AU2001244470A1 - Assembly process - Google Patents

Assembly process

Info

Publication number
AU2001244470A1
AU2001244470A1 AU2001244470A AU4447001A AU2001244470A1 AU 2001244470 A1 AU2001244470 A1 AU 2001244470A1 AU 2001244470 A AU2001244470 A AU 2001244470A AU 4447001 A AU4447001 A AU 4447001A AU 2001244470 A1 AU2001244470 A1 AU 2001244470A1
Authority
AU
Australia
Prior art keywords
assembly process
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001244470A
Inventor
Ernest H. Fischer
Edison T. Hudson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infotech AG
Original Assignee
Infotech AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infotech AG filed Critical Infotech AG
Publication of AU2001244470A1 publication Critical patent/AU2001244470A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Operations Research (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AU2001244470A 2000-03-10 2001-03-08 Assembly process Abandoned AU2001244470A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US18863500P 2000-03-10 2000-03-10
US60188635 2000-03-10
PCT/IB2001/000610 WO2001067492A2 (en) 2000-03-10 2001-03-08 Method and apparatus for soldering surface mounted components onto printed circuit boards

Publications (1)

Publication Number Publication Date
AU2001244470A1 true AU2001244470A1 (en) 2001-09-17

Family

ID=22693957

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001244470A Abandoned AU2001244470A1 (en) 2000-03-10 2001-03-08 Assembly process

Country Status (3)

Country Link
US (2) US6605500B2 (en)
AU (1) AU2001244470A1 (en)
WO (1) WO2001067492A2 (en)

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US7296727B2 (en) * 2001-06-27 2007-11-20 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting electronic components
EP1424884A1 (en) * 2002-11-29 2004-06-02 Leica Geosystems AG Method of mounting miniaturised parts on a carrier plate
JP2008522417A (en) * 2004-11-29 2008-06-26 ヒートロニクス・コーポレーション Thermal desorption method and system for surface mount components
US20080156789A1 (en) * 2004-11-29 2008-07-03 Andrew Devey Platen for use with a thermal attach and detach system which holds components by vacuum suction
JP4710772B2 (en) * 2006-09-15 2011-06-29 パナソニック株式会社 Electronic component mounting line and position management method in electronic component mounting line
US7722435B2 (en) * 2007-06-13 2010-05-25 Black & Decker Inc. Sander
JP4941422B2 (en) * 2008-07-14 2012-05-30 パナソニック株式会社 Component mounting system
US20120327215A1 (en) * 2009-09-22 2012-12-27 Case Steven K High speed optical sensor inspection system
IT1396894B1 (en) * 2009-11-19 2012-12-20 Lcm S R L DEVICE FOR COLLECTION AND POSITIONING OF ELECTRONIC COMPONENTS ON PRINTED CIRCUITS.
DE102010047678A1 (en) * 2010-10-06 2012-04-12 Atn Automatisierungstechnik Niemeier Gmbh Contacting solar module, comprises detecting a resulting relative movement between the joining partners, and evaluating a setting path and temperature profile
JP6178693B2 (en) * 2013-10-09 2017-08-09 ハンファテクウィン株式会社Ｈａｎｗｈａ Ｔｅｃｈｗｉｎ Ｃｏ．，Ｌｔｄ． Component mounting head for surface mounter
WO2017217931A1 (en) * 2016-06-15 2017-12-21 Semiconductor Technologies And Instruments Pte Ltd Apparatus and method for automatically setting, calibrating and monitoring or measuring pickup head position and force during component pickup operations
US10500737B2 (en) * 2016-06-28 2019-12-10 Akribis Systems Pte Ltd Pick-and-place device having force measurement capability
WO2022169609A1 (en) * 2021-02-02 2022-08-11 Illumina, Inc. Gasket assemblies and related systems and methods

