AU2001270026A1 - Accelerometer with folded beams - Google Patents
Accelerometer with folded beamsInfo
- Publication number
- AU2001270026A1 AU2001270026A1 AU2001270026A AU7002601A AU2001270026A1 AU 2001270026 A1 AU2001270026 A1 AU 2001270026A1 AU 2001270026 A AU2001270026 A AU 2001270026A AU 7002601 A AU7002601 A AU 7002601A AU 2001270026 A1 AU2001270026 A1 AU 2001270026A1
- Authority
- AU
- Australia
- Prior art keywords
- accelerometer
- folded beams
- beams
- folded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V1/00—Seismology; Seismic or acoustic prospecting or detecting
- G01V1/16—Receiving elements for seismic signals; Arrangements or adaptations of receiving elements
- G01V1/18—Receiving elements, e.g. seismometer, geophone or torque detectors, for localised single point measurements
- G01V1/181—Geophones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
- B81B7/0016—Protection against shocks or vibrations, e.g. vibration damping
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0109—Bridges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0145—Flexible holders
- B81B2203/0163—Spring holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/05—Type of movement
- B81B2203/053—Translation according to an axis perpendicular to the substrate
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Remote Sensing (AREA)
- Computer Hardware Design (AREA)
- Toxicology (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Acoustics & Sound (AREA)
- Environmental & Geological Engineering (AREA)
- Geology (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geophysics (AREA)
- Mechanical Engineering (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21299700P | 2000-06-21 | 2000-06-21 | |
US60212997 | 2000-06-21 | ||
US21760900P | 2000-07-11 | 2000-07-11 | |
US60217609 | 2000-07-11 | ||
PCT/US2001/019796 WO2001098786A1 (en) | 2000-06-21 | 2001-06-21 | Accelerometer with folded beams |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001270026A1 true AU2001270026A1 (en) | 2002-01-02 |
Family
ID=26907684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001270026A Abandoned AU2001270026A1 (en) | 2000-06-21 | 2001-06-21 | Accelerometer with folded beams |
Country Status (6)
Country | Link |
---|---|
US (2) | US6805008B2 (en) |
EP (2) | EP1311863A4 (en) |
AU (1) | AU2001270026A1 (en) |
CA (1) | CA2413965C (en) |
NO (1) | NO20026151L (en) |
WO (1) | WO2001098786A1 (en) |
Families Citing this family (54)
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DE10116931A1 (en) | 2001-04-05 | 2002-10-17 | Bosch Gmbh Robert | sensor |
US7248703B1 (en) | 2001-06-26 | 2007-07-24 | Bbn Technologies Corp. | Systems and methods for adaptive noise cancellation |
US7274621B1 (en) | 2002-06-13 | 2007-09-25 | Bbn Technologies Corp. | Systems and methods for flow measurement |
US7138293B2 (en) * | 2002-10-04 | 2006-11-21 | Dalsa Semiconductor Inc. | Wafer level packaging technique for microdevices |
US7255196B1 (en) | 2002-11-19 | 2007-08-14 | Bbn Technologies Corp. | Windshield and sound-barrier for seismic sensors |
US6865944B2 (en) * | 2002-12-16 | 2005-03-15 | Honeywell International Inc. | Methods and systems for decelerating proof mass movements within MEMS structures |
US6817244B2 (en) * | 2003-01-06 | 2004-11-16 | Honeywell International Inc. | Methods and systems for actively controlling movement within MEMS structures |
US6718825B1 (en) | 2003-01-17 | 2004-04-13 | Honeywell International Inc. | Methods and systems for reducing stick-down within MEMS structures |
