AU2001230975A1 - Redundant system for assembly of electronic components to substrates - Google Patents

Redundant system for assembly of electronic components to substrates

Info

Publication number
AU2001230975A1
AU2001230975A1 AU2001230975A AU3097501A AU2001230975A1 AU 2001230975 A1 AU2001230975 A1 AU 2001230975A1 AU 2001230975 A AU2001230975 A AU 2001230975A AU 3097501 A AU3097501 A AU 3097501A AU 2001230975 A1 AU2001230975 A1 AU 2001230975A1
Authority
AU
Australia
Prior art keywords
substrates
assembly
electronic components
redundant system
redundant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001230975A
Inventor
Koenraad A. Gieskes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delaware Capital Formation Inc
Original Assignee
Universal Instruments Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universal Instruments Corp filed Critical Universal Instruments Corp
Publication of AU2001230975A1 publication Critical patent/AU2001230975A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0495—Mounting of components, e.g. of leadless components having a plurality of work-stations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0411—Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5191—Assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5196—Multiple station with conveyor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53143—Motor or generator
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53265—Means to assemble electrical device with work-holder for assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53378—Means to interrelatedly feed plural work parts from plural sources without manual intervention including converging conveyors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Automatic Assembly (AREA)
AU2001230975A 2000-01-19 2001-01-19 Redundant system for assembly of electronic components to substrates Abandoned AU2001230975A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/487,324 US6643917B1 (en) 2000-01-19 2000-01-19 Redundant system for assembly of electronic components to substrates
US09487324 2000-01-19
PCT/US2001/001725 WO2001053034A1 (en) 2000-01-19 2001-01-19 Redundant system for assembly of electronic components to substrates

Publications (1)

Publication Number Publication Date
AU2001230975A1 true AU2001230975A1 (en) 2001-07-31

Family

ID=23935272

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001230975A Abandoned AU2001230975A1 (en) 2000-01-19 2001-01-19 Redundant system for assembly of electronic components to substrates

Country Status (3)

Country Link
US (2) US6643917B1 (en)
AU (1) AU2001230975A1 (en)
WO (1) WO2001053034A1 (en)

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US6643917B1 (en) * 2000-01-19 2003-11-11 Delaware Capital Formation Redundant system for assembly of electronic components to substrates
US6836960B2 (en) * 2000-05-15 2005-01-04 Matsushita Electric Industrial Co., Ltd. Board transfer apparatus, board transfer method, and component mounting apparatus
KR100581427B1 (en) * 2000-08-22 2006-05-17 마츠시타 덴끼 산교 가부시키가이샤 Device and method for mounting parts
US20020062553A1 (en) * 2000-11-24 2002-05-30 Mirae Corporation Surface mounting device and method thereof
KR100363902B1 (en) * 2000-11-24 2002-12-11 미래산업 주식회사 Surface mounting device and method thereof
WO2002074024A2 (en) * 2001-03-14 2002-09-19 Legacy Electronics, Inc. A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
EP1389344B1 (en) * 2001-05-23 2014-07-16 ASM Assembly Systems GmbH & Co. KG Assembly system and method for assembling components on substrates
DE10225430A1 (en) * 2002-06-07 2003-12-24 Siemens Ag Assembly system and method for assembling substrates with components
KR100530743B1 (en) * 2002-06-12 2005-11-23 삼성테크윈 주식회사 Chip mounter
JP2004128400A (en) * 2002-10-07 2004-04-22 Fuji Mach Mfg Co Ltd Component mounting apparatus, program for controlling operation of the same apparatus, and component mounting system
DE10317984A1 (en) * 2003-04-19 2004-10-28 Protechno Card Gmbh Device to transport credit card into writing position of laser writing station with three transfer positions for card
JP3993536B2 (en) * 2003-06-20 2007-10-17 三菱重工業株式会社 Manufacturing method of shaft seal, shaft seal, shaft seal member, and rotary machine using shaft seal
KR101006449B1 (en) * 2004-04-08 2011-01-06 삼성전자주식회사 Distribution system for manufacturing liquid crystal display
US7836582B2 (en) * 2006-12-12 2010-11-23 Universal Instruments Corporation Printed circuit board assembly machine
US8132317B2 (en) * 2007-06-11 2012-03-13 Research In Motion Limited Apparatus for manufacture of electronic assemblies
JP4957453B2 (en) * 2007-08-23 2012-06-20 パナソニック株式会社 Electronic component mounting system and electronic component mounting method
JP5003350B2 (en) * 2007-08-23 2012-08-15 パナソニック株式会社 Electronic component mounting apparatus and electronic component mounting method
JP4872961B2 (en) * 2008-04-04 2012-02-08 パナソニック株式会社 Electronic component mounting device
US8096408B2 (en) * 2008-04-07 2012-01-17 Muratec Automation Co., Ltd. Segmented material conveyor system, threshold assembly and method for making and using the same
JP4883071B2 (en) * 2008-10-03 2012-02-22 パナソニック株式会社 Electronic component mounting system
JP4883070B2 (en) * 2008-10-03 2012-02-22 パナソニック株式会社 Electronic component mounting system and electronic component mounting method
US8555784B2 (en) 2008-11-19 2013-10-15 Illinois Tool Works Inc. Method of processing electronic substrates using vertically separated pass through conveyor system
JP5155834B2 (en) * 2008-12-02 2013-03-06 富士機械製造株式会社 Circuit board inspection equipment
DE102010013506A1 (en) * 2010-03-31 2011-10-06 Mimot Gmbh Device for processing workpieces
US8336757B2 (en) * 2011-01-04 2012-12-25 Asm Assembly Automation Ltd Apparatus for transporting substrates for bonding
JP5743747B2 (en) * 2011-06-27 2015-07-01 富士機械製造株式会社 Production management apparatus and production management method for component mounting line
JP5701178B2 (en) * 2011-08-10 2015-04-15 富士機械製造株式会社 Solder printing system
DE102012220904B4 (en) * 2012-11-15 2016-05-25 Siemens Aktiengesellschaft Formation of Festüstungs setup families for the assembly of printed circuit boards
KR102244153B1 (en) * 2013-09-13 2021-04-23 엘지이노텍 주식회사 Camera module
US9611107B2 (en) 2014-12-08 2017-04-04 Rockwell Automation Technologies, Inc. Linear drive transport system and method
DE102015200414A1 (en) * 2015-01-14 2016-07-14 Siemens Aktiengesellschaft Method and system for assembling printed circuit boards
DE102017102700A1 (en) * 2017-02-10 2018-09-13 Atg Luther & Maelzer Gmbh Test apparatus and method for testing printed circuit boards
WO2019040629A1 (en) * 2017-08-22 2019-02-28 Universal Instruments Corporation Improved printed circuit board transport
US11351639B2 (en) * 2018-03-29 2022-06-07 Hirata Corporation Working system and work method

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KR100363898B1 (en) 2000-11-24 2002-12-11 미래산업 주식회사 Surface mounting device and method thereof
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US7082680B2 (en) 2001-11-21 2006-08-01 Mirae Corporation Mounting method of electronic components

Also Published As

Publication number Publication date
US20040060170A1 (en) 2004-04-01
US6643917B1 (en) 2003-11-11
US7032304B2 (en) 2006-04-25
WO2001053034A1 (en) 2001-07-26

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