AU2001250604A1 - Method and apparatus for temperature controlled vapor deposition on a substrate - Google Patents

Method and apparatus for temperature controlled vapor deposition on a substrate

Info

Publication number
AU2001250604A1
AU2001250604A1 AU2001250604A AU5060401A AU2001250604A1 AU 2001250604 A1 AU2001250604 A1 AU 2001250604A1 AU 2001250604 A AU2001250604 A AU 2001250604A AU 5060401 A AU5060401 A AU 5060401A AU 2001250604 A1 AU2001250604 A1 AU 2001250604A1
Authority
AU
Australia
Prior art keywords
substrate
vapor deposition
layer
temperature controlled
substance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001250604A
Inventor
Zvi Finkelstein
Dina Katsir
Israel Tartakovsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Acktar Ltd
Original Assignee
Acktar Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acktar Ltd filed Critical Acktar Ltd
Publication of AU2001250604A1 publication Critical patent/AU2001250604A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/541Heating or cooling of the substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

A method of controlling the temperature of a low thermal emittance substrate (18) during a vapor deposition process which includes a first step of forming a preselected substance on a first side of the substrate (18) by vapor deposition, the substance having a high thermal emittance layer (40). The method includes a second step of forming on a second side of the substrate, a layer of a preselected substance (42), where the layer on the first side (42) radiates excess heat away from the substrate (18), thereby preventing heating of the substrate (18) to more than a predetermined temperature. Several multi-stage, free-span, vapor deposition apparatuses (10, 50, 70, 80, 90) are also taught which use the above method.
AU2001250604A 2000-04-09 2001-04-05 Method and apparatus for temperature controlled vapor deposition on a substrate Abandoned AU2001250604A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL13555000A IL135550A0 (en) 2000-04-09 2000-04-09 Method and apparatus for temperature controlled vapor deposition on a substrate
PCT/IL2001/000326 WO2001076768A1 (en) 2000-04-09 2001-04-05 Method and apparatus for temperature controlled vapor deposition on a substrate

Publications (1)

Publication Number Publication Date
AU2001250604A1 true AU2001250604A1 (en) 2001-10-23

Family

ID=11074035

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001250604A Abandoned AU2001250604A1 (en) 2000-04-09 2001-04-05 Method and apparatus for temperature controlled vapor deposition on a substrate

Country Status (7)

Country Link
EP (1) EP1390157B1 (en)
JP (1) JP4439156B2 (en)
AT (1) ATE393840T1 (en)
AU (1) AU2001250604A1 (en)
DE (1) DE60133838T2 (en)
IL (1) IL135550A0 (en)
WO (1) WO2001076768A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2418628B (en) 2004-10-01 2006-12-13 Acktar Ltd Improved laminates and the manufacture thereof
JP4747658B2 (en) * 2005-04-22 2011-08-17 大日本印刷株式会社 Film forming apparatus and film forming method
JP4747665B2 (en) * 2005-05-11 2011-08-17 大日本印刷株式会社 Film forming apparatus and film forming method
WO2007014924A1 (en) 2005-07-29 2007-02-08 Tibotec Pharmaceuticals Ltd. Macrocyclic inhibitors of hepatitis c virus
CN101965640A (en) * 2008-03-04 2011-02-02 索莱克山特公司 Process for making solar cells
JP5528727B2 (en) * 2009-06-19 2014-06-25 富士フイルム株式会社 Thin film transistor manufacturing apparatus, oxide semiconductor thin film manufacturing method, thin film transistor manufacturing method, oxide semiconductor thin film, thin film transistor, and light emitting device
JP5278218B2 (en) * 2009-07-15 2013-09-04 住友金属鉱山株式会社 Long resin film processing apparatus and roll cooling apparatus, roll cooling method, and long resin film and roll cooling method
JP5959099B2 (en) * 2011-07-29 2016-08-02 日東電工株式会社 Manufacturing method of laminate
CN103628046B (en) * 2012-08-24 2015-11-11 中微半导体设备(上海)有限公司 A kind of temperature controlling system and temperature control method regulating substrate surface temperature
US10821240B2 (en) 2014-02-11 2020-11-03 Vapor Cartridge Technology Llc Methods and drug delivery devices using cannabis
US9220294B2 (en) 2014-02-11 2015-12-29 Timothy McCullough Methods and devices using cannabis vapors
US9380813B2 (en) * 2014-02-11 2016-07-05 Timothy McCullough Drug delivery system and method
US20220115185A1 (en) * 2019-02-20 2022-04-14 Panasonic Intellectual Property Management Co., Ltd. Film production method, film production device, and electrode foil production method
CA3154135A1 (en) 2019-09-16 2021-03-25 Vapor Cartridge Technology Llc Drug delivery system with stackable substrates

