AU2001251530A1 - Making integral heat spreader by coining - Google Patents
Making integral heat spreader by coiningInfo
- Publication number
- AU2001251530A1 AU2001251530A1 AU2001251530A AU5153001A AU2001251530A1 AU 2001251530 A1 AU2001251530 A1 AU 2001251530A1 AU 2001251530 A AU2001251530 A AU 2001251530A AU 5153001 A AU5153001 A AU 5153001A AU 2001251530 A1 AU2001251530 A1 AU 2001251530A1
- Authority
- AU
- Australia
- Prior art keywords
- coining
- heat spreader
- integral heat
- making integral
- making
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US19594700P | 2000-04-10 | 2000-04-10 | |
US60195947 | 2000-04-10 | ||
PCT/US2001/011782 WO2001076789A1 (fr) | 2000-04-10 | 2001-04-10 | Fabrication d'un dissipateur thermique monobloc par estampage |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001251530A1 true AU2001251530A1 (en) | 2001-10-23 |
Family
ID=22723483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001251530A Abandoned AU2001251530A1 (en) | 2000-04-10 | 2001-04-10 | Making integral heat spreader by coining |
Country Status (3)
Country | Link |
---|---|
US (1) | US7506527B2 (fr) |
AU (1) | AU2001251530A1 (fr) |
WO (1) | WO2001076789A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7065478B2 (en) * | 2001-12-31 | 2006-06-20 | Ugs Corp. | Computer-aided progressive die design system and method |
US9153520B2 (en) | 2011-11-14 | 2015-10-06 | Micron Technology, Inc. | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods |
CN103639259A (zh) * | 2013-12-13 | 2014-03-19 | 宁波东源音响器材有限公司 | 用于冲压高音扬声器的壳盖的设备 |
US20190009318A1 (en) * | 2017-07-05 | 2019-01-10 | Springfield Spring Corporation | Method for manufacturing a metal insert for a collar device |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2839955A (en) | 1954-10-29 | 1958-06-24 | Western Electric Co | Article-working apparatus |
GB1238056A (fr) * | 1968-10-02 | 1971-07-07 | ||
GB1467168A (en) * | 1973-07-10 | 1977-03-16 | Sato Y | Process for manufacturing a base for a semiconductor device |
DE2346810C3 (de) * | 1973-09-18 | 1978-08-10 | Theodor Graebener Maschinenfabrik, 5931 Netphen | Münzprägemaschine |
US4284670A (en) | 1976-08-06 | 1981-08-18 | Aluminum Company Of America | Method for applying lubricants onto metal working surfaces |
US5289039A (en) * | 1988-02-05 | 1994-02-22 | Citizen Watch Co., Ltd. | Resin encapsulated semiconductor device |
GB8816380D0 (en) * | 1988-07-15 | 1988-08-10 | Metal Box Plc | Press & transfer tool |
US5789810A (en) | 1995-12-21 | 1998-08-04 | International Business Machines Corporation | Semiconductor cap |
-
2001
- 2001-04-10 AU AU2001251530A patent/AU2001251530A1/en not_active Abandoned
- 2001-04-10 WO PCT/US2001/011782 patent/WO2001076789A1/fr active Application Filing
- 2001-04-10 US US10/257,594 patent/US7506527B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2001076789A1 (fr) | 2001-10-18 |
US7506527B2 (en) | 2009-03-24 |
US20040123639A1 (en) | 2004-07-01 |
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