AU2001263176A1 - Redundancy analysis method and apparatus for memory testing - Google Patents
Redundancy analysis method and apparatus for memory testingInfo
- Publication number
- AU2001263176A1 AU2001263176A1 AU2001263176A AU6317601A AU2001263176A1 AU 2001263176 A1 AU2001263176 A1 AU 2001263176A1 AU 2001263176 A AU2001263176 A AU 2001263176A AU 6317601 A AU6317601 A AU 6317601A AU 2001263176 A1 AU2001263176 A1 AU 2001263176A1
- Authority
- AU
- Australia
- Prior art keywords
- analysis method
- memory testing
- redundancy analysis
- redundancy
- testing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/72—Masking faults in memories by using spares or by reconfiguring with optimized replacement algorithms
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/44—Indication or identification of errors, e.g. for repair
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09574689 | 2000-05-17 | ||
US09/574,689 US6499118B1 (en) | 2000-05-17 | 2000-05-17 | Redundancy analysis method and apparatus for ATE |
PCT/US2001/015783 WO2001093276A1 (en) | 2000-05-17 | 2001-05-16 | Redundancy analysis method and apparatus for memory testing |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001263176A1 true AU2001263176A1 (en) | 2001-12-11 |
Family
ID=24297200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001263176A Abandoned AU2001263176A1 (en) | 2000-05-17 | 2001-05-16 | Redundancy analysis method and apparatus for memory testing |
Country Status (6)
Country | Link |
---|---|
US (1) | US6499118B1 (en) |
KR (1) | KR100795520B1 (en) |
AU (1) | AU2001263176A1 (en) |
MY (1) | MY121478A (en) |
TW (1) | TW497193B (en) |
WO (1) | WO2001093276A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1273923A1 (en) * | 2001-07-03 | 2003-01-08 | Koninklijke Philips Electronics N.V. | Testing a batch of electrical components |
US7253650B2 (en) * | 2004-05-25 | 2007-08-07 | International Business Machines Corporation | Increase productivity at wafer test using probe retest data analysis |
US7423442B2 (en) * | 2005-07-22 | 2008-09-09 | Texas Instruments Incorporated | System and method for early qualification of semiconductor devices |
US20080270854A1 (en) | 2007-04-24 | 2008-10-30 | Micron Technology, Inc. | System and method for running test and redundancy analysis in parallel |
US11360840B2 (en) | 2020-01-20 | 2022-06-14 | Samsung Electronics Co., Ltd. | Method and apparatus for performing redundancy analysis of a semiconductor device |
US11456049B2 (en) * | 2020-07-02 | 2022-09-27 | Micron Technology, Inc. | Memory device testing, and associated methods, devices, and systems |
US11797371B2 (en) | 2020-08-18 | 2023-10-24 | Changxin Memory Technologies, Inc. | Method and device for determining fail bit repair scheme |
EP3985675B1 (en) | 2020-08-18 | 2024-01-31 | Changxin Memory Technologies, Inc. | Method and device for repairing fail bits |
US11887685B2 (en) | 2020-08-18 | 2024-01-30 | Changxin Memory Technologies, Inc. | Fail Bit repair method and device |
US11791010B2 (en) | 2020-08-18 | 2023-10-17 | Changxin Memory Technologies, Inc. | Method and device for fail bit repairing |
US20220310187A1 (en) * | 2021-03-26 | 2022-09-29 | Changxin Memory Technologies, Inc. | Redundant circuit assigning method and device, and medium |
US11791012B2 (en) | 2021-03-31 | 2023-10-17 | Changxin Memory Technologies, Inc. | Standby circuit dispatch method, apparatus, device and medium |
US11881278B2 (en) * | 2021-03-31 | 2024-01-23 | Changxin Memory Technologies, Inc. | Redundant circuit assigning method and device, apparatus and medium |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0670668B2 (en) * | 1989-09-08 | 1994-09-07 | 株式会社東芝 | Electronic component inspection device |
US5588115A (en) * | 1993-01-29 | 1996-12-24 | Teradyne, Inc. | Redundancy analyzer for automatic memory tester |
US5522038A (en) * | 1993-04-16 | 1996-05-28 | Micron Technology, Inc. | Testing mapped signal sources |
US5795797A (en) * | 1995-08-18 | 1998-08-18 | Teradyne, Inc. | Method of making memory chips using memory tester providing fast repair |
US5754556A (en) | 1996-07-18 | 1998-05-19 | Teradyne, Inc. | Semiconductor memory tester with hardware accelerators |
US5764650A (en) | 1996-08-02 | 1998-06-09 | Micron Technology, Inc. | Intelligent binning for electrically repairable semiconductor chips |
US5867505A (en) | 1996-08-07 | 1999-02-02 | Micron Technology, Inc. | Method and apparatus for testing an integrated circuit including the step/means for storing an associated test identifier in association with integrated circuit identifier for each test to be performed on the integrated circuit |
JPH10289597A (en) | 1997-04-14 | 1998-10-27 | Advantest Corp | Memory testing device |
JP2000156095A (en) * | 1998-11-19 | 2000-06-06 | Asia Electronics Inc | Method and device for testing semiconductor memory |
JP3555859B2 (en) * | 2000-03-27 | 2004-08-18 | 広島日本電気株式会社 | Semiconductor production system and semiconductor device production method |
-
2000
- 2000-05-17 US US09/574,689 patent/US6499118B1/en not_active Expired - Lifetime
-
2001
- 2001-05-16 WO PCT/US2001/015783 patent/WO2001093276A1/en active Application Filing
- 2001-05-16 KR KR1020027015499A patent/KR100795520B1/en active IP Right Grant
- 2001-05-16 AU AU2001263176A patent/AU2001263176A1/en not_active Abandoned
- 2001-05-17 MY MYPI20012359A patent/MY121478A/en unknown
- 2001-05-17 TW TW090112031A patent/TW497193B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2001093276A1 (en) | 2001-12-06 |
MY121478A (en) | 2006-01-28 |
KR20030001512A (en) | 2003-01-06 |
TW497193B (en) | 2002-08-01 |
KR100795520B1 (en) | 2008-01-16 |
US6499118B1 (en) | 2002-12-24 |
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