AU1976400A - Method for controlling a sawing process - Google Patents
Method for controlling a sawing processInfo
- Publication number
- AU1976400A AU1976400A AU19764/00A AU1976400A AU1976400A AU 1976400 A AU1976400 A AU 1976400A AU 19764/00 A AU19764/00 A AU 19764/00A AU 1976400 A AU1976400 A AU 1976400A AU 1976400 A AU1976400 A AU 1976400A
- Authority
- AU
- Australia
- Prior art keywords
- controlling
- sawing process
- sawing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19859291 | 1998-12-22 | ||
DE1998159291 DE19859291A1 (en) | 1998-12-22 | 1998-12-22 | Process for controlling a sawing process |
PCT/EP1999/009772 WO2000038023A1 (en) | 1998-12-22 | 1999-12-10 | Method for controlling a sawing process |
Publications (1)
Publication Number | Publication Date |
---|---|
AU1976400A true AU1976400A (en) | 2000-07-12 |
Family
ID=7892135
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU19764/00A Abandoned AU1976400A (en) | 1998-12-22 | 1999-12-10 | Method for controlling a sawing process |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU1976400A (en) |
DE (1) | DE19859291A1 (en) |
WO (1) | WO2000038023A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115036213B (en) * | 2022-08-11 | 2023-01-10 | 四川洪芯微科技有限公司 | Wafer cracking device and wafer cracking method |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4308246C2 (en) * | 1993-03-16 | 1998-06-10 | Guntram Dipl Ing Hoerdemann | Method and device for monitoring and controlling machine tools |
JP2967896B2 (en) * | 1993-06-18 | 1999-10-25 | 信越化学工業株式会社 | Wafer manufacturing method |
US5937844A (en) * | 1996-03-26 | 1999-08-17 | Shin-Etsu Handotai Co., Ltd. | Method for slicing cylindrical workpieces by varying slurry conditions and wire feed rate during slicing |
-
1998
- 1998-12-22 DE DE1998159291 patent/DE19859291A1/en not_active Withdrawn
-
1999
- 1999-12-10 WO PCT/EP1999/009772 patent/WO2000038023A1/en active Application Filing
- 1999-12-10 AU AU19764/00A patent/AU1976400A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2000038023A1 (en) | 2000-06-29 |
DE19859291A1 (en) | 2000-06-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |