ATE548893T1 - Gehäuse aus stranggepressten multipositions- metallprofilen zur herstellung einer dichten elektronischen leistungsvorrichtung - Google Patents
Gehäuse aus stranggepressten multipositions- metallprofilen zur herstellung einer dichten elektronischen leistungsvorrichtungInfo
- Publication number
- ATE548893T1 ATE548893T1 AT08172822T AT08172822T ATE548893T1 AT E548893 T1 ATE548893 T1 AT E548893T1 AT 08172822 T AT08172822 T AT 08172822T AT 08172822 T AT08172822 T AT 08172822T AT E548893 T1 ATE548893 T1 AT E548893T1
- Authority
- AT
- Austria
- Prior art keywords
- producing
- housing
- power device
- electronic power
- housing made
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
- H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
- Structure Of Receivers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0850255A FR2926399B1 (fr) | 2008-01-16 | 2008-01-16 | Boitier en profiles extrudes metalliques multi-positions pour la fabrication d'un dispositif electronique de puissance etanche |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE548893T1 true ATE548893T1 (de) | 2012-03-15 |
Family
ID=39684563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT08172822T ATE548893T1 (de) | 2008-01-16 | 2008-12-23 | Gehäuse aus stranggepressten multipositions- metallprofilen zur herstellung einer dichten elektronischen leistungsvorrichtung |
Country Status (7)
Country | Link |
---|---|
US (1) | US8035964B2 (de) |
EP (1) | EP2081422B1 (de) |
AT (1) | ATE548893T1 (de) |
CA (1) | CA2649248C (de) |
DK (1) | DK2081422T3 (de) |
ES (1) | ES2383621T3 (de) |
FR (1) | FR2926399B1 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201654639U (zh) * | 2009-11-26 | 2010-11-24 | 鸿富锦精密工业(深圳)有限公司 | 电脑系统 |
CN201654638U (zh) * | 2009-11-26 | 2010-11-24 | 鸿富锦精密工业(深圳)有限公司 | 电脑系统 |
WO2011155247A1 (ja) * | 2010-06-07 | 2011-12-15 | 三菱電機株式会社 | ヒートシンクおよびその製造方法 |
US20120014071A1 (en) * | 2010-07-16 | 2012-01-19 | Robert Louis Fils | Amplifier with sealed entry points |
TWI488562B (zh) * | 2010-08-30 | 2015-06-11 | Liquidcool Solutions Inc | 擠製伺服器殼體 |
US8446722B2 (en) * | 2010-09-10 | 2013-05-21 | Src, Inc. | Circuit board chassis and method including sidewall aperture and backplane insertion slots for side assembled backplane |
CN103260924B (zh) | 2010-12-07 | 2016-11-09 | 艾里逊变速箱公司 | 用于混合动力电动车的能量存储系统 |
US9320158B2 (en) * | 2011-03-07 | 2016-04-19 | Mitsubishi Electric Corporation | Vehicle control device |
US9161478B2 (en) * | 2012-02-24 | 2015-10-13 | Futurewei Technologies, Inc. | Apparatus and method for an active antenna heat sink |
US8687363B2 (en) * | 2012-05-01 | 2014-04-01 | General Electric Company | Enclosure with duct mounted electronic components |
US9700965B2 (en) * | 2013-03-15 | 2017-07-11 | Illinois Tool Works Inc. | Base for welding type power supply |
JPWO2014147961A1 (ja) * | 2013-03-19 | 2017-02-16 | 富士電機株式会社 | 電子機器冷却装置およびこれを備える電力変換装置 |
US9496589B2 (en) | 2013-05-15 | 2016-11-15 | Valmet Automotive Oy | System for packaging and thermal management of battery cells |
US11026343B1 (en) * | 2013-06-20 | 2021-06-01 | Flextronics Ap, Llc | Thermodynamic heat exchanger |
WO2016048391A1 (en) | 2014-09-25 | 2016-03-31 | Evtron, Inc. | Heat and flow management in a computing device |
US9594409B1 (en) * | 2015-03-18 | 2017-03-14 | Western Digital Technologies, Inc. | Storage drive heat sink mounting structure |
US10520207B1 (en) | 2015-06-23 | 2019-12-31 | Flextronics Ap, Llc | Refrigerated drying module for moisture sensitive device storage |
CN105848455B (zh) * | 2016-05-27 | 2018-02-09 | 温岭市志创网络科技有限公司 | 一种高效散热堆叠式智能控制器 |
