AU2001251530A1 - Making integral heat spreader by coining - Google Patents

Making integral heat spreader by coining

Info

Publication number
AU2001251530A1
AU2001251530A1 AU2001251530A AU5153001A AU2001251530A1 AU 2001251530 A1 AU2001251530 A1 AU 2001251530A1 AU 2001251530 A AU2001251530 A AU 2001251530A AU 5153001 A AU5153001 A AU 5153001A AU 2001251530 A1 AU2001251530 A1 AU 2001251530A1
Authority
AU
Australia
Prior art keywords
coining
heat spreader
integral heat
making integral
making
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001251530A
Other languages
English (en)
Inventor
Russell J. Anderson Iii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intri Plex Technologies Inc
Original Assignee
Intri Plex Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intri Plex Technologies Inc filed Critical Intri Plex Technologies Inc
Publication of AU2001251530A1 publication Critical patent/AU2001251530A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4878Mechanical treatment, e.g. deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)
AU2001251530A 2000-04-10 2001-04-10 Making integral heat spreader by coining Abandoned AU2001251530A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US19594700P 2000-04-10 2000-04-10
US60195947 2000-04-10
PCT/US2001/011782 WO2001076789A1 (fr) 2000-04-10 2001-04-10 Fabrication d'un dissipateur thermique monobloc par estampage

Publications (1)

Publication Number Publication Date
AU2001251530A1 true AU2001251530A1 (en) 2001-10-23

Family

ID=22723483

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001251530A Abandoned AU2001251530A1 (en) 2000-04-10 2001-04-10 Making integral heat spreader by coining

Country Status (3)

Country Link
US (1) US7506527B2 (fr)
AU (1) AU2001251530A1 (fr)
WO (1) WO2001076789A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7065478B2 (en) * 2001-12-31 2006-06-20 Ugs Corp. Computer-aided progressive die design system and method
US9153520B2 (en) 2011-11-14 2015-10-06 Micron Technology, Inc. Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods
CN103639259A (zh) * 2013-12-13 2014-03-19 宁波东源音响器材有限公司 用于冲压高音扬声器的壳盖的设备
US20190009318A1 (en) * 2017-07-05 2019-01-10 Springfield Spring Corporation Method for manufacturing a metal insert for a collar device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2839955A (en) 1954-10-29 1958-06-24 Western Electric Co Article-working apparatus
GB1238056A (fr) * 1968-10-02 1971-07-07
GB1467168A (en) * 1973-07-10 1977-03-16 Sato Y Process for manufacturing a base for a semiconductor device
DE2346810C3 (de) * 1973-09-18 1978-08-10 Theodor Graebener Maschinenfabrik, 5931 Netphen Münzprägemaschine
US4284670A (en) 1976-08-06 1981-08-18 Aluminum Company Of America Method for applying lubricants onto metal working surfaces
US5289039A (en) * 1988-02-05 1994-02-22 Citizen Watch Co., Ltd. Resin encapsulated semiconductor device
GB8816380D0 (en) * 1988-07-15 1988-08-10 Metal Box Plc Press & transfer tool
US5789810A (en) 1995-12-21 1998-08-04 International Business Machines Corporation Semiconductor cap

Also Published As

Publication number Publication date
WO2001076789A1 (fr) 2001-10-18
US7506527B2 (en) 2009-03-24
US20040123639A1 (en) 2004-07-01

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