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GB1262148A (en) 1968-03-13 1972-02-02 Zeva Elek Zitats Ges Smits Und Soldering apparatus
US4613942A (en) 1982-02-19 1986-09-23 Chen Richard M Orientation and control system for robots
JPS58182718A (en) 1982-04-20 1983-10-25 Datsuku Eng Kk Positioning device
US4437114A (en) 1982-06-07 1984-03-13 Farrand Optical Co., Inc. Robotic vision system
JPS61152100A (en) 1984-12-26 1986-07-10 ティーディーケイ株式会社 Apparatus and method for mounting electronic component
US4818993A (en) 1986-02-27 1989-04-04 Siemens Aktiengesellschaft Electronic control system for controlling several remote devices
DE3701554A1 (en) 1987-01-21 1988-08-04 Duerr Gmbh & Co MACHINE SYSTEM WITH SEVERAL ACTUATORS
FR2609919B1 (en) 1987-01-22 1989-03-31 Farco Sa DEVICE FOR WELDING AN ELECTRICAL COMPONENT AND METHOD USED THEREWITH
US4890241A (en) 1987-10-26 1989-12-26 Megamation Incorporated Robotic system
US4918690A (en) 1987-11-10 1990-04-17 Echelon Systems Corp. Network and intelligent cell for providing sensing, bidirectional communications and control
US4911543A (en) 1988-05-31 1990-03-27 Hodgson R W Microscope viewing apparatus for viewing a specimen image and an optical overlay pattern image in a comparison manner
ATE116513T1 (en) 1989-09-29 1995-01-15 Siemens Nixdorf Inf Syst METHOD FOR SOLDERING COMPONENTS ON CIRCUIT BOARDS.
DE69116709T2 (en) 1990-03-19 1997-02-06 Hitachi Ltd Device and method for transporting components
US5168441A (en) 1990-05-30 1992-12-01 Allen-Bradley Company, Inc. Methods for set up and programming of machine and process controllers
US5172468A (en) 1990-08-22 1992-12-22 Sony Corporation Mounting apparatus for electronic parts
JP2926282B2 (en) 1991-06-06 1999-07-28 株式会社日立製作所 Air conditioner and medium recording operation control program thereof
US5195234A (en) 1991-08-19 1993-03-23 Motorola, Inc. Method and apparatus for visual alignment of parts
US5225897A (en) * 1991-10-02 1993-07-06 Unitrode Corporation Molded package for semiconductor devices with leadframe locking structure
US5631973A (en) 1994-05-05 1997-05-20 Sri International Method for telemanipulation with telepresence
DE4216242C2 (en) 1992-05-16 1997-02-13 Leuze Electronic Gmbh & Co Identification of sensors / actuators in bus systems
NL9300631A (en) 1993-04-14 1994-11-01 Hans Gerard Van Den Brink Optical system for mutually positioning a track carrier and component with connecting feet.
JPH06344279A (en) 1993-06-07 1994-12-20 Hitachi Ltd Remote operation device and method
US5452201A (en) 1993-08-24 1995-09-19 Allen-Bradley Company, Inc. Industrial controller with highly distributed processing
DE4330467C1 (en) 1993-09-08 1994-09-08 Siemens Nixdorf Inf Syst Method for soldering surface-mounted electronic components (SMDs) onto printed circuit boards
US5576946A (en) 1993-09-30 1996-11-19 Fluid Air, Inc. Icon based process design and control system
JP3579455B2 (en) 1994-05-06 2004-10-20 ペンタックス株式会社 Image input device
US5588109A (en) 1995-01-23 1996-12-24 Hewlett-Packard Company User interface for a remote diagnostic device
US5903662A (en) 1995-06-30 1999-05-11 Dci Systems, Inc. Automated system for placement of components
US5812394A (en) 1995-07-21 1998-09-22 Control Systems International Object-oriented computer program, system, and method for developing control schemes for facilities
US5764366A (en) 1995-11-30 1998-06-09 Lucent Technologies Inc. Method and apparatus for alignment and bonding
JPH09288573A (en) 1996-04-23 1997-11-04 Mitsubishi Electric Corp On-vehicle controller
US5805442A (en) 1996-05-30 1998-09-08 Control Technology Corporation Distributed interface architecture for programmable industrial control systems
EP0825506B1 (en) 1996-08-20 2013-03-06 Invensys Systems, Inc. Methods and apparatus for remote process control
DE29615180U1 (en) 1996-08-21 1996-10-31 Siemens Ag Function monitoring for a proximity switch device to influence a program control device
US5768759A (en) 1996-11-19 1998-06-23 Zevatech, Inc. Method and apparatus for reflective in-flight component registration
DE19649082C1 (en) 1996-11-27 1998-01-08 Fraunhofer Ges Forschung Remote control unit for implement with holder and two hexapods
US6085407A (en) * 1997-08-21 2000-07-11 Micron Technology, Inc. Component alignment apparatuses and methods
EP0932103A1 (en) 1998-01-27 1999-07-28 Deutsche Thomson-Brandt Gmbh Method and apparatus for transferring bi-directionally data between an IEEE 1394 bus and device
US6567122B1 (en) 1998-03-18 2003-05-20 Ipac Acquisition Subsidiary I Method and system for hosting an internet web site on a digital camera
WO2000004428A1 (en) 1998-07-15 2000-01-27 OCé PRINTING SYSTEMS GMBH Method and system for configuring a computer-aided system
WO2000008588A2 (en) 1998-08-04 2000-02-17 Cyberoptics Corporation Enhanced sensor
US6408090B1 (en) * 1998-09-28 2002-06-18 Siemens Production And Logistics System Aktiengesellschaft Method for position recognition of components equipped on a substrate in an automatic equipping unit

Also Published As

Publication number Publication date
US6734537B1 (en) 2004-05-11
US20010046723A1 (en) 2001-11-29
WO2001067492A2 (en) 2001-09-13
WO2001067492A3 (en) 2002-03-21
US6605500B2 (en) 2003-08-12

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