AU2000269919A1 - Piezo-ceramic multilayer component for measuring instruments and method for the production thereof - Google Patents
Piezo-ceramic multilayer component for measuring instruments and method for the production thereofInfo
- Publication number
- AU2000269919A1 AU2000269919A1 AU2000269919A AU6991900A AU2000269919A1 AU 2000269919 A1 AU2000269919 A1 AU 2000269919A1 AU 2000269919 A AU2000269919 A AU 2000269919A AU 6991900 A AU6991900 A AU 6991900A AU 2000269919 A1 AU2000269919 A1 AU 2000269919A1
- Authority
- AU
- Australia
- Prior art keywords
- electrode layers
- sensor element
- piezo
- production
- measuring instruments
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000919 ceramic Substances 0.000 title abstract 3
- 238000005259 measurement Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
- G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
- G01F23/28—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring the variations of parameters of electromagnetic or acoustic waves applied directly to the liquid or fluent solid material
- G01F23/296—Acoustic waves
- G01F23/2968—Transducers specially adapted for acoustic level indicators
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/09—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by piezoelectric pick-up
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
- H10N30/503—Piezoelectric or electrostrictive devices having a stacked or multilayer structure with non-rectangular cross-section orthogonal to the stacking direction, e.g. polygonal, circular
- H10N30/505—Annular cross-section
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Connection electrodes of multilayer piezoelectric or electrostrictive devices, e.g. external electrodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49789—Obtaining plural product pieces from unitary workpiece
- Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking
Abstract
The invention relates to an electromechanical drive or a sensor element composed of piezoelectric elements arranged in the form of a stack. The drive or the sensor element is intended for measurement instruments and operates even at very high temperatures.The new drive or the new sensor element (10) for this purpose comprises a number of piezoelectric ceramic layers (12a-f), with electrode layers (16a-e) in each case being arranged between two mutually facing surfaces of directly adjacent piezoelectric ceramic layers. Connectors (18a,b) in the form of wires run in grooves (14a-d) in the electrode layers (16a-e) in order to make electrical contact with the electrode layers (16a-e), and are passed out of the electrode layers (16a-e).
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10020549 | 2000-04-27 | ||
DE10020549 | 2000-04-27 | ||
PCT/EP2000/007506 WO2001084642A1 (en) | 2000-04-27 | 2000-08-03 | Piezo-ceramic multilayer component for measuring instruments and method for the production thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2000269919A1 true AU2000269919A1 (en) | 2001-11-12 |
Family
ID=7640051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2000269919A Abandoned AU2000269919A1 (en) | 2000-04-27 | 2000-08-03 | Piezo-ceramic multilayer component for measuring instruments and method for the production thereof |
Country Status (8)
Country | Link |
---|---|
US (2) | US6710517B2 (en) |
EP (1) | EP1277243B1 (en) |
JP (1) | JP2003533032A (en) |
CN (1) | CN1330014C (en) |
AT (1) | ATE540433T1 (en) |
AU (1) | AU2000269919A1 (en) |
RU (1) | RU2264678C2 (en) |
WO (1) | WO2001084642A1 (en) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004007767A1 (en) * | 2004-02-18 | 2005-09-08 | Vega Grieshaber Kg | Multiple electrode for a vibration generating and / or vibration detecting device |
