AU2001220118A1 - Metal component carrier - Google Patents

Metal component carrier

Info

Publication number
AU2001220118A1
AU2001220118A1 AU2001220118A AU2011801A AU2001220118A1 AU 2001220118 A1 AU2001220118 A1 AU 2001220118A1 AU 2001220118 A AU2001220118 A AU 2001220118A AU 2011801 A AU2011801 A AU 2011801A AU 2001220118 A1 AU2001220118 A1 AU 2001220118A1
Authority
AU
Australia
Prior art keywords
component carrier
metal component
metal
carrier
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001220118A
Inventor
Christian Axelsson
Ulrika Renmark
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of AU2001220118A1 publication Critical patent/AU2001220118A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H05K2201/10772—Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
AU2001220118A 2000-01-25 2000-12-18 Metal component carrier Abandoned AU2001220118A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP00610009A EP1121005A1 (en) 2000-01-25 2000-01-25 Metal component carrier
EP00610009 2000-01-25
PCT/EP2000/012927 WO2001056341A1 (en) 2000-01-25 2000-12-18 Metal component carrier

Publications (1)

Publication Number Publication Date
AU2001220118A1 true AU2001220118A1 (en) 2001-08-07

Family

ID=8174363

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001220118A Abandoned AU2001220118A1 (en) 2000-01-25 2000-12-18 Metal component carrier

Country Status (5)

Country Link
US (1) US6375494B2 (en)
EP (1) EP1121005A1 (en)
AU (1) AU2001220118A1 (en)
MY (1) MY127100A (en)
WO (1) WO2001056341A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10337442A1 (en) * 2003-08-14 2005-03-10 Siemens Ag Device for mounting
CN202840021U (en) * 2012-08-14 2013-03-27 美国莫列斯股份有限公司 Electrical connector
US8938928B2 (en) * 2013-03-15 2015-01-27 Stoneworth Building Products Roofing batten snap spacer

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4273399A (en) * 1979-11-05 1981-06-16 Amp Incorporated Transducer supporting and contacting means
JPH0432778Y2 (en) * 1984-10-23 1992-08-06
US4629278A (en) * 1985-04-15 1986-12-16 Amp Incorporated Surface mountable connector retention means and method
US5272597A (en) * 1992-05-15 1993-12-21 Ericsson Ge Mobile Communications Inc. Attachment for surface-mounting a resonator crystal on a circuit board
DE4332770A1 (en) * 1993-09-25 1995-03-30 Bosch Gmbh Robert Arrangement of a power component on a printed circuit board
JPH07240654A (en) * 1994-02-28 1995-09-12 Nippon Dempa Kogyo Co Ltd Mounting method for surface mount piezoelectric device
JP2665191B2 (en) * 1995-04-28 1997-10-22 静岡日本電気株式会社 LCD holding bracket
US5865413A (en) * 1995-08-07 1999-02-02 Motorola Inc. Surface mountable component holder
US5749740A (en) * 1996-09-20 1998-05-12 Hubbell Incorporated Bonding strap for non-metallic electrical enclosure
DE19736607C1 (en) * 1997-08-22 1999-07-15 Dunkel Otto Gmbh PCB socket
US6099322A (en) * 1997-10-31 2000-08-08 The Whitaker Corporation Electrical receptacle
US5984697A (en) * 1997-12-03 1999-11-16 Qualcomm Incorporated Ground clip apparatus for circuit boards
JP3767166B2 (en) * 1998-04-20 2006-04-19 富士通株式会社 holder
US6305972B1 (en) * 2000-07-06 2001-10-23 Motorola, Inc. Apparatus for mounting an electronic component to a printed circuit board

Also Published As

Publication number Publication date
US6375494B2 (en) 2002-04-23
WO2001056341A1 (en) 2001-08-02
US20010051458A1 (en) 2001-12-13
MY127100A (en) 2006-11-30
EP1121005A1 (en) 2001-08-01

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