US6860151B2 (en) * | 2003-02-07 | 2005-03-01 | Honeywell International Inc. | Methods and systems for controlling movement within MEMS structures |
US6978673B2 (en) * | 2003-02-07 | 2005-12-27 | Honeywell International, Inc. | Methods and systems for simultaneously fabricating multi-frequency MEMS devices |
EP1491901A1 (en) * | 2003-06-25 | 2004-12-29 | Matsushita Electric Works, Ltd. | Semiconductor acceleration sensor and method of manufacturing the same |
US7284431B1 (en) * | 2003-11-14 | 2007-10-23 | Bbn Technologies Corp. | Geophone |
US7013730B2 (en) * | 2003-12-15 | 2006-03-21 | Honeywell International, Inc. | Internally shock caged serpentine flexure for micro-machined accelerometer |
US7012322B2 (en) * | 2003-12-22 | 2006-03-14 | Honeywell International Inc. | Method for reducing harmonic distortion in comb drive devices |
US7036373B2 (en) | 2004-06-29 | 2006-05-02 | Honeywell International, Inc. | MEMS gyroscope with horizontally oriented drive electrodes |
US7232701B2 (en) * | 2005-01-04 | 2007-06-19 | Freescale Semiconductor, Inc. | Microelectromechanical (MEM) device with a protective cap that functions as a motion stop |
US20070163346A1 (en) * | 2006-01-18 | 2007-07-19 | Honeywell International Inc. | Frequency shifting of rotational harmonics in mems devices |
US7516661B2 (en) * | 2006-02-23 | 2009-04-14 | Honeywell International Inc. | Z offset MEMS device |
DE102007002725A1 (en) * | 2007-01-18 | 2008-07-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Housing for micromechanical and micro-optical components used in mobile applications |
US20080253226A1 (en) * | 2007-04-11 | 2008-10-16 | Stig Rune Lennart Tenghamn | System and method for marine seismic surveying |
JP5165294B2 (en) * | 2007-07-06 | 2013-03-21 | 三菱電機株式会社 | Capacitance type acceleration sensor |
US8011247B2 (en) * | 2008-06-26 | 2011-09-06 | Honeywell International Inc. | Multistage proof-mass movement deceleration within MEMS structures |
US8187902B2 (en) | 2008-07-09 | 2012-05-29 | The Charles Stark Draper Laboratory, Inc. | High performance sensors and methods for forming the same |
US8104346B2 (en) * | 2008-11-10 | 2012-01-31 | Westerngeco L.L.C. | MEMS-based capacitive sensor |
US8098546B2 (en) * | 2009-07-08 | 2012-01-17 | Geospace Technologies, Lp | Geophone having improved sensitivity |
US8208347B2 (en) * | 2009-07-08 | 2012-06-26 | Geospace Technologies, Lp | Geophone having improved damping control |
US8050144B2 (en) * | 2009-07-08 | 2011-11-01 | Geospace Technologies Lp | Vertical geophone having improved distortion characteristics |
US8322216B2 (en) * | 2009-09-22 | 2012-12-04 | Duli Yu | Micromachined accelerometer with monolithic electrodes and method of making the same |
US8722445B2 (en) | 2010-06-25 | 2014-05-13 | International Business Machines Corporation | Planar cavity MEMS and related structures, methods of manufacture and design structures |
US9010170B2 (en) | 2010-08-16 | 2015-04-21 | Westerngeco L.L.C. | Method and apparatus to test an accelerometer |
US9217805B2 (en) | 2010-10-01 | 2015-12-22 | Westerngeco L.L.C. | Monitoring the quality of particle motion data during a seismic acquisition |
CN103547895B (en) * | 2011-02-07 | 2016-08-24 | 离子地球物理学公司 | For the method and apparatus sensing underwater signal |
US10292445B2 (en) | 2011-02-24 | 2019-05-21 | Rochester Institute Of Technology | Event monitoring dosimetry apparatuses and methods thereof |
US9339224B2 (en) | 2011-02-24 | 2016-05-17 | Rochester Institute Of Technology | Event dosimeter devices and methods thereof |