DE102004033311B4 (en) * | 2004-07-08 | 2010-07-22 | Endress + Hauser Gmbh + Co. Kg | Device for determining and / or monitoring a process variable of a medium |
US7174792B2 (en) * | 2004-08-09 | 2007-02-13 | Xinetics, Inc. | Multi-axis transducer |
WO2007024225A1 (en) * | 2005-08-26 | 2007-03-01 | Xinetics, Inc. | Multi-axis transducer |
US8669689B2 (en) * | 2009-07-10 | 2014-03-11 | Viking At, Llc | Mountable arm smart material actuator and energy harvesting apparatus |
WO2011006028A2 (en) * | 2009-07-10 | 2011-01-13 | Viking At, Llc | Small scale smart material actuator and energy harvesting apparatus |
US8850892B2 (en) | 2010-02-17 | 2014-10-07 | Viking At, Llc | Smart material actuator with enclosed compensator |
KR20130132528A (en) | 2010-12-09 | 2013-12-04 | 바이킹 에이티 엘엘씨 | High speed smart material actuator with second stage |
HUE025407T2 (en) * | 2011-11-09 | 2016-07-28 | Grieshaber Vega Kg | Vibration-type level switch |
DE102012100728A1 (en) * | 2012-01-30 | 2013-08-01 | Endress + Hauser Gmbh + Co. Kg | Device for determining and / or monitoring at least one process variable |
DE102013200243A1 (en) * | 2013-01-10 | 2014-07-10 | Robert Bosch Gmbh | Piezoelectric component and method for producing a piezoelectric component |
RU2540440C1 (en) * | 2013-08-01 | 2015-02-10 | Открытое акционерное общество "Научно-исследовательский институт "Элпа" с опытным производством" | Manufacturing method of monolithic multilayer piezoceramic elements-columns |
US10276776B2 (en) | 2013-12-24 | 2019-04-30 | Viking At, Llc | Mechanically amplified smart material actuator utilizing layered web assembly |
CH709395A1 (en) * | 2014-03-21 | 2015-09-30 | Kistler Holding Ag | Piezoelectric measuring element for measuring the dynamic pressure as well as the static pressure and / or the temperature. |
DE102014118393A1 (en) | 2014-12-11 | 2016-06-16 | Endress + Hauser Gmbh + Co. Kg | Device and a method for determining and / or monitoring at least one process variable |
DE102015112543A1 (en) | 2015-07-30 | 2017-02-02 | Endress+Hauser Gmbh+Co. Kg | Device for determining and / or monitoring at least one process variable |
EP3367452A1 (en) * | 2017-02-28 | 2018-08-29 | Koninklijke Philips N.V. | Electroactive material actuator and drive method |
EP3537117B1 (en) * | 2018-03-06 | 2020-11-11 | VEGA Grieshaber KG | Piezoelectric transmitting and/or receiving device for a vibration sensor, vibration sensor having such a piezoelectric transmitting and/or receiving device and method for manufacturing a piezoelectric transmitting and/or receiving device for a vibration sensor |
CN109900927B (en) * | 2019-04-01 | 2021-08-24 | 中电科技集团重庆声光电有限公司 | Piezoelectric acceleration sensor and preparation method thereof |
DE102019111384B3 (en) * | 2019-05-02 | 2020-09-03 | Vega Grieshaber Kg | Piezoelectric transmitting and / or receiving device and vibration limit level sensor with such |
WO2020229674A1 (en) * | 2019-05-15 | 2020-11-19 | Tdk Electronics Ag | Ferroelectric sensor |
DE102022105918A1 (en) | 2022-03-14 | 2023-09-14 | Vega Grieshaber Kg | Vibronic point level sensor with acceleration sensor |
Family Cites Families (25)
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US2479987A (en) * | 1947-10-11 | 1949-08-23 | Brush Dev Co | Multiplate electrotransducer |
US2933628A (en) * | 1956-01-13 | 1960-04-19 | Piezo Crystal Company | Piezo electric crystal holder |
US3500852A (en) * | 1968-02-07 | 1970-03-17 | Bowles Eng Corp | Pure fluid amplifier having a stable undeflected power stream |
