AU1418901A - Accelerator solution for direct plating and method for direct plating - Google Patents

Accelerator solution for direct plating and method for direct plating

Info

Publication number
AU1418901A
AU1418901A AU14189/01A AU1418901A AU1418901A AU 1418901 A AU1418901 A AU 1418901A AU 14189/01 A AU14189/01 A AU 14189/01A AU 1418901 A AU1418901 A AU 1418901A AU 1418901 A AU1418901 A AU 1418901A
Authority
AU
Australia
Prior art keywords
direct plating
accelerator solution
plating
direct
accelerator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU14189/01A
Inventor
Bill Brasch
Henry Garay
Masaaki Imanari
Masaru Seita
Yoshihiro Sugita
Hideki Tsuchida
Keith Waryold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LeaRonal Japan Inc
Original Assignee
LeaRonal Japan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LeaRonal Japan Inc filed Critical LeaRonal Japan Inc
Publication of AU1418901A publication Critical patent/AU1418901A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
AU14189/01A 1999-11-22 2000-11-21 Accelerator solution for direct plating and method for direct plating Abandoned AU1418901A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP11/331289 1999-11-22
JP33128999 1999-11-22
JP2000-329948 2000-10-30
JP2000329948A JP4646376B2 (en) 1999-11-22 2000-10-30 Accelerator bath solution for direct plating and direct plating method
PCT/JP2000/008214 WO2001038604A1 (en) 1999-11-22 2000-11-21 Accelerator solution for direct plating and method for direct plating

Publications (1)

Publication Number Publication Date
AU1418901A true AU1418901A (en) 2001-06-04

Family

ID=26573806

Family Applications (1)

Application Number Title Priority Date Filing Date
AU14189/01A Abandoned AU1418901A (en) 1999-11-22 2000-11-21 Accelerator solution for direct plating and method for direct plating

Country Status (3)

Country Link
JP (1) JP4646376B2 (en)
AU (1) AU1418901A (en)
WO (1) WO2001038604A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4843164B2 (en) * 2001-08-21 2011-12-21 日本リーロナール有限会社 Method for forming copper-resin composite material
EP1411147A1 (en) * 2002-10-18 2004-04-21 Shipley Co. L.L.C. Formaldehyde-free electroless copper plating process and solution for use in the process
CN100402700C (en) * 2002-11-20 2008-07-16 希普雷公司 Methyl free copper plating method and used solution thereof
TWI348499B (en) * 2006-07-07 2011-09-11 Rohm & Haas Elect Mat Electroless copper and redox couples
JP2008031536A (en) * 2006-07-31 2008-02-14 Ebara Udylite Kk Direct plating method
KR101329989B1 (en) * 2006-11-06 2013-11-15 우에무라 고교 가부시키가이샤 Direct plating method and solution for palladium conductor layer formation
JP5997717B2 (en) * 2014-02-26 2016-09-28 石原 邦雄 Method for producing fabric for radiation protective clothing
KR102208197B1 (en) * 2019-05-27 2021-01-27 주식회사 엠엠에스 Method for producing multi-functional multi-layered powder composed of silver-copper-graphite and Multi-functional multi-layered powder by the method
CN114836795B (en) * 2021-06-25 2023-12-19 深圳市铭轩珠宝首饰有限公司 Electroforming solution for gold cladding and preparation method and application thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4180600A (en) * 1975-10-23 1979-12-25 Nathan Feldstein Process using activated electroless plating catalysts
JPH0627350B2 (en) * 1986-01-22 1994-04-13 宇部興産株式会社 Method for plating of polyamide resin molded products
JP3337802B2 (en) * 1993-12-28 2002-10-28 日本リーロナール株式会社 Direct plating method by metallization of copper (I) oxide colloid
JPH11191675A (en) * 1997-12-26 1999-07-13 Nippon Riironaaru Kk Manufacture of build-up printed wiring board
JP2000144439A (en) * 1998-10-30 2000-05-26 Kizai Kk Plating treating method for nonconductor stock, and electroless treating solution composition therefor

Also Published As

Publication number Publication date
JP2001214278A (en) 2001-08-07
WO2001038604A1 (en) 2001-05-31
JP4646376B2 (en) 2011-03-09

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase