene and carbon nanotube hybrid foam |
CN104393114A (en) * | 2014-11-17 | 2015-03-04 | 中国电子科技集团公司第四十八研究所 | Preparation method of polycrystalline black silicon of micro-nano composite suede structure |
CN106711240B (en) * | 2016-11-14 | 2018-06-05 | 华南师范大学 | A kind of preparation method of translucent solar cell |
CN109103301B (en) * | 2018-08-30 | 2020-07-07 | 鲁东大学 | Preparation method of polycrystalline silicon surface micro-nano composite structure |
CN110729379B (en) * | 2019-10-16 | 2021-05-04 | 哈尔滨工业大学 | Preparation method of black silicon substrate with ultralow-reflectivity micro-nano composite structure |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4229233A (en) * | 1979-02-05 | 1980-10-21 | International Business Machines Corporation | Method for fabricating non-reflective semiconductor surfaces by anisotropic reactive ion etching |
US4478209A (en) * | 1982-06-30 | 1984-10-23 | Guarnieri C Richard | Radiant energy collector having plasma-textured polyimide exposed surface |
JP2000022185A (en) * | 1998-07-03 | 2000-01-21 | Sharp Corp | Solar cell and its manufacture |
-
2000
- 2000-08-09 US US09/634,905 patent/US6329296B1/en not_active Expired - Lifetime
-
2001
- 2001-08-03 AT AT01955043T patent/ATE393479T1/en not_active IP Right Cessation
- 2001-08-03 EP EP01955043A patent/EP1316115B1/en not_active Expired - Lifetime
- 2001-08-03 JP JP2002518537A patent/JP3855105B2/en not_active Expired - Lifetime
- 2001-08-03 AU AU2001277250A patent/AU2001277250A1/en not_active Abandoned
- 2001-08-03 WO PCT/US2001/024340 patent/WO2002013279A2/en active Application Filing
- 2001-08-03 DE DE60133749T patent/DE60133749D1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ATE393479T1 (en) | 2008-05-15 |
EP1316115A2 (en) | 2003-06-04 |
EP1316115B1 (en) | 2008-04-23 |
US6329296B1 (en) | 2001-12-11 |
WO2002013279A3 (en) | 2003-04-03 |
DE60133749D1 (en) | 2008-06-05 |
JP3855105B2 (en) | 2006-12-06 |
JP2004506330A (en) | 2004-02-26 |
WO2002013279A2 (en) | 2002-02-14 |
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