US4499566A (en) * | 1981-01-21 | 1985-02-12 | The United States Of America As Represented By The Secretary Of The Navy | Electro-ceramic stack |
JPS60103685A (en) | 1983-11-11 | 1985-06-07 | Nippon Soken Inc | Laminated piezoelectric body |
US4752712A (en) * | 1985-06-10 | 1988-06-21 | Nippon Soken, Inc. | Piezoelectric laminate stack |
US4803763A (en) * | 1986-08-28 | 1989-02-14 | Nippon Soken, Inc. | Method of making a laminated piezoelectric transducer |
JP2790178B2 (en) * | 1987-06-26 | 1998-08-27 | 株式会社村田製作所 | Electrostrictive resonance device |
US4816713A (en) * | 1987-10-09 | 1989-03-28 | Change Jr Nicholas D | Piezoelectric sensor with FET amplified output |
JPH01283069A (en) * | 1988-05-02 | 1989-11-14 | Japan Aviation Electron Ind Ltd | Piezoelectric bimorph type actuator |
DE3931453C1 (en) * | 1989-09-21 | 1991-02-28 | Endress U. Hauser Gmbh U. Co, 7864 Maulburg, De | |
JPH03159277A (en) * | 1989-11-17 | 1991-07-09 | Toyota Motor Corp | Manufacture of piezoelectric laminate |
DE59004780D1 (en) * | 1989-12-22 | 1994-04-07 | Asea Brown Boveri | Fiber optic sensor. |
GB9021122D0 (en) * | 1990-09-28 | 1990-11-14 | Cookson Group Plc | Composite multilayer ceramic structure |
US5055734A (en) * | 1990-09-28 | 1991-10-08 | Caterpillar Inc. | Single-piece multiple electrode conductor |
JPH04333295A (en) * | 1991-05-09 | 1992-11-20 | Nec Corp | Electrostrictive effect element and manufacture thereof |
JPH04361575A (en) * | 1991-06-10 | 1992-12-15 | Toyota Motor Corp | Laminated type piezoelectric body |
US5155409A (en) * | 1991-07-11 | 1992-10-13 | Caterpillar Inc. | Integral conductor for a piezoelectric actuator |
US5168189A (en) * | 1991-09-18 | 1992-12-01 | Caterpillar Inc. | Solderless connector for a solid state motor stack |
US5300852A (en) | 1991-10-04 | 1994-04-05 | Honda Giken Kogyo Kabushiki Kaisha | Piezoelectric ceramic laminate device |
US5459371A (en) * | 1993-03-12 | 1995-10-17 | Brother Kogyo Kabushiki Kaisha | Multilayer piezoelectric element |
US5509815A (en) | 1994-06-08 | 1996-04-23 | At&T Corp. | Solder medium for circuit interconnection |
DE69710976T2 (en) * | 1996-08-30 | 2002-08-22 | Toyoda Chuo Kenkyusho Kk | Ceramics with crystal orientation and process for their manufacture |
KR20010013595A (en) * | 1997-06-09 | 2001-02-26 | 엔, 마이클 그로브 | Annealing of a crystalline perovskite ferroelectric cell and cells exhibiting improved barrier properties |
US5945770A (en) * | 1997-08-20 | 1999-08-31 | Acuson Corporation | Multilayer ultrasound transducer and the method of manufacture thereof |
-
2000
- 2000-08-03 JP JP2001581355A patent/JP2003533032A/en active Pending
- 2000-08-03 RU RU2002131882/28A patent/RU2264678C2/en active
- 2000-08-03 AT AT00958371T patent/ATE540433T1/en active
- 2000-08-03 AU AU2000269919A patent/AU2000269919A1/en not_active Abandoned
- 2000-08-03 EP EP00958371A patent/EP1277243B1/en not_active Expired - Lifetime
- 2000-08-03 WO PCT/EP2000/007506 patent/WO2001084642A1/en active Application Filing
- 2000-08-03 CN CNB00819470XA patent/CN1330014C/en not_active Expired - Lifetime
- 2000-12-08 US US09/733,487 patent/US6710517B2/en not_active Expired - Lifetime
-
2003
- 2003-11-07 US US10/704,162 patent/US6834419B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6710517B2 (en) | 2004-03-23 |
US20040095041A1 (en) | 2004-05-20 |
CN1452792A (en) | 2003-10-29 |
RU2264678C2 (en) | 2005-11-20 |
US20020011589A1 (en) | 2002-01-31 |
EP1277243A1 (en) | 2003-01-22 |
US6834419B2 (en) | 2004-12-28 |
CN1330014C (en) | 2007-08-01 |
EP1277243B1 (en) | 2012-01-04 |
WO2001084642A1 (en) | 2001-11-08 |
JP2003533032A (en) | 2003-11-05 |
ATE540433T1 (en) | 2012-01-15 |
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