US20180042144A1 (en) * | 2016-08-03 | 2018-02-08 | Kuei-Piao Lee | Method of Cooling Electric-Vehicle Controller |
WO2018053871A1 (zh) * | 2016-09-26 | 2018-03-29 | 深圳市大疆创新科技有限公司 | 散热机构及具有该散热机构的电子调速器、电子装置 |
JP6985588B2 (ja) * | 2017-04-07 | 2021-12-22 | 富士通株式会社 | 電子装置及び電磁波吸収体 |
CN106877461A (zh) * | 2017-04-20 | 2017-06-20 | 成都锐奕信息技术有限公司 | 一种能快速散热的充电器 |
US10607798B2 (en) * | 2018-05-14 | 2020-03-31 | Te Connectivity Corporation | Power switch device with shape memory alloy actuator |
US11252307B2 (en) * | 2018-09-05 | 2022-02-15 | Canon Kabushiki Kaisha | Imaging device and imaging system |
USD902874S1 (en) * | 2019-01-21 | 2020-11-24 | Roadmaster, Inc. | Heatsink housing |
CN113923939A (zh) * | 2021-09-13 | 2022-01-11 | 杭州电子科技大学 | 一种具有黑化表面的电子设备金属外壳 |
CN114096136A (zh) * | 2022-01-21 | 2022-02-25 | 深圳富联富桂精密工业有限公司 | 浸没式冷却系统 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3219885A (en) * | 1961-03-20 | 1965-11-23 | Gen Motors Corp | Transistor heat dissipator |
US3961666A (en) * | 1972-11-24 | 1976-06-08 | Sony Corporation | Heat dispersion device for use in an electronic apparatus |
DE7911538U1 (de) * | 1979-04-20 | 1979-08-02 | Eberle Werke Kg, 8500 Nuernberg | Gehäuse zur Aufnahme von bestückten Leiterplatten, insbesondere für Steuerungen von Industrieprozessen |
US4656559A (en) * | 1984-05-10 | 1987-04-07 | Ultima Electronics Ltd. | Holder and heat sink for electronic components |
US4791531A (en) * | 1987-03-09 | 1988-12-13 | Tech-S, Inc. | Extruded enclosure for electrical apparatus |
US5742478A (en) * | 1996-09-25 | 1998-04-21 | Wu; Chih-Hsien | Radiating structure of a power converter |
US6144556A (en) * | 1999-03-30 | 2000-11-07 | Lanclos; Kenneth W. | Heat dissipating housing for electronic components |
US6411514B1 (en) * | 2001-03-08 | 2002-06-25 | Rally Manufacturing, Inc. | Power inverter with heat dissipating assembly |
DE20112594U1 (de) * | 2001-07-31 | 2002-01-17 | Trw Automotive Electron & Comp | Elektronisches Steuergerät in Fahrzeugen |
USD509806S1 (en) * | 2004-07-16 | 2005-09-20 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
US7136286B2 (en) * | 2005-01-10 | 2006-11-14 | Aaeon Technology Inc. | Industrial computer with aluminum case having fins as radiating device |
FR2881018B1 (fr) * | 2005-01-19 | 2007-04-06 | Intelligent Electronic Systems | Procede de refroidissement d'un dispositif de conversion statique d'electronique de puissance et dispositif correspondant |
CN1905338A (zh) * | 2005-07-27 | 2007-01-31 | 协欣电子工业股份有限公司 | 一种电源转换器的外壳结构与电子元件固定器结构 |
AT502498B1 (de) * | 2005-10-11 | 2007-04-15 | Fronius Int Gmbh | Vorrichtung zur montage einer printplatte und zur wärmeableitung |
US7304852B2 (en) * | 2005-10-14 | 2007-12-04 | Alltrade Tools Llc | Inverter apparatus |
-
2008
- 2008-01-16 FR FR0850255A patent/FR2926399B1/fr active Active
- 2008-12-23 DK DK08172822.2T patent/DK2081422T3/da active
- 2008-12-23 EP EP08172822A patent/EP2081422B1/de active Active
- 2008-12-23 AT AT08172822T patent/ATE548893T1/de active
- 2008-12-23 ES ES08172822T patent/ES2383621T3/es active Active
-
2009
- 2009-01-12 CA CA2649248A patent/CA2649248C/en not_active Expired - Fee Related
- 2009-01-13 US US12/352,807 patent/US8035964B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
DK2081422T3 (da) | 2012-06-25 |
EP2081422A1 (de) | 2009-07-22 |
FR2926399A1 (fr) | 2009-07-17 |
US20090180251A1 (en) | 2009-07-16 |
CA2649248C (en) | 2017-03-28 |
CA2649248A1 (en) | 2009-07-16 |
EP2081422B1 (de) | 2012-03-07 |
ES2383621T3 (es) | 2012-06-22 |
US8035964B2 (en) | 2011-10-11 |
FR2926399B1 (fr) | 2010-02-05 |
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