ATE552921T1 - Verfahren zur kontrollierten transienten kavitation - Google Patents
Verfahren zur kontrollierten transienten kavitationInfo
- Publication number
- ATE552921T1 ATE552921T1 AT05447214T AT05447214T ATE552921T1 AT E552921 T1 ATE552921 T1 AT E552921T1 AT 05447214 T AT05447214 T AT 05447214T AT 05447214 T AT05447214 T AT 05447214T AT E552921 T1 ATE552921 T1 AT E552921T1
- Authority
- AT
- Austria
- Prior art keywords
- transient cavitation
- creating
- range
- cavitation
- acoustic field
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0288—Ultra or megasonic jets
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Surgical Instruments (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US61208704P | 2004-09-21 | 2004-09-21 | |
EP04447204A EP1637238A1 (de) | 2004-09-21 | 2004-09-21 | Verfahren zur kontrollierten Kavitation |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE552921T1 true ATE552921T1 (de) | 2012-04-15 |
Family
ID=34933083
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05447214T ATE552921T1 (de) | 2004-09-21 | 2005-09-20 | Verfahren zur kontrollierten transienten kavitation |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1637238A1 (de) |
KR (1) | KR100674996B1 (de) |
AT (1) | ATE552921T1 (de) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2794438B2 (ja) * | 1989-02-16 | 1998-09-03 | 本多電子株式会社 | キャビテーションを利用した洗浄方法 |
DE4305660C2 (de) * | 1993-02-24 | 1994-07-07 | Stephan Mayer | Vorrichtung und Verfahren zur Steuerung der Größenverteilungen von Gas- oder Flüssigkeitsblasen in einem flüssigen Medium |
US5437729A (en) * | 1993-04-08 | 1995-08-01 | Martin Marietta Energy Systems, Inc. | Controlled removal of ceramic surfaces with combination of ions implantation and ultrasonic energy |
WO1996022844A1 (en) * | 1995-01-27 | 1996-08-01 | Trustees Of Boston University | Acoustic coaxing methods and apparatus |
US5800626A (en) * | 1997-02-18 | 1998-09-01 | International Business Machines Corporation | Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates |
US5849091A (en) * | 1997-06-02 | 1998-12-15 | Micron Technology, Inc. | Megasonic cleaning methods and apparatus |
US5931173A (en) * | 1997-06-09 | 1999-08-03 | Cypress Semiconductor Corporation | Monitoring cleaning effectiveness of a cleaning system |
US5961895A (en) * | 1997-06-19 | 1999-10-05 | The United States Of America As Represented By The Secretary Of The Navy | Multi-stage system for microbubble production |
-
2004
- 2004-09-21 EP EP04447204A patent/EP1637238A1/de not_active Withdrawn
-
2005
- 2005-09-20 AT AT05447214T patent/ATE552921T1/de active
- 2005-09-21 KR KR1020050087859A patent/KR100674996B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20060051502A (ko) | 2006-05-19 |
KR100674996B1 (ko) | 2007-01-29 |
EP1637238A1 (de) | 2006-03-22 |
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