AU1209001A - Conveyorized electroplating device - Google Patents

Conveyorized electroplating device

Info

Publication number
AU1209001A
AU1209001A AU12090/01A AU1209001A AU1209001A AU 1209001 A AU1209001 A AU 1209001A AU 12090/01 A AU12090/01 A AU 12090/01A AU 1209001 A AU1209001 A AU 1209001A AU 1209001 A AU1209001 A AU 1209001A
Authority
AU
Australia
Prior art keywords
conveyor device
plating solution
assembly
anode
fluid bed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU12090/01A
Inventor
Jerome R. Faucher
Joseph M. Webb
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teledyne Technologies Inc
Original Assignee
Teledyne Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23675633&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU1209001(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Teledyne Technologies Inc filed Critical Teledyne Technologies Inc
Publication of AU1209001A publication Critical patent/AU1209001A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Abstract

A conveyorized electroplating device having an anode positioned proximate to a plurality of absorptive applicator assemblies that apply a plating solution to a substrate and a conveyor device that grips the substrate thereby isolating the electrical contact from the plating solution. The conveyorized electroplating device has a fluid bed assembly with a manifold and an anode, a conveyor device adjacent to the fluid bed assembly, and a plurality of absorptive applicator assemblies, wherein the plurality of absorptive applicator assemblies are adjacent and in close proximity to the anode and in fluid communication with the fluid bed assembly. The conveyor device isolates the electrical contacts from the plating solution and is able to handle various sizes and thicknesses of substrates. The conveyor device of the present invention comprises a drive assembly and a gripper assembly connected thereto, wherein the gripper assembly has a non-metallic housing, a metallic member slideably mounted within a cavity defined by the non-metallic housing, an arm pivotably mounted to the housing and forming a passageway, and a seal mounted adjacent to the arm.
AU12090/01A 1999-10-21 2000-10-16 Conveyorized electroplating device Abandoned AU1209001A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/422,612 US6294060B1 (en) 1999-10-21 1999-10-21 Conveyorized electroplating device
US09422612 1999-10-21
PCT/US2000/028678 WO2001029288A2 (en) 1999-10-21 2000-10-16 Conveyorized electroplating device

Publications (1)

Publication Number Publication Date
AU1209001A true AU1209001A (en) 2001-04-30

Family

ID=23675633

Family Applications (1)

Application Number Title Priority Date Filing Date
AU12090/01A Abandoned AU1209001A (en) 1999-10-21 2000-10-16 Conveyorized electroplating device

Country Status (9)

Country Link
US (2) US6294060B1 (en)
EP (1) EP1230446B1 (en)
JP (1) JP2003512530A (en)
KR (1) KR20020042737A (en)
CN (1) CN1382233A (en)
AT (1) ATE294881T1 (en)
AU (1) AU1209001A (en)
DE (1) DE60019957T2 (en)
WO (1) WO2001029288A2 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6294060B1 (en) 1999-10-21 2001-09-25 Ati Properties, Inc. Conveyorized electroplating device
US6514391B2 (en) * 2001-06-07 2003-02-04 Jason Ko Electroplating apparatus with conducting nets for distributing evenly anode current
WO2003038158A2 (en) * 2001-10-25 2003-05-08 Infineon Technologies Ag Electroplating device and electroplating system for coating already conductive structures
TWI226303B (en) * 2002-04-18 2005-01-11 Olympus Corp Substrate carrying device
US7204918B2 (en) * 2003-03-10 2007-04-17 Modular Components National, Inc. High efficiency plating apparatus and method
DE10340888B3 (en) 2003-09-04 2005-04-21 Atotech Deutschland Gmbh Power supply device in a device for electrochemical treatment
WO2006033315A1 (en) 2004-09-24 2006-03-30 Ibiden Co., Ltd. Plating method and plating apparatus
TW200741037A (en) 2006-01-30 2007-11-01 Ibiden Co Ltd Plating apparatus and plating method
JP4878866B2 (en) * 2006-02-22 2012-02-15 イビデン株式会社 Plating apparatus and plating method
ITMI20070002A1 (en) * 2007-01-03 2008-07-04 Occleppo S R L NONE
US20090078579A1 (en) * 2007-09-20 2009-03-26 Weibezahn Karl S Systems And Methods For Electroplating Embossed Features On Substrates
NL2005480C2 (en) * 2010-10-07 2012-04-11 Meco Equip Eng DEVICE FOR SINGLE-SIDED ELECTROLYTIC TREATMENT OF A FLAT SUBSTRATE.
DE102011050131B3 (en) * 2011-05-05 2012-08-16 Lpkf Laser & Electronics Ag Preparing metallizations made of three-dimensional plastic parts, comprises selectively preparing conductive layer, selectively constructing galvanic metallization, and connecting plastic part by connecting part with flexible carrier
CN104040417B (en) 2011-11-15 2017-07-18 阿什温-乌沙斯公司 Complementary polymeric electrochromic device
US9207515B2 (en) 2013-03-15 2015-12-08 Ashwin-Ushas Corporation, Inc. Variable-emittance electrochromic devices and methods of preparing the same
CN103422142B (en) * 2013-09-03 2016-08-17 竞陆电子(昆山)有限公司 The structure-improved of horizontal plating line conveying mechanism
US9632059B2 (en) 2015-09-03 2017-04-25 Ashwin-Ushas Corporation, Inc. Potentiostat/galvanostat with digital interface
US9482880B1 (en) 2015-09-15 2016-11-01 Ashwin-Ushas Corporation, Inc. Electrochromic eyewear
US9945045B2 (en) 2015-12-02 2018-04-17 Ashwin-Ushas Corporation, Inc. Electrochemical deposition apparatus and methods of using the same
CN109537035A (en) * 2018-12-26 2019-03-29 安徽宏实自动化装备有限公司 The Wafer electroplating device of piece leaf horizontal feed formula
CN109898125B (en) * 2019-03-29 2020-08-25 深圳市祥盛兴科技有限公司 Metal electroplating device

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3028635A1 (en) 1980-07-29 1982-03-04 Degussa Ag, 6000 Frankfurt DEVICE FOR PARTIAL GALVANIC COATING
US4402800A (en) * 1981-10-02 1983-09-06 Ash James J Apparatus and method of treating tabs of printed circuit boards and the like
US4610772A (en) * 1985-07-22 1986-09-09 The Carolinch Company Electrolytic plating apparatus
DE3603856C2 (en) * 1986-02-07 1994-05-05 Bosch Gmbh Robert Method and device for galvanizing flat workpieces such as printed circuit boards
US4668358A (en) 1986-05-14 1987-05-26 Motor Wheel Corporation Method and apparatus for use in surface treatment of conveyor supported workholders
DE3624481A1 (en) 1986-07-19 1988-01-28 Schering Ag ARRANGEMENT FOR THE ELECTROLYTIC TREATMENT OF PLATE-SHAPED OBJECTS
EP0351569B1 (en) * 1988-07-07 1993-08-25 Siemens Nixdorf Informationssysteme Aktiengesellschaft Apparatus for electroplating platelike articles, particularly circuit boards
DE3939681A1 (en) 1989-12-01 1991-06-06 Schering Ag METHOD FOR CONTROLLING THE OUTLET OF GALVANIC PLANTS AND FOR IMPLEMENTING THE METHOD OF THE SERVICE ARRANGEMENT
DE9007542U1 (en) 1990-02-20 1992-06-25 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
DE9116588U1 (en) 1991-06-07 1993-03-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
US5324406A (en) 1992-09-10 1994-06-28 Tosoh Smd, Inc. Automatic brush plating machine
JPH06228791A (en) * 1992-12-07 1994-08-16 Ebara Yuujiraito Kk Electroplating device
DE4402596C2 (en) * 1994-01-28 1997-03-27 Atotech Deutschland Gmbh Electrolytic process in horizontal continuous systems and device for carrying it out
US5494529A (en) 1994-02-22 1996-02-27 Atotech Usa, Inc. Treatment method for cleaning and drying printed circuit boards and the like
DE19504517C1 (en) 1995-02-11 1996-08-08 Atotech Deutschland Gmbh Process for electroplating plate-shaped items to be treated in horizontal continuous systems and device for carrying out the process
US5553700A (en) 1995-04-10 1996-09-10 Atotech Usa, Inc. Treatment method and apparatus for printed circuit boards and the like
DE19545231A1 (en) 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Process for the electrolytic deposition of metal layers
US5658441A (en) * 1995-12-18 1997-08-19 Cfc, Inc. Conveyorized spray plating machine
US6168691B1 (en) 1996-08-09 2001-01-02 Atotech Deutschland Gmbh Device for electrochemical treatment of elongate articles
DE19653272C1 (en) 1996-12-20 1998-02-12 Atotech Deutschland Gmbh Circuit board blank electroplating in continuous plant
DE19707905C1 (en) 1997-02-27 1998-02-05 Atotech Deutschland Gmbh Bipolar pulsed current supply method for electroplating
DE19717512C3 (en) * 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Device for electroplating circuit boards under constant conditions in continuous systems
US6179844B1 (en) 1999-10-18 2001-01-30 Rick Underwood Animal tagging system
US6294060B1 (en) 1999-10-21 2001-09-25 Ati Properties, Inc. Conveyorized electroplating device

Also Published As

Publication number Publication date
WO2001029288B1 (en) 2002-03-07
ATE294881T1 (en) 2005-05-15
DE60019957T2 (en) 2006-02-23
US6294060B1 (en) 2001-09-25
US6607652B2 (en) 2003-08-19
US20020020620A1 (en) 2002-02-21
EP1230446B1 (en) 2005-05-04
JP2003512530A (en) 2003-04-02
WO2001029288A9 (en) 2002-08-15
WO2001029288A2 (en) 2001-04-26
WO2001029288A3 (en) 2002-02-07
KR20020042737A (en) 2002-06-05
CN1382233A (en) 2002-11-27
DE60019957D1 (en) 2005-06-09
EP1230446A2 (en) 2002-08-14

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase