AU1502199A - Electroplating method and electroplated articles - Google Patents
Electroplating method and electroplated articlesInfo
- Publication number
- AU1502199A AU1502199A AU15021/99A AU1502199A AU1502199A AU 1502199 A AU1502199 A AU 1502199A AU 15021/99 A AU15021/99 A AU 15021/99A AU 1502199 A AU1502199 A AU 1502199A AU 1502199 A AU1502199 A AU 1502199A
- Authority
- AU
- Australia
- Prior art keywords
- electroplating method
- electroplated articles
- electroplated
- articles
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9726062.4A GB9726062D0 (en) | 1997-12-09 | 1997-12-09 | Electroplating method and electroplated articles |
GB9726062 | 1997-12-09 | ||
GB9726344 | 1997-12-12 | ||
GB9726344A GB2332209A (en) | 1997-12-09 | 1997-12-12 | Electroplating involving the use of a preliminary coating |
PCT/IB1998/002107 WO1999029932A1 (en) | 1997-12-09 | 1998-12-08 | Electroplating method and electroplated articles |
Publications (1)
Publication Number | Publication Date |
---|---|
AU1502199A true AU1502199A (en) | 1999-06-28 |
Family
ID=26312737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU15021/99A Abandoned AU1502199A (en) | 1997-12-09 | 1998-12-08 | Electroplating method and electroplated articles |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU1502199A (en) |
GB (1) | GB2332209A (en) |
WO (1) | WO1999029932A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013217751A1 (en) * | 2013-09-05 | 2015-03-05 | Siemens Aktiengesellschaft | Method for producing a layer by chemical or electrochemical coating |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2518126B1 (en) * | 1981-12-14 | 1986-01-17 | Rhone Poulenc Spec Chim | PROCESS FOR THE METALLIZATION OF ELECTRICALLY INSULATING ARTICLES OF PLASTIC MATERIAL AND THE INTERMEDIATE AND FINISHED ARTICLES OBTAINED ACCORDING TO THIS PROCESS |
US4673469A (en) * | 1984-06-08 | 1987-06-16 | Mcgean-Rohco, Inc. | Method of plating plastics |
US4552626A (en) * | 1984-11-19 | 1985-11-12 | Michael Landney, Jr. | Metal plating of polyamide thermoplastics |
US4619741A (en) * | 1985-04-11 | 1986-10-28 | Olin Hunt Specialty Products Inc. | Process for preparing a non-conductive substrate for electroplating |
US4622108A (en) * | 1986-05-05 | 1986-11-11 | Olin Hunt Specialty Products, Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
US5015339A (en) * | 1990-03-26 | 1991-05-14 | Olin Hunt Sub Iii Corp. | Process for preparing nonconductive substrates |
US4964959A (en) * | 1990-04-12 | 1990-10-23 | Olin Hunt Specialty Products Inc. | Process for preparing a nonconductive substrate for electroplating |
US5139642A (en) * | 1991-05-01 | 1992-08-18 | Olin Corporation | Process for preparing a nonconductive substrate for electroplating |
JPH07268682A (en) * | 1994-03-28 | 1995-10-17 | Mec Kk | Method for electroplating surface of electric nonconductor |
US5536386A (en) * | 1995-02-10 | 1996-07-16 | Macdermid, Incorporated | Process for preparing a non-conductive substrate for electroplating |
US5611905A (en) * | 1995-06-09 | 1997-03-18 | Shipley Company, L.L.C. | Electroplating process |
US5618400A (en) * | 1995-09-19 | 1997-04-08 | Shipley Company, L.L.C. | Electroplating process |
-
1997
- 1997-12-12 GB GB9726344A patent/GB2332209A/en not_active Withdrawn
-
1998
- 1998-12-08 AU AU15021/99A patent/AU1502199A/en not_active Abandoned
- 1998-12-08 WO PCT/IB1998/002107 patent/WO1999029932A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
GB2332209A (en) | 1999-06-16 |
GB2332209A9 (en) | |
WO1999029932A1 (en) | 1999-06-17 |
GB9726344D0 (en) | 1998-02-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |