ATE59129T1 - Verfahren zur herstellung von leiterplatten mit darin verlegten draehten und damit hergestellte artikel. - Google Patents

Verfahren zur herstellung von leiterplatten mit darin verlegten draehten und damit hergestellte artikel.

Info

Publication number
ATE59129T1
ATE59129T1 AT86109558T AT86109558T ATE59129T1 AT E59129 T1 ATE59129 T1 AT E59129T1 AT 86109558 T AT86109558 T AT 86109558T AT 86109558 T AT86109558 T AT 86109558T AT E59129 T1 ATE59129 T1 AT E59129T1
Authority
AT
Austria
Prior art keywords
manufacture
processes
circuit boards
articles manufactured
wires inside
Prior art date
Application number
AT86109558T
Other languages
English (en)
Inventor
Brian Edward Swiggett
Ronald Morino
Raymond J Keogh
George Szenczy
Jonathan Clark Crowell
Andrew Jed Schoenberg
Marju Laube Friedrich
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Application granted granted Critical
Publication of ATE59129T1 publication Critical patent/ATE59129T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Reinforced Plastic Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laser Beam Processing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AT86109558T 1985-07-19 1986-07-12 Verfahren zur herstellung von leiterplatten mit darin verlegten draehten und damit hergestellte artikel. ATE59129T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/756,722 US4711026A (en) 1985-07-19 1985-07-19 Method of making wires scribed circuit boards
EP86109558A EP0212227B1 (de) 1985-07-19 1986-07-12 Verfahren zur Herstellung von Leiterplatten mit darin verlegten Drähten und damit hergestellte Artikel

Publications (1)

Publication Number Publication Date
ATE59129T1 true ATE59129T1 (de) 1990-12-15

Family

ID=25044766

Family Applications (1)

Application Number Title Priority Date Filing Date
AT86109558T ATE59129T1 (de) 1985-07-19 1986-07-12 Verfahren zur herstellung von leiterplatten mit darin verlegten draehten und damit hergestellte artikel.

Country Status (9)