CN102602879B (en) * | 2011-11-23 | 2016-01-06 | 中国计量学院 | Two step corrosion manufacture methods of resonance type accelerometer resonance beam and brace summer |
GB2498520A (en) * | 2012-01-13 | 2013-07-24 | Secr Defence | Accelerometer |
US8800371B2 (en) * | 2012-03-08 | 2014-08-12 | Industrial Technology Research Institute | Electrostatic force generator and force measurement system and accelerometer having the same |
US20150059430A1 (en) * | 2012-04-20 | 2015-03-05 | Panasonic Intellectual Property Management Co., Ltd. | Inertial force sensor |
JP5888411B2 (en) * | 2012-04-27 | 2016-03-22 | 株式会社村田製作所 | Acceleration sensor |
CN103675346B (en) | 2012-09-21 | 2018-03-06 | 中国科学院地质与地球物理研究所 | A kind of accelerometer and its manufacturing process |
CN103675345B (en) * | 2012-09-21 | 2017-12-01 | 中国科学院地质与地球物理研究所 | A kind of accelerometer and its manufacturing process |
CN102879608B (en) * | 2012-10-26 | 2014-12-24 | 中国科学院上海微系统与信息技术研究所 | Capacitive acceleration transducer for bending elastic beam and manufacturing method |
CN102879609B (en) * | 2012-10-26 | 2013-11-27 | 中国科学院上海微系统与信息技术研究所 | Capacitive acceleration transducer for H-shaped beam and manufacturing method thereof |
US20140260617A1 (en) * | 2013-03-14 | 2014-09-18 | Agency For Science Technology And Research (A*Star) | Fully differential capacitive architecture for mems accelerometer |
US20140260618A1 (en) * | 2013-03-14 | 2014-09-18 | Agency For Science Technology And Research (A*Star) | Force feedback electrodes in mems accelerometer |
CN104166016B (en) | 2013-05-16 | 2016-06-01 | 中国科学院地质与地球物理研究所 | A kind of highly sensitive 3 axis MEMS jerkmeter and manufacturing process thereof |
CN104296784B (en) * | 2013-07-19 | 2017-02-15 | 中国科学院地质与地球物理研究所 | MEMS detection device and manufacturing technology thereof |
US9470806B2 (en) | 2013-08-29 | 2016-10-18 | Pgs Geophysical As | Piezoelectric accelerometer |
EP3147258A1 (en) * | 2015-09-22 | 2017-03-29 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Connection panel for electronic components |
US10345330B2 (en) | 2015-09-25 | 2019-07-09 | Apple Inc. | Mechanical low pass filter for motion sensors |
US10324105B2 (en) * | 2015-09-25 | 2019-06-18 | Apple Inc. | Mechanical low pass filter for motion sensors |
CN107045073B (en) * | 2017-02-07 | 2019-07-09 | 中国科学院上海微系统与信息技术研究所 | Single silicon-chip double-sided symmetrical folds girder construction micro-acceleration sensor and preparation method thereof |
FR3090613B1 (en) * | 2018-12-20 | 2021-01-22 | Commissariat Energie Atomique | JOINT FOR MICRO AND NANOELECTROMECHANICAL SYSTEMS WITH OUT-OF-PLAN DISPLACEMENT OFFERING REDUCED NON-LINEARITY |
CN109704268A (en) * | 2019-02-21 | 2019-05-03 | 厦门大学 | A kind of stretchable immune substrate of electronic interferences deformation |
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US3877296A (en) * | 1970-12-09 | 1975-04-15 | Kinemetrics Inc | Strong motion accelerograph with self-starter and electrical as well as light outputs |
US3884085A (en) * | 1972-04-05 | 1975-05-20 | Robinson Halpern Company | Accelerometer assembly |
US4922756A (en) | 1988-06-20 | 1990-05-08 | Triton Technologies, Inc. | Micro-machined accelerometer |
US5095749A (en) * | 1986-08-25 | 1992-03-17 | Hanson Richard A | Proofmass suspension assembly for accelerometers |
US5331853A (en) * | 1991-02-08 | 1994-07-26 | Alliedsignal Inc. | Micromachined rate and acceleration sensor |
US5345823A (en) * | 1991-11-12 | 1994-09-13 | Texas Instruments Incorporated | Accelerometer |
US5412987A (en) * | 1992-09-24 | 1995-05-09 | Siemens Automotive L.P. | Folded cantilever beam accelerometer |
US5507182A (en) * | 1993-02-18 | 1996-04-16 | Nippondenso Co., Ltd. | Semiconductor accelerometer with damperless structure |
US5777226A (en) | 1994-03-28 | 1998-07-07 | I/O Sensors, Inc. | Sensor structure with L-shaped spring legs |
US5484073A (en) | 1994-03-28 | 1996-01-16 | I/O Sensors, Inc. | Method for fabricating suspension members for micromachined sensors |
WO1995026509A1 (en) * | 1994-03-28 | 1995-10-05 | I/O Sensors, Inc. | Sensor structure with l-shaped spring legs |
DE19509868A1 (en) * | 1995-03-17 | 1996-09-19 | Siemens Ag | Micromechanical semiconductor component |
US5852242A (en) * | 1995-12-04 | 1998-12-22 | I/O Sensors, Inc. | Apparatus with mechanical and electric springs and method for its manufacture |
JPH10173052A (en) * | 1996-12-13 | 1998-06-26 | Fujitsu Ltd | Semiconductor device and its manufacture |
US5831162A (en) * | 1997-01-21 | 1998-11-03 | Delco Electronics Corporation | Silicon micromachined motion sensor and method of making |
US5674775A (en) * | 1997-02-20 | 1997-10-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Isolation trench with a rounded top edge using an etch buffer layer |
US6077790A (en) * | 1997-03-14 | 2000-06-20 | Micron Technology, Inc. | Etching process using a buffer layer |
US6223598B1 (en) * | 1997-06-18 | 2001-05-01 | Analog Devices, Inc. | Suspension arrangement for semiconductor accelerometer |
JP3439135B2 (en) * | 1998-10-05 | 2003-08-25 | 沖電気工業株式会社 | Semiconductor device manufacturing method and semiconductor device |
US6105428A (en) | 1998-12-10 | 2000-08-22 | Motorola, Inc. | Sensor and method of use |
US6128954A (en) * | 1998-12-18 | 2000-10-10 | Delco Electronics Corporation | Spring for a resonance ring of an angular rate sensor |
US6158815A (en) * | 1998-12-24 | 2000-12-12 | Toyo Tire & Rubber Co., Ltd. | Seat having a seat cushion including a polyurethane foam pad onto a portion of which a stretchable, nonwoven fabric is laminated |
US6035694A (en) * | 1999-03-12 | 2000-03-14 | I/O Of Austin, Inc. | Method and apparatus for calibration of stray capacitance mismatch in a closed loop electro-mechanical accelerometer |
KR100404560B1 (en) * | 2001-01-06 | 2003-11-05 | 삼성전자주식회사 | Method of manufacturing semiconductor device |
US6393914B1 (en) * | 2001-02-13 | 2002-05-28 | Delphi Technologies, Inc. | Angular accelerometer |
-
2001
- 2001-06-21 CA CA2413965A patent/CA2413965C/en not_active Expired - Lifetime
- 2001-06-21 EP EP01948555A patent/EP1311863A4/en not_active Withdrawn
- 2001-06-21 EP EP20090011656 patent/EP2136215A3/en not_active Withdrawn
- 2001-06-21 US US09/886,320 patent/US6805008B2/en not_active Expired - Lifetime
- 2001-06-21 AU AU2001270026A patent/AU2001270026A1/en not_active Abandoned
- 2001-06-21 WO PCT/US2001/019796 patent/WO2001098786A1/en active Application Filing
-
2002
- 2002-12-20 NO NO20026151A patent/NO20026151L/en not_active Application Discontinuation
-
2004
- 2004-07-22 US US10/897,147 patent/US20040255675A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP2136215A3 (en) | 2014-01-01 |
US20040255675A1 (en) | 2004-12-23 |
US6805008B2 (en) | 2004-10-19 |
CA2413965A1 (en) | 2001-12-27 |
EP2136215A2 (en) | 2009-12-23 |
NO20026151D0 (en) | 2002-12-20 |
EP1311863A1 (en) | 2003-05-21 |
CA2413965C (en) | 2011-01-11 |
WO2001098786A1 (en) | 2001-12-27 |
NO20026151L (en) | 2003-02-14 |
EP1311863A4 (en) | 2003-07-30 |
US20020178817A1 (en) | 2002-12-05 |
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