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59173266A (en) * 1983-03-23 1984-10-01 Fuji Photo Film Co Ltd Apparatus for formation of thin film
EP0344316B1 (en) * 1987-07-30 1994-11-02 Matsushita Electric Industrial Co., Ltd. Method for producing an electrolytic capacitor
US4844009A (en) * 1987-11-28 1989-07-04 Leybold Aktiengesellschaft Apparatus for coating webs of material having an open structure in depth
WO1989010430A1 (en) * 1988-04-27 1989-11-02 American Thin Film Laboratories, Inc. Vacuum coating system
US5239026A (en) * 1991-08-26 1993-08-24 Minnesota Mining And Manufacturing Company Low loss high numerical aperture cladded optical fibers
US5803976A (en) * 1993-11-09 1998-09-08 Imperial Chemical Industries Plc Vacuum web coating
TW289900B (en) * 1994-04-22 1996-11-01 Gould Electronics Inc
TW359688B (en) * 1995-02-28 1999-06-01 Nisshin Steel Co Ltd High anticorrosion Zn-Mg series-plated steel sheet and method of manufacture it
DE69636627T2 (en) * 1995-08-04 2007-08-30 Ngimat Co. CHEMICAL GAS PHASE DEPOSITION AND POWDER FORMATION USING A THERMAL SPRAYING METHOD FROM LONG-TERM SUPERCITIC AND SUPERCRITICAL FLUID SOLUTIONS

Also Published As

Publication number Publication date
JP2005537385A (en) 2005-12-08
EP1390157B1 (en) 2008-04-30
ATE393840T1 (en) 2008-05-15
EP1390157A1 (en) 2004-02-25
DE60133838D1 (en) 2008-06-12
EP1390157A4 (en) 2006-06-07
IL135550A0 (en) 2001-05-20
JP4439156B2 (en) 2010-03-24
WO2001076768A1 (en) 2001-10-18
DE60133838T2 (en) 2009-06-10

Similar Documents

Publication Publication Date Title
WO1997003236A3 (en) System and method for thermal processing of a semiconductor substrate
AU2001250604A1 (en) Method and apparatus for temperature controlled vapor deposition on a substrate
WO2004082821A3 (en) Processing system and method for thermally treating a substrate
WO2003060184A8 (en) Method and apparatus for forming silicon containing films
EP1209251A3 (en) Temperature control system for wafer
WO2002056349A3 (en) Chamber for uniform substrate heating
WO2002071446A3 (en) Method and apparatus for active temperature control of susceptors
WO1999057751A3 (en) Method and apparatus for controlling the radial temperature gradient of a wafer while ramping the wafer temperature
CA2363767A1 (en) Device and method for thermally treating substrates
WO2001018604A3 (en) Method and apparatus for thermal processing a photosensitive element
TW349247B (en) Process for producing semiconductor element
WO2005006400A3 (en) Substrate support having dynamic temperature control
TW200709278A (en) Method and apparatus to control semiconductor film deposition characteristics
EP1235257A4 (en) Semiconductor-manufacturing apparatus
EP1067587A3 (en) Thermally processing a substrate
WO2004025710A3 (en) Method of heating a substrate in a variable temperature process using a fixed temperature chuck
EP1075015A3 (en) A method and apparatus for thermal control of a semiconductor substrate
CA2177645A1 (en) Apparatus and Method for Depositing a Substance with Temperature Control
HK1070985A1 (en) Method for thermally treating substrates
WO2004078537A3 (en) Fluid heater temperature control apparatus and method
JPS55110032A (en) Method for high-frequency heated epitaxial growth
AU2002368438A1 (en) Susceptor system________________________
WO2003062922A3 (en) Photomask and method for manufacturing the same
WO2004027838A3 (en) Fast gas exchange for thermal conductivity modulation
WO1999054521A3 (en) Method and apparatus for modifying the profile of high-aspect-ratio gaps using differential plasma power

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase
TH Corrigenda

Free format text: IN VOL 16, NO 10, PAGE(S) 2150-2167 UNDER THE HEADING APPLICATIONS LAPSED, REFUSED OR WITHDRAWN PLEASE DELETE ALL REFERENCE TO APPLICATION NO. 37189/01, 39165/01, 42263/01, 44489/01, 48491/01, 48494/01, 50604/01, 50624/01, 50628/01, 58215/01, 60018/01, 60051/01, 63811/01, 73840/01 AND 87748/01