Country Link
US (1) US4711026A (de)
EP (1) EP0212227B1 (de)
JP (1) JPS6284596A (de)
AT (1) ATE59129T1 (de)
AU (1) AU594352B2 (de)
CA (1) CA1251576A (de)
DE (2) DE3676128D1 (de)
FR (1) FR2585209B1 (de)
GB (1) GB2180696B (de)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4642321A (en) * 1985-07-19 1987-02-10 Kollmorgen Technologies Corporation Heat activatable adhesive for wire scribed circuits
FR2585210B1 (fr) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp Procede de fabrication de plaquettes a circuits d'interconnexion
US4859807A (en) * 1985-07-19 1989-08-22 Kollmorgen Technologies Corporation Wire scribed circuit boards and method of manufacture
US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards
US4864723A (en) * 1986-07-01 1989-09-12 Preleg, Inc. Electrical circuit modification method
US4918260A (en) * 1985-07-26 1990-04-17 Preleg, Inc. Adhesive-coated wire and method and printed circuit board using same
US4908939A (en) * 1985-10-18 1990-03-20 Kollmorgen Corporation Method of making coaxial interconnection boards
JPS63271996A (ja) * 1987-04-28 1988-11-09 Fanuc Ltd 大電流用プリント基板
NL8802249A (nl) * 1988-09-13 1990-04-02 Du Pont Nederland Bevestigingsframe en filtereenheid voor connectoren.
DE3831394A1 (de) * 1988-09-15 1990-03-22 Prithwis Basu Verfahren und vorrichtung zum kontaktieren eines elektrischen leitungsdrahtes mit kontaktstellen auf einer leiterplatte
US4972050A (en) * 1989-06-30 1990-11-20 Kollmorgen Corporation Wire scribed circuit boards and methods of their manufacture
US5575932A (en) * 1994-05-13 1996-11-19 Performance Controls, Inc. Method of making densely-packed electrical conductors
WO2000033244A2 (en) 1998-11-27 2000-06-08 Synaptics (Uk) Limited Position sensor
US20030062889A1 (en) * 1996-12-12 2003-04-03 Synaptics (Uk) Limited Position detector
US6249234B1 (en) 1994-05-14 2001-06-19 Absolute Sensors Limited Position detector
DE19512725C1 (de) * 1995-04-05 1996-09-12 Orga Kartensysteme Gmbh Ausweiskarte o.dgl. in Form einer Chipkarte
JPH0955464A (ja) * 1995-06-09 1997-02-25 Mitsubishi Electric Corp 表面実装型半導体装置、半導体実装部品、及びそれらの製造方法
ES2146989T3 (es) * 1996-02-12 2000-08-16 David Finn Procedimiento y dispositivo para el contacto de un conductor de hilo.
DE19618917C1 (de) * 1996-05-12 1997-10-02 Markus Woelfel Verfahren und Vorrichtung zur Herstellung von drahtgeschriebenen Leiterplatten
US6788221B1 (en) 1996-06-28 2004-09-07 Synaptics (Uk) Limited Signal processing apparatus and method
DE19705934C2 (de) * 1997-02-15 2001-05-17 Cubit Electronics Gmbh Verfahren und Vorrichtung zum Einbringen von drahtförmigen Leiterdrähten in ein Substrat
DE69832274T2 (de) 1997-05-28 2006-08-03 Synaptics (Uk) Ltd., Harston Verfahren und drahtbond-vorrichtung zur herstellung eines wandlers
GB9720954D0 (en) 1997-10-02 1997-12-03 Scient Generics Ltd Commutators for motors
GB9721891D0 (en) 1997-10-15 1997-12-17 Scient Generics Ltd Symmetrically connected spiral transducer
US6005991A (en) * 1997-11-26 1999-12-21 Us Conec Ltd Printed circuit board assembly having a flexible optical circuit and associated fabrication method
US6245822B1 (en) * 1998-04-27 2001-06-12 Matsushita Electric Industrial Co. Ltd. Method and apparatus for decomposition treating article having cured thermosetting resin
GB9811151D0 (en) 1998-05-22 1998-07-22 Scient Generics Ltd Rotary encoder
US7019672B2 (en) * 1998-12-24 2006-03-28 Synaptics (Uk) Limited Position sensor
US6073344A (en) * 1999-01-28 2000-06-13 International Business Machines Corporation Laser segmentation of plated through-hole sidewalls to form multiple conductors
US6535535B1 (en) * 1999-02-12 2003-03-18 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method, laser irradiation apparatus, and semiconductor device
US6640434B1 (en) * 2000-04-11 2003-11-04 Lear Corporation Method of forming an electrical circuit on a substrate
US6486408B1 (en) 2000-10-31 2002-11-26 Hewlett-Packard Company Flexible circuit using discrete wiring
DE60227174D1 (de) 2001-05-21 2008-07-31 Synaptics Uk Ltd Positionssensor
TW548816B (en) * 2002-01-23 2003-08-21 Via Tech Inc Formation method of conductor pillar
GB2403017A (en) 2002-03-05 2004-12-22 Synaptics Position sensor
AU2003232360A1 (en) 2002-06-05 2003-12-22 Synaptics (Uk) Limited Signal transfer method and apparatus
GB0317370D0 (en) 2003-07-24 2003-08-27 Synaptics Uk Ltd Magnetic calibration array
GB0319945D0 (en) 2003-08-26 2003-09-24 Synaptics Uk Ltd Inductive sensing system
EP2014406A3 (de) * 2004-11-02 2010-06-02 HID Global GmbH Verlegevorrichtung, Kontaktiervorrichtung, Zustellsystem, Verlege- und Kontaktiereinheit Herstellungsanlage, Verfahren zur herstellung und eine Transpondereinheit
US7971339B2 (en) * 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
DE102006050785A1 (de) * 2006-10-27 2008-05-08 Robert Bosch Gmbh Leiterkarte
DE102006053697A1 (de) * 2006-11-13 2008-05-29 Häusermann GmbH Leiterplatte mit additiven und integrierten und mittels Ultraschall kontaktierten Kupferelementen und Herstellverfahren und Anwendung
WO2008139216A2 (en) 2007-05-10 2008-11-20 Cambridge Integrated Circuits Limited Transducer
KR100882261B1 (ko) * 2007-07-25 2009-02-06 삼성전기주식회사 인쇄회로기판의 제조 방법 및 장치
DE602007010634D1 (de) * 2007-09-18 2010-12-30 Baile Na Habhann Co Galway Verfahren zur Kontaktierung eines Drahtleiters gelegt auf ein Substrat
CN101610870B (zh) * 2007-10-16 2013-09-11 三星钻石工业股份有限公司 脆性材料基板的u形槽加工方法以及使用该方法的去除加工方法、打孔加工方法和倒角方法
US7708607B2 (en) * 2008-08-28 2010-05-04 Unitech Printed Circuit Board Corp. Precision printed circuit board testing tool
GB2488389C (en) 2010-12-24 2018-08-22 Cambridge Integrated Circuits Ltd Position sensing transducer
US9414501B2 (en) * 2012-01-04 2016-08-09 Board Of Regents, The University Of Texas System Method for connecting inter-layer conductors and components in 3D structures
GB2503006B (en) 2012-06-13 2017-08-09 Cambridge Integrated Circuits Ltd Position sensing transducer
CN103144378B (zh) * 2013-01-28 2015-03-25 广东生益科技股份有限公司 一种pn固化体系的覆铜板、pcb板及其制作方法
JP2013219404A (ja) * 2013-08-02 2013-10-24 Sumida Corporation アンテナ部品の製造方法
US10099315B2 (en) * 2014-06-27 2018-10-16 Jabil Inc. System, apparatus and method for hybrid function micro welding
US9736932B1 (en) * 2015-01-20 2017-08-15 Flextronics Ap, Llc. Magnet wire for 3D electronic circuitry
US10264664B1 (en) 2015-06-04 2019-04-16 Vlt, Inc. Method of electrically interconnecting circuit assemblies
US10321560B2 (en) 2015-11-12 2019-06-11 Multek Technologies Limited Dummy core plus plating resist restrict resin process and structure
US9999134B2 (en) 2016-03-14 2018-06-12 Multek Technologies Limited Self-decap cavity fabrication process and structure
US10064292B2 (en) * 2016-03-21 2018-08-28 Multek Technologies Limited Recessed cavity in printed circuit board protected by LPI
US10785871B1 (en) * 2018-12-12 2020-09-22 Vlt, Inc. Panel molded electronic assemblies with integral terminals
US11224117B1 (en) 2018-07-05 2022-01-11 Flex Ltd. Heat transfer in the printed circuit board of an SMPS by an integrated heat exchanger
CN114379260B (zh) * 2021-09-02 2023-09-26 苏州清听声学科技有限公司 一种定向发声屏绝缘凸点丝印制作方法
CN117393226A (zh) * 2023-11-29 2024-01-12 三元科技（深圳）有限公司 一种用于内窥镜的光电混合线缆

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3353263A (en) * 1964-08-17 1967-11-21 Texas Instruments Inc Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
US3674602A (en) * 1969-10-09 1972-07-04 Photocircuits Corp Apparatus for making wire scribed circuit boards
JPS5550399B1 (de) * 1970-03-05 1980-12-17
JPS5025054B1 (de) * 1970-10-30 1975-08-20
JPS50100574A (de) * 1974-01-09 1975-08-09
US3981076A (en) * 1974-11-27 1976-09-21 Commissariat A L'energie Atomique Method of connecting electronic microcomponents
FR2304247A1 (fr) * 1975-03-12 1976-10-08 Commissariat Energie Atomique Procede et dispositif d'interconnexion de composants electroniques
US4031612A (en) * 1976-03-02 1977-06-28 Commissariat A L'energie Atomique Method and a device for the interconnection of electronic components
ZA775455B (en) * 1977-08-09 1978-07-26 Kollmorgen Tech Corp Improved methods and apparatus for making scribed circuit boards
JPS5439633A (en) * 1977-09-02 1979-03-27 Hitachi Chemical Co Ltd Multiistylus head and method of making same
JPS5466464A (en) * 1977-11-04 1979-05-29 Oki Electric Ind Co Ltd Simple preparation of circuit substrate
US4327124A (en) * 1978-07-28 1982-04-27 Desmarais Jr Raymond C Method for manufacturing printed circuits comprising printing conductive ink on dielectric surface
JPS5536938A (en) * 1978-09-04 1980-03-14 Nippon Electric Co Circuit board
FR2458978A2 (fr) * 1979-06-07 1981-01-02 Commissariat Energie Atomique Procede et dispositif d'interconnexions de composants electronique
JPS5613013A (en) * 1979-07-14 1981-02-07 Kurita Water Ind Ltd Removing method of scale
DE3035090C2 (de) * 1979-09-28 1995-01-26 Cii Honeywell Bull Vorrichtung zur Verdrahtung von Substratoberflächen
JPS57136391A (en) * 1981-02-17 1982-08-23 Nippon Electric Co Method and device for wiring circuit board
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
US4414741A (en) * 1981-05-22 1983-11-15 Augat Inc. Process for interconnecting components on a PCB
US4450623A (en) * 1981-12-18 1984-05-29 Kollmorgen Technologies Corporation Process for the manufacture of circuit boards
US4427478A (en) * 1982-06-28 1984-01-24 International Business Machines Corporation Process for making an encapsulated circuit board and products made thereby
EP0113820B1 (de) * 1982-12-22 1987-09-09 International Business Machines Corporation Verfahren und Vorrichtung zum Einbetten eines Drahtes in einem lichthärtbaren Klebstoff
DE3408338A1 (de) * 1984-03-07 1985-09-12 Siemens AG, 1000 Berlin und 8000 München Verfahren und vorrichtung zum verlegen eines schaltdrahtes auf einer traegerplatte
US4693778A (en) * 1985-07-19 1987-09-15 Kollmorgen Technologies Corporation Apparatus for making scribed circuit boards and circuit board modifications
US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards
FR2585210B1 (fr) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp Procede de fabrication de plaquettes a circuits d'interconnexion

Also Published As

Publication number Publication date
DE3624627A1 (de) 1987-01-29
DE3676128D1 (de) 1991-01-24
CA1251576A (en) 1989-03-21
AU594352B2 (en) 1990-03-08
US4711026A (en) 1987-12-08
GB2180696B (en) 1989-07-19
EP0212227A2 (de) 1987-03-04
FR2585209B1 (fr) 1994-03-11
JPS6284596A (ja) 1987-04-18
GB8617363D0 (en) 1986-08-20
GB2180696A (en) 1987-04-01
FR2585209A1 (fr) 1987-01-23
EP0212227B1 (de) 1990-12-12
EP0212227A3 (en) 1987-05-13
AU6035386A (en) 1987-01-22

Similar Documents

Publication Publication Date Title
ATE59129T1 (de) Verfahren zur herstellung von leiterplatten mit darin verlegten draehten und damit hergestellte artikel.
BR7908875A (pt) Composicao de revestimento,artigo revestido e processo de revestimento de substrato
ES2192861T3 (es) Revestimiento de sol-gel resistente al rayado para lacas transparentes en polvo en suspension.
ES465175A1 (es) Un metodo para el tratamiento de un sustrato solido para me-jorar el desprendimiento de materiales adhesivos del mismo.
BR8107624A (pt) Processo para o revestimento,por extrusao,de um substrato;processo para aplicar um revestimento extrudado a um substrato;composicao para revestimento por extrusao e artefato revestido
BR8103496A (pt) Metodo para a produacao de cohidrolisado aquoso adaptado pra adesao a um substrato plastico composicao aquosa de revestimento para uso como revestimento de topo para substrats plasticos artigos compreendendo o dito substrato e processo para a formacao de revestimento resistente a abrasao sobre o dito substrato nao aperelhado
BR8702961A (pt) Composicao de revestimento,substrato revestido,composicao de revestimento de multicamadas,processo de revestimento de um substrato e composicao resinosa de revestimento
ATE63191T1 (de) Verfahren und beschichtungsmittel zum aufbringen elektrisch leitender druckbilder auf isolierende substrate.
KR890010617A (ko) 열가소성 기체용 방사선 경화성 코팅 조성물, 열가소성 물품의 코팅 방법 및 코팅된 열가소성 물품
DE3678058D1 (de) Vorrichtung zur herstellung von "geschriebenen" leiterplatten und leiterplatten-modifikationen.
BR7800600A (pt) Processo para aplicacao de um revestimento organico,ligado,a um substrato ferroso,composicao de emulsao,processo para formar um banho para aplicacao no mencionado processo,e substrato revestido
ATE93398T1 (de) Verfahren zum antithrombogenmachen von substratoberflaechen.
AR225025A1 (es) Composicion acuosa de recubrimiento,sustrato solido recubierto con dicha composicion y articulos que comprenden dicho sustrato
BR7309476D0 (pt) Composicao para tratamento da superficie de substratos contendo ions metalicos e processo para melhorar a adesao de materiais polimeros a substratos
BR9001351A (pt) Sistema de revestimento de multi-camada,processo de revestimento de um substrato,e artigo
DE3772845D1 (de) Widerstandsfaehige, elektrische zusammensetzung, damit beschichtete substrate und verfahren zu deren herstellung.
BR7601948A (pt) Artigo metalico revestido com metal,e processo para revestir um substrato metalico
ATE66968T1 (de) Verfahren zur chemischen metallisierung eines elektrisch schlecht leitenden traegerkoerpers aus einem anorganischen material.
NL191641C (nl) Werkwijze voor het vervaardigen van een grondplaat met een geleiderpatroon uit veel draden voor toepassing als drager van elektronische componenten.
BR8507240A (pt) Composicao de revestimento de laca de eletroimersao aquosa,catodicamente precipitavel e processo para o revestimento de um substrato eletricamente condutor
BR8101523A (pt) Composicao de revestimento, processo e substrato metalico revestido
SE8104867L (sv) Polymera beleggningar och forfarande att pafora desamma
BR7802738A (pt) Processo para a aplicacao de um revestimento de fosfato sobre superficies metalicas,e concentrado para a preparacao e/ou complementacao de uma solucao destinada a aplicacao no dito processo
ATE195909T1 (de) Verfahren zum auftragen einer dekorativen schicht auf ein trägermaterial
BR8505743A (pt) Composicao de resina,banho de revestimento de eletrodeposicao catodica,aquoso,artigo revestido,metodo para revestir artigos com resina formadora de pelicula e processo para preparar composicao